REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 94-02-28 M. A. FRYE Add case outlines F and 2. Add output noise voltage test to table I, reference section. Change minimum limit for VTH(SYNC) test in table I, oscillator section. Editorial changes throughout. B Add device class V device and make change to TABLE II. - ro 00-11-30 R. MONNIN C Add device type 05. Make Changes to 1.2.2, 1.3, 1.4, table I, figure 1, and figure 2. - ro 01-03-21 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV C SHEET 15 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY JOSEPH A. KERBY STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY D. H. JOHNSON APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, REGULATING, PULSE WIDTH MODULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-04-27 REVISION LEVEL C SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-89511 15 5962-E265-01 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - ~ ~ ~ ~ ~ ~ Federal stock class designator \ 89511 E 01 ~ ~ ~ RHA designator (see 1.2.1) Device type (see 1.2.2) ~ ~ ~ X ~ ~ ~ Case outline (see 1.2.4) Lead finish (see 1.2.5) V ~ ~ ~ / \/ Drawing number For device class V: 5962 - ~ ~ ~ ~ ~ ~ Federal stock class designator \ 89511 03 ~ ~ ~ RHA designator (see 1.2.1) Device type (see 1.2.2) / ~ ~ ~ Device class designator (see 1.2.3) 2 Case outline (see 1.2.4) X ~ ~ ~ Lead finish (see 1.2.5) \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 03 04 05 1525A 1527A UC1525A UC1527A UC1525B STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 Circuit function Regulating pulse width modulator Regulating pulse width modulator Regulating pulse width modulator Regulating pulse width modulator Regulating pulse width modulator SIZE 5962-89511 A REVISION LEVEL C SHEET 2 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter E F 2 Descriptive designator GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N20 Terminals 16 16 20 Package style Dual-in-line Flat pack Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Input voltage (+VIN) ...........................................................................+40 V dc Collector voltage (VC) ........................................................................+40 V dc Logic inputs range..............................................................................-0.3 V dc to +5.5 V dc Analog inputs range ...........................................................................-0.3 V dc to +V IN Output current, source or sink............................................................500 mA Reference output current ...................................................................50 mA Oscillator charging current .................................................................5 mA Maximum power dissipation (PD).......................................................1,000 mW Lead temperature (soldering, 10 seconds) ........................................+300 qC Junction temperature (TJ) ..................................................................+150qC Storage temperature range ...............................................................-65qC to +150qC Thermal resistance, junction-to-case (TJC)........................................See MIL-STD-1835 Thermal resistance, junction-to-ambient (TJA): Cases E and F................................................................................100qC/W Case 2 ............................................................................................70qC/W 1.4 Recommended operating conditions. Input voltage (+VIN) ...........................................................................+8 V dc to +35 V dc Collector voltage (VC) ........................................................................