Sub-Contract Wafer Services Full Turn-Key European Wafer Processing Services: • Low volume flexibility for developments + R&D • All elements centralised and in-house • 1000s of wafers per month volume capacity • 25 years processing experience Wafer Mapping & Wafer Inking • Map creation from test data • Conversion between industry formats • Inking using any electronic wafer map Customised Output Wafer Thinning • All industry die supply forms • Sawn wafer on film-frame & ring-frame • Waffle Tray or Gel-Pak • Tape to Tape / KGD array re-build • Pocket Tape / Blister Tape / SurfTape® • Automated in-feed grinding of wafers ± 3 microns tolerance • Wafer sizes up to 8” / 200mm • Singulated die grinding & custom work pieces Die Picking Wafer Dicing • Automated virtually contactless handling of singulated die • Compatible with all electronic wafer maps • Multiple bin / grade die picking • Safe handling of sensitive topside & 3D features • ± 1 micron tolerance • Wafer sizes up to 12” / 300mm Si, SiGe, SiC, GaAs, GaN, MEMS, Glass, Ceramics & more… • Custom dicing plans, multi-project wafers, step cutting, yield optimisations ISO: 9001 : 2008 Unit D2 Tweedale Way, Hollinwood, Manchester, OL9 8EH • T: +44 (0) 1616 835236 • www.micross.com • [email protected]