70 Maxess Road ! Melville, New York 11747 (516) 396-7500 ! Fax (516) 396-7575 PRODUCT SPECIFICATION FEATURES • Glass Passivated Junction • High Temperature Metallurgical Bonded Construction • Molded Plastic Case, Over Glass, Meets UL-94V-0 Flammability Classification • Capable Of Meeting Environmental Testing Per MILSTD-19500 • Flow And Reflow Soldering Compatible NIC P/N: NRF4001TR DESC: SURFACE MOUNT (MELF) SILICON RECTIFIER DIODE SPECIFICATIONS: 1. 2. 3. 4. 5. 6. OPERATING TEMPERATURE RANGE TJ, TSTG: MAXIMUM RECURRENT PEAK RECOVERY VOLTAGE: MAXIMUM RMS VOLTAGE: MAXIMUM DC BLOCKING VOLTAGE: MAXIMUM AVERAGE FORWARD CURRENT(TT=+75°C): PEAK FORWARD SURGE CURRENT, IFM (SURGE): ! ! (8.3mS Single Half Sine Wave Superimposed On Rated Load, JEDEC Method, TA=+75°C) -65°C ~ +175°C 50V 35V 50VDC 1.0A 30A 7. MAXIMUM INSTANTANEOUS FORWARD VOLTAGE AT 1.0A: 8. MAXIMUM FULL LOAD REVERSE CURRENT: 1.1V 30µA 9. MAXIMUM DC REVERSE CURRENT (At Rated DC Blocking Voltage): 10µA (+25°C) 50µA (+125°C) 15pF 30°C/W 75°C/W (Full Cycle Average at TA=+75°C) 10. TYPICAL JUNCTION CAPACITANCE (1MHz, 4.0VDC Bias): 11. MAXIMUM THERMAL RESISTANCE RthJL (SEE NOTE): RthJA (SEE NOTE): NOTE: RthJL = Thermal resistance junction to terminal, 6.0mm² copper pads to each terminal. RthJA = Thermal resistance junction to ambient, 6.0mm² copper pads to each terminal. 12. DIMENSIONS (mm): Cathode color band marker (silver) 2.41 ~ 2.67 0.46 ~ 0.56 4.70 ~ 5.21 TERMINATION: SOLDER PLATE OVER NICKEL BARRIER OVER COPPER BASE METALLIZATION. MEETS SOLDERABILITY PER MIL-STD-202F, METHOD 208. 70 Maxess Road ! Melville, New York 11747 (516) 396-7500 ! Fax (516) 396-7575 PRODUCT SPECIFICATION FEATURES • Glass Passivated Junction • High Temperature Metallurgical Bonded Construction • Molded Plastic Case, Over Glass, Meets UL-94V-0 Flammability Classification • Capable Of Meeting Environmental Testing Per MILSTD-19500 • Flow And Reflow Soldering Compatible NIC P/N: NRF4002TR DESC: SURFACE MOUNT (MELF) SILICON RECTIFIER DIODE SPECIFICATIONS: 1. 2. 3. 4. 5. 6. OPERATING TEMPERATURE RANGE TJ, TSTG: MAXIMUM RECURRENT PEAK RECOVERY VOLTAGE: MAXIMUM RMS VOLTAGE: MAXIMUM DC BLOCKING VOLTAGE: MAXIMUM AVERAGE FORWARD CURRENT(TT=+75°C): PEAK FORWARD SURGE CURRENT, IFM (SURGE): ! ! (8.3mS Single Half Sine Wave Superimposed On Rated Load, JEDEC Method, TA=+75°C) -65°C ~ +175°C 100V 70V 100VDC 1.0A 30A 7. MAXIMUM INSTANTANEOUS FORWARD VOLTAGE AT 1.0A: 8. MAXIMUM FULL LOAD REVERSE CURRENT: 1.1V 30µA 9. MAXIMUM DC REVERSE CURRENT (At Rated DC Blocking Voltage): 10µA (+25°C) 50µA (+125°C) 15pF 30°C/W 75°C/W (Full Cycle Average at TA=+75°C) 10. TYPICAL JUNCTION CAPACITANCE (1MHz, 4.0VDC Bias): 11. MAXIMUM THERMAL RESISTANCE RthJL (SEE NOTE): RthJA (SEE NOTE): NOTE: RthJL = Thermal resistance junction to terminal, 6.0mm² copper pads to each terminal. RthJA = Thermal resistance junction to ambient, 6.0mm² copper pads to each terminal. 