Surface Mount ESD Suppressor NXED Series FEATURES • IDEAL FOR USB2.0, IEEE1394 & HDMI HIGH SPEED DATA APPLICATIONS • SUPER LOW CAPACITANCE (AS LOW AS 0.05pF) RoHS Compliant • EIA SIZES 0402 AND 0603 includes all homogeneous materials • MEETS STANDARDS OF IEC 61000-4-2, LEVEL 4 *See Part Number System for Details • Pb-FREE REFLOW PROCESS COMPATIBLE SPECIFICATIONS Case Size Part Number Capacitance (*1) 0402 0603 NXED0402S15X501TRF NXED0603S15Y501TRF 0.05 ± 0.05pF 0.10 ± 0.1pF Peak Voltage (*2) 500V max. (350V typ.) Clamping Voltage (*3) Rated Voltage Leakage Current (max.) (*4) Temperature Range 100V max. 15V max. 1μA -55 ~ +125°C 1. Capacitance value shall be measured at 1MHz ±10%, 1V ± 0.2Vrms and 25 ± 2°C 2. Peak voltage shall be measured under the IEC61000-4-2, 8kV contact dischsrge ESD test conditions. 3. Clamping voltage shall be measured at 20ns after initiation of pulse and measured under IEC61000-4-2, 8kV contact dischsrge ESD test conditions 4. Leakage current shall be measured at 15Vdc. DIMENSIONS (mm) Case L W T a b Size 0402 1.00 ± 0.05 0.50 ± 0.05 0.38 ± 0.05 0.20 ± 0.1 0.25±0.1 0603 1.60 ± 0.10 0.80 ± 0.10 0.50 ± 0.10 0.30 ± 0.2 0.30±0.2 PART NUMBERING SYSTEM NXED 0603 S 15 X 501 TR F RoHS Compliant Tape & Reel Peak Voltage Capacitance Code: X = 0.05pF, Y = 0.1pF Rated Voltage: 15Vdc S = Standard Case Size L Series W a Structure Substrate Protective Coating ESD Element Inner Electrode Barrier Plating Termination Finish a T b Material AI203 Resin Composite metal powder and resin Thin metal film Nickel 100% Sn Inner electrode b ESD element Barrier Plating Termination finish Protective coating Substrate NXED APPLICATIONS ESD Protection of Data Lines ® 68 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com Surface Mount ESD Suppressor NXED Series RECOMMENDED LAND PATTERN DIMENSIONS (mm) TYPICAL ESD SUPPRESSION CHARACTERISTICS 400 0402 0603 300 250 Volts (V) Reflow Soldering A B C 0.5 ~ 0.6 0.40 ~ 0.55 0.4 ~ 0.6 0.7 ~ 0.9 0.55 ~ 0.75 0.8 ~ 1.0 Case Size 350 200 150 C 100 50 0 -50 B -20 0 20 40 60 80 100 120 140 160180 200 Time (nano-seconds) A B RECOMMENDED REFLOW SOLDERING TEMPERATURE PROFILE 300 10 Sec. Peak Temperature 260°C 260 230 200 180 Natural Cooling 150 100 Time above 230°C 30 ~ 40 Sec. 60 ~ 120 Sec. 50 0 CARRIER TAPE DIMENSIONS (mm) Type A B NXED0402 0.70 ±0.05 1.20 ± 0.05 NXED0603 1.10 ± 0.10 1.90 ± 0.10 φ1.5+0.1/-0.0 W F E 8.0 ± 0.2 3.50 ±0.05 1.75 ±0.10 P1 T Qty/Reel 2.00 ±0.05 0.60 ± 0.05 10,000 4.00 ± 0.05 0.70 ± 0.05 5,000 4.0 ±0.1 B F W B t P1 A C REEL DIMENSIONS (mm) A +0/-3 B ± 1.0 C min. W ± 0.3 180 13 60 9.0 W ® NIC COMPONENTS CORP. A www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 69