+4.5 V dc to +35 V dc Sink/source load current (steady-state) .............................................0 mA to 100 mA Sink/source load current (peak) .........................................................0 mA to 400 mA Reference load current range ...........................................................0 mA to 20 mA Oscillator frequency range: Device types 01 - 04 ......................................................................100 Hz to 350 kHz Device type 05 ...............................................................................100 Hz to 400 kHz 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 3 1.4 Recommended operating conditions – continued. Oscillator timing resistor (RT): Device types 01 – 04 .....................................................................2 k : to 200 k: Device type 05 ...............................................................................2 k: to 150 k: Oscillator timing capacitor range (CT): Device types 01 – 04 .....................................................................470 pF to 0.1 PF Device type 05 ...............................................................................0.001 pF to 0.1 PF Dead time resistor range (device type 05 only) ................................0 : to 500 : Ambient operating temperature range (T A)........................................-55qC to +125qC 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 4 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connection(s). The terminal connection(s) shall be as specified on figure 1. 3.2.3 Logic diagram(s). The logic diagram(s) shall be as specified on figure 2. 3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 110 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55qC d TA d +125qC unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max 5.05 5.15 5.0 5.2 Reference section Reference voltage out 1 VREF 01-04 2,3 Line regulation Load regulation Short-circuit current VRLINE VLOAD IOS VIN = 8 V to 35 V 1 05 5.062 5.138 1,2,3 01-04 -30 30 05 -10 10 01-04 -50 50 05 -15 15 01-04 -100 1,2,3 IL = 0 mA to 20 mA 1 VREF = 0 V, t < 25 ms, TA = +25qC mA 2,3 05 50 1,2,3 05 2 05 10 mV 7 All 200 PVrms 4 All 37.5 42.5 kHz 5,6 All 35.2 44.8 kHz 3/ Total output variation VTOV Line, load, and temperature Long term stability VLTS 1000 hours, NO 10 Hz d f d 10 kHz, Initial accuracy FOSC TA = +25qC Oscillator accuracy over temperature FOSC TA = -55qC and +125qC Voltage stability VSTAB VIN = 8 V to 35 V 4,5,6 All Clock pulse amplitude VOSC 3/ 4,5,6 All 3 Clock pulse width tPW TA = +25qC 3/ 9 All 0.3 Max oscillator frequency FMAX RT = 2 k:, CT = .001 PF 4,5,6 01,02 300 03,04 350 05 400 5.036 5.164 TA = +125qC 3/ mV 100 VTS Output noise voltage mV 05 Temperature stability 3/ V TA = +25qC mV V Oscillator section (OT) RT = 2 k:, CT = 470 PF r1 % V 1.0 Ps kHz See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55qC d TA d +125qC unless otherwise specified Group A subgroups Device type Limits 2/ Min Unit Max Oscillator section – continued. Min oscillator frequency FMIN RT = 150 k:, CT = 0.1 PF 4,5,6 RT = 200 k:, CT = 0.1 PF Threshold SYNC voltage VTH SYNC input current II 01,02 150 03,04, 05 120 1,2,3 All 1,2,3 9,10,11 1.2 Hz 2.8 V All 2.5 mA 01-04 .001 % 05 0 (SYNC) SYNC voltage = 3.5 V (SYNC) Pulse width modulator comparator section Min duty cycle tON(min) / VCOMP = 0.6 V tOSC Max duty cycle tON(max) / VCOMP = 3.6 V 9,10,11 All 45 1,2,3 All -5 % tOSC Error amplitude section, VCM = 5.1 V (unless otherwise specified) RS d 2 k: Input offset voltage VIO Input bias current IIB 1,2,3 All Input offset current IIO 1,2,3 All -1 DC open loop gain AVOL 4 All 60 TA = +25qC, VCM = 5.1 V, 5 10 1 mV PA PA dB RL t 10 M: Output low level VOL 1,2,3 All 0.5 V Output high level VOH 1,2,3 All 3.8 V Common mode rejection ratio CMRR VCM = 1.5 V to 5.2 V 1,2,3 All 60 dB Power supply rejection ratio PSRR VIN = 8 V to 35 V 4,5,6 All 50 dB Unity gain bandwidth GBW AV = 0 dB, TA = +25qC 3/ 7 All 1 MHz See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55qC d TA d +125qC unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max 25 80 PA Soft start section Soft start current ISS VSD = 0 V, VSS = 0 V 1,2,3 All Soft start voltage VSS VSD = 2.5 V 1,2,3 All 0.7 V Shutdown input current ISD VSD = 2.5 V 1,2,3 All 1.0 mA Shutdown threshold voltage VTH To outputs, VSS = 5.1 V, 4 03,04, 05 1,2,3 All TA = +25qC 0.6 V Output section (each output), VC = +20 V (unless otherwise specified) Output low level VOL ISINK = 20 mA 0.4 2.2 ISINK = 100 mA Output high level VOH 1,2,3 ISOURCE = -20 mA All 18 VUL VCOMP and VSS = high Shutdown delay tSD VSD = 3 V, TA = +25qC 3/ V 17 ISOURCE = -100 mA Under voltage lockout V 1,2,3 All 9 VSD = 2.5 V, TA = +25qC 3/ 6 8 V 01,02 500 ns 03,04, 05 500 Rise time tr CL = 1 nF, TA = +25qC 3/ 9 All 600 ns Collector fall time tf CL = 1 nF, TA = +25qC 3/ 9 All 300 ns Collector leakage voltage VCL VC = 35 V 1,2,3 05 200 VC off current IVC VC = 35 V 1,2,3 01,03 200 PA PA VIN = 35 V 1,2,3 All 20 mA (off) Total standby current section Supply current IS 1/ Unless otherwise specified, +VIN = 20 V, RT = 3.6 k:, CT = 0.01 PF, and RD = 0 :. 