12. DIMENSIONS (mm): Cathode color band marker (silver) 2.41 ~ 2.67 0.46 ~ 0.56 4.70 ~ 5.21 TERMINATION: SOLDER PLATE OVER NICKEL BARRIER OVER COPPER BASE METALLIZATION. MEETS SOLDERABILITY PER MIL-STD-202F, METHOD 208. 70 Maxess Road ! Melville, New York 11747 (516) 396-7500 ! Fax (516) 396-7575 PRODUCT SPECIFICATION FEATURES • Glass Passivated Junction • High Temperature Metallurgical Bonded Construction • Molded Plastic Case, Over Glass, Meets UL-94V-0 Flammability Classification • Capable Of Meeting Environmental Testing Per MILSTD-19500 • Flow And Reflow Soldering Compatible NIC P/N: NRF4003TR DESC: SURFACE MOUNT (MELF) SILICON RECTIFIER DIODE SPECIFICATIONS: 1. 2. 3. 4. 5. 6. OPERATING TEMPERATURE RANGE TJ, TSTG: MAXIMUM RECURRENT PEAK RECOVERY VOLTAGE: MAXIMUM RMS VOLTAGE: MAXIMUM DC BLOCKING VOLTAGE: MAXIMUM AVERAGE FORWARD CURRENT(TT=+75°C): PEAK FORWARD SURGE CURRENT, IFM (SURGE): ! ! (8.3mS Single Half Sine Wave Superimposed On Rated Load, JEDEC Method, TA=+75°C) -65°C ~ +175°C 200V 140V 200VDC 1.0A 30A 7. MAXIMUM INSTANTANEOUS FORWARD VOLTAGE AT 1.0A: 8. MAXIMUM FULL LOAD REVERSE CURRENT: 1.1V 30µA 9. MAXIMUM DC REVERSE CURRENT (At Rated DC Blocking Voltage): 10µA (+25°C) 50µA (+125°C) 15pF 30°C/W 75°C/W (Full Cycle Average at TA=+75°C) 10. TYPICAL JUNCTION CAPACITANCE (1MHz, 4.0VDC Bias): 11. MAXIMUM THERMAL RESISTANCE RthJL (SEE NOTE): RthJA (SEE NOTE): NOTE: RthJL = Thermal resistance junction to terminal, 6.0mm² copper pads to each terminal. RthJA = Thermal resistance junction to ambient, 6.0mm² copper pads to each terminal. 12. DIMENSIONS (mm): Cathode color band marker (silver) 2.41 ~ 2.67 0.46 ~ 0.56 4.70 ~ 5.21 TERMINATION: SOLDER PLATE OVER NICKEL BARRIER OVER COPPER BASE METALLIZATION. MEETS SOLDERABILITY PER MIL-STD-202F, METHOD 208. 70 Maxess Road ! Melville, New York 11747 (516) 396-7500 ! Fax (516) 396-7575 PRODUCT SPECIFICATION FEATURES • Glass Passivated Junction • High Temperature Metallurgical Bonded Construction • Molded Plastic Case, Over Glass, Meets UL-94V-0 Flammability Classification • Capable Of Meeting Environmental Testing Per MILSTD-19500 • Flow And Reflow Soldering Compatible NIC P/N: NRF4004TR DESC: SURFACE MOUNT (MELF) SILICON RECTIFIER DIODE SPECIFICATIONS: 1. 2. 3. 4. 5. 