NTE622 Silicon Rectifier, General Purpose, High Voltage, Fast Recovery (Surface Mount) Features: D High Temperature Metallurgically Bonded D Glass Passivated Junction D High Temperature Soldering Guaranteed: +450°C/5 Seconds at Terminals. Complete Device Submersible Temperature of +260°C/10 Seconds in Solder Bath. Maximum Ratings and Electrical Characteristics: (TA = +25°C unless otherwise specified. 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.) Maximum Recurrent Peak Reverse Voltage, VRRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V Maximum RMS Voltage, VRMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280V Maximum DC Blocking Voltage, VDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V Maximum Average Forward Rectified Current (TT = +75°C), IT(AV) . . . . . . . . . . . . . . . . . . . . . . . 0.5A Peak Forward Surge Current, IFSM (8.3ms Single Half Sine–Wave Superimposed on Rated Load) . . . . . . . . . . . . . . . . . . . . 10A Maximum Instantaneous Forward Voltage (IT = 0.5A), VF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2V Maximum DC Reverse Current (VDC = 400V), IR TA = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5µA TA = +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50µA Maximum Reverse Recovery Time (TJ = +25°C, Note 1), trr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50ns Typical Junction Capacitance (Note 2), CJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4pF Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +175°C Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +175°C Maximum Thermal Resistance, Junction–to–Terminal (Note 3), RthJL . . . . . . . . . . . . . . . . . . . 70°C/W Maximum Thermal Resistance, Junction–to–Ambient (Note 4), RthJA . . . . . . . . . . . . . . . . . 150°C/W Note Note Note Note 1. 2. 2. 3. Reverse Recovery Test Conditions: IF = 0.5A, IR = 1A, IRR = 0.25A.. Measured at 1MHz and applied reverse voltage of 4VDC. Thermal resistance, junction–to–terminal, 5.0mm2 copper pads to each terminal. Thermal resistance, junction–to–ambient, 5.0mm2 copper pads to each terminal. Solderable Ends 1st Band (Device Type) 2nd Band (Voltage Type) .066 (1.676) Max Dia .022 (.559) Max .145 (3.683) Max Two Bands Indicates Cathode