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 3/ If not tested, shall be guaranteed to the limits specified in table I herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 8 Device types 01,02,03,04, and 05 Case outlines E and F 2 Terminal number 1 Terminal symbol INVERTING INPUT NC 2 NONINVERTING INPUT INVERTING INPUT 3 SYNC NONINVERTING INPUT 4 OSCILLATOR OUTPUT SYNC 5 CT OSCILLATOR OUTPUT 6 RT NC 7 DISCHARGE CT 8 SOFT-START RT 9 COMPENSATION DISCHARGE 10 SHUTDOWN SOFT START 11 OUTPUT A NC 12 GROUND COMPENSATION 13 VC SHUTDOWN 14 OUTPUT B OUTPUT A 15 +VIN GROUND 16 VREF NC 17 --- VC 18 --- OUTPUT B 19 --- +VIN 20 --- VREF NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 9 Device types 01 and 02 FIGURE 2. Logic diagram . STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 10 Device types 03 and 04 FIGURE 2. Logic diagram – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 11 Device type 05 FIGURE 2. Logic diagram – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 12 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125qC, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroup 8 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 13 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Device class Q Device class V Interim electrical parameters (see 4.2) --- --- --- Final electrical parameters (see 4.2) 1,2,3,4,9 1/ 1,2,3,4,9 1/ 1,2,3,4,9 1/ Group A test requirements (see 4.4) 1,2,3,4,5,6, 7,9,10,11 1,2,3,4,5,6, 7,9,10,11 1,2,3,4,5,6, 7,9,10,11 Group C end-point electrical parameters (see 4.4) 1 1 1,2,3 Group D end-point electrical parameters (see 4.4) 1 1 1,2,3 Group E end-point electrical parameters (see 4.4) --- --- --- 1/ PDA applies to subgroup 1. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125qC, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 14 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the post irradiation end-point electrical parameter limits as defined in table I at TA = +25qC r5qC, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-89511 A REVISION LEVEL C SHEET 15 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 01-03-21 Approved sources of supply for SMD 5962-89511 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ Reference military specification PIN 5962-8951101EA U3158 IP1525AJ/883B M38510/12602BEA 01295 UC1525AJ/883B 34333 SG1525AJ/883B 64155 3/ LT1525AJ/883 5962-8951101FA 34333 SG1525AF/883B 5962-89511012A 01295 UC1525AL/883B 5962-8951102EA U3158 IP1527AJ/883B 01295 UC1527AJ/883B 34333 SG1527AJ/883B 64155 3/ LT1527AJ/883 5962-89511022A 01295 UC1527AL/883B 5962-8951103EA 01295 UC1525AJ/883B 5962-89511032A 01295 UC1525AL/883B 5962-8951103VEA 01295 UC1525AJQMLV 5962-8951103V2A 01295 UC1525ALQMLV 1 of 2 M38510/12604BEA STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8951104EA 01295 UC1527AJ/883B 5962-89511042A 01295 UC1527AL/883B 5962-8951105EA 01295 UC1525BJ/883B 5962-89511052A 01295 UC1525BL/883B 5962-8951105VEA 01295 UC1525BJQMLV 5962-8951105V2A 01295 UC1525BLQMLV Reference military specification PIN 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ The end-of-life date for this device is 30 March 2001. Vendor CAGE number Vendor name and address U3158 Semelab PLC Coventry Road, Lutterworth Leicestershire, LE174JB United Kingdom Point of contact: 19 Palham Island Road Wayland, MA 01778 01295 Texas Instruments, Incorporated Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: 6412 Highway 75 South Sherman, TX 75090-9493 34333 Linfinity Microelectronics, Incorporated 11861 Western Avenue Garden Grove, CA 92641 64155 Linear Technology Corporation 720 Sycamore Drive Milpitas, CA 95035-7487 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2