6. OPERATING TEMPERATURE RANGE TJ, TSTG: MAXIMUM RECURRENT PEAK RECOVERY VOLTAGE: MAXIMUM RMS VOLTAGE: MAXIMUM DC BLOCKING VOLTAGE: MAXIMUM AVERAGE FORWARD CURRENT(TT=+75°C): PEAK FORWARD SURGE CURRENT, IFM (SURGE): ! ! (8.3mS Single Half Sine Wave Superimposed On Rated Load, JEDEC Method, TA=+75°C) -65°C ~ +175°C 400V 280V 400VDC 1.0A 30A 7. MAXIMUM INSTANTANEOUS FORWARD VOLTAGE AT 1.0A: 8. MAXIMUM FULL LOAD REVERSE CURRENT: 1.1V 30µA 9. MAXIMUM DC REVERSE CURRENT (At Rated DC Blocking Voltage): 10µA (+25°C) 50µA (+125°C) 15pF 30°C/W 75°C/W (Full Cycle Average at TA=+75°C) 10. TYPICAL JUNCTION CAPACITANCE (1MHz, 4.0VDC Bias): 11. MAXIMUM THERMAL RESISTANCE RthJL (SEE NOTE): RthJA (SEE NOTE): NOTE: RthJL = Thermal resistance junction to terminal, 6.0mm² copper pads to each terminal. RthJA = Thermal resistance junction to ambient, 6.0mm² copper pads to each terminal. 12. DIMENSIONS (mm): Cathode color band marker (silver) 2.41 ~ 2.67 0.46 ~ 0.56 4.70 ~ 5.21 TERMINATION: SOLDER PLATE OVER NICKEL BARRIER OVER COPPER BASE METALLIZATION. MEETS SOLDERABILITY PER MIL-STD-202F, METHOD 208. 70 Maxess Road ! Melville, New York 11747 (516) 396-7500 ! Fax (516) 396-7575 PRODUCT SPECIFICATION FEATURES • Glass Passivated Junction • High Temperature Metallurgical Bonded Construction • Molded Plastic Case, Over Glass, Meets UL-94V-0 Flammability Classification • Capable Of Meeting Environmental Testing Per MILSTD-19500 • Flow And Reflow Soldering Compatible NIC P/N: NRF4005TR DESC: SURFACE MOUNT (MELF) SILICON RECTIFIER DIODE SPECIFICATIONS: 1. 2. 3. 4. 5. 6. OPERATING TEMPERATURE RANGE TJ, TSTG: MAXIMUM RECURRENT PEAK RECOVERY VOLTAGE: MAXIMUM RMS VOLTAGE: MAXIMUM DC BLOCKING VOLTAGE: MAXIMUM AVERAGE FORWARD CURRENT(TT=+75°C): PEAK FORWARD SURGE CURRENT, IFM (SURGE): ! ! (8.3mS Single Half Sine Wave Superimposed On Rated Load, JEDEC Method, TA=+75°C) -65°C ~ +175°C 600V 420V 600VDC 1.0A 30A 7. MAXIMUM INSTANTANEOUS FORWARD VOLTAGE AT 1.0A: 8. MAXIMUM FULL LOAD REVERSE CURRENT: 1.1V 30µA 9. MAXIMUM DC REVERSE CURRENT (At Rated DC Blocking Voltage): 10µA (+25°C) 50µA (+125°C) 15pF 30°C/W 75°C/W (Full Cycle Average at TA=+75°C) 10. TYPICAL JUNCTION CAPACITANCE (1MHz, 4.0VDC Bias): 11. MAXIMUM THERMAL RESISTANCE RthJL (SEE NOTE): RthJA (SEE NOTE): NOTE: RthJL = Thermal resistance junction to terminal, 6.0mm² copper pads to each terminal. RthJA = Thermal resistance junction to ambient, 6.0mm² copper pads to each terminal. 12. DIMENSIONS (mm): Cathode color band marker (silver) 2.41 ~ 2.67 0.46 ~ 0.56 4.70 ~ 5.21 TERMINATION: SOLDER PLATE OVER NICKEL BARRIER OVER COPPER BASE METALLIZATION. MEETS SOLDERABILITY PER MIL-STD-202F, METHOD 208. 70 Maxess Road ! Melville, New York 11747 (516) 396-7500 ! Fax (516) 396-7575 PRODUCT SPECIFICATION FEATURES • Glass Passivated Junction • High Temperature Metallurgical Bonded Construction • Molded Plastic Case, Over Glass, Meets UL-94V-0 Flammability Classification • Capable Of Meeting Environmental Testing Per MILSTD-19500 • Flow And Reflow Soldering Compatible NIC P/N: NRF4006TR DESC: SURFACE MOUNT (MELF) SILICON RECTIFIER DIODE SPECIFICATIONS: 1. 2. 3. 4. 5. 6. OPERATING TEMPERATURE RANGE TJ, TSTG: MAXIMUM RECURRENT PEAK RECOVERY VOLTAGE: MAXIMUM RMS VOLTAGE: MAXIMUM DC BLOCKING VOLTAGE: MAXIMUM AVERAGE FORWARD CURRENT(TT=+75°C): PEAK FORWARD SURGE CURRENT, IFM (SURGE): ! ! (8.3mS Single Half Sine Wave Superimposed On Rated Load, JEDEC Method, TA=+75°C) -65°C ~ +175°C 800V 560V 800VDC 1.0A 30A 7. MAXIMUM INSTANTANEOUS FORWARD VOLTAGE AT 1.0A: 8. MAXIMUM FULL LOAD REVERSE CURRENT: 1.1V 30µA 9. MAXIMUM DC REVERSE CURRENT (At Rated DC Blocking Voltage): 10µA (+25°C) 50µA (+125°C) 15pF 30°C/W 75°C/W (Full Cycle Average at TA=+75°C) 10. TYPICAL JUNCTION CAPACITANCE (1MHz, 4.0VDC Bias): 11. MAXIMUM THERMAL RESISTANCE RthJL (SEE NOTE): RthJA (SEE NOTE): NOTE: RthJL = Thermal resistance junction to terminal, 6.0mm² copper pads to each terminal. RthJA = Thermal resistance junction to ambient, 6.0mm² copper pads to each terminal. 12. DIMENSIONS (mm): Cathode color band marker (silver) 2.41 ~ 2.67 0.46 ~ 0.56 4.70 ~ 5.21 TERMINATION: SOLDER PLATE OVER NICKEL BARRIER OVER COPPER BASE METALLIZATION. MEETS SOLDERABILITY PER MIL-STD-202F, METHOD 208. 70 Maxess Road ! Melville, New York 11747 (516) 396-7500 ! Fax (516) 396-7575 PRODUCT SPECIFICATION FEATURES • Glass Passivated Junction • High Temperature Metallurgical Bonded Construction • Molded Plastic Case, Over Glass, Meets UL-94V-0 Flammability Classification • Capable Of Meeting Environmental Testing Per MILSTD-19500 • Flow And Reflow Soldering Compatible NIC P/N: NRF4007TR DESC: SURFACE MOUNT (MELF) SILICON RECTIFIER DIODE SPECIFICATIONS: 1. 2. 3. 4. 5. 6. OPERATING TEMPERATURE RANGE TJ, TSTG: MAXIMUM RECURRENT PEAK RECOVERY VOLTAGE: MAXIMUM RMS VOLTAGE: MAXIMUM DC BLOCKING VOLTAGE: MAXIMUM AVERAGE FORWARD CURRENT(TT=+75°C): PEAK FORWARD SURGE CURRENT, IFM (SURGE): ! ! (8.3mS Single Half Sine Wave Superimposed On Rated Load, JEDEC Method, TA=+75°C) -65°C ~ +175°C 1000V 700V 1000VDC 1.0A 30A 7. MAXIMUM INSTANTANEOUS FORWARD VOLTAGE AT 1.0A: 8. MAXIMUM FULL LOAD REVERSE CURRENT: 1.1V 30µA 9. MAXIMUM DC REVERSE CURRENT (At Rated DC Blocking Voltage): 10µA (+25°C) 50µA (+125°C) 15pF 30°C/W 75°C/W (Full Cycle Average at TA=+75°C) 10. TYPICAL JUNCTION CAPACITANCE (1MHz, 4.0VDC Bias): 11. MAXIMUM THERMAL RESISTANCE RthJL (SEE NOTE): RthJA (SEE NOTE): NOTE: RthJL = Thermal resistance junction to terminal, 6.0mm² copper pads to each terminal. RthJA = Thermal resistance junction to ambient, 6.0mm² copper pads to each terminal. 12. DIMENSIONS (mm): Cathode color band marker (silver) 2.41 ~ 2.67 0.46 ~ 0.56 4.70 ~ 5.21 TERMINATION: SOLDER PLATE OVER NICKEL BARRIER OVER COPPER BASE METALLIZATION. MEETS SOLDERABILITY PER MIL-STD-202F, METHOD 208.