HAL® 242x - Micronas

Hardware
Documentation
P rel i m i n a r y D a ta Sh eet
®
HAL 242x
High-Precision Programmable
Linear Hall-Effect Sensor with
Arbitrary Output Characteristics
Edition Nov. 26, 2014
PD000211_004EN
HAL 242x
PRELIMINARY DATA SHEET
Copyright, Warranty, and Limitation of Liability
The information and data contained in this document
are believed to be accurate and reliable. The software
and proprietary information contained therein may be
protected by copyright, patent, trademark and/or other
intellectual property rights of Micronas. All rights not
expressly granted remain reserved by Micronas.
Micronas Trademarks
– HAL
Third-Party Trademarks
All other brand and product names or company names
may be trademarks of their respective companies.
Micronas assumes no liability for errors and gives no
warranty representation or guarantee regarding the
suitability of its products for any particular purpose due
to these specifications.
By this publication, Micronas does not assume responsibility for patent infringements or other rights of third
parties which may result from its use. Commercial conditions, product availability and delivery are exclusively
subject to the respective order confirmation.
Any information and data which may be provided in the
document can and do vary in different applications,
and actual performance may vary over time.
All operating parameters must be validated for each
customer application by customers’ technical experts.
Any new issue of this document invalidates previous
issues. Micronas reserves the right to review this document and to make changes to the document’s content
at any time without obligation to notify any person or
entity of such revision or changes. For further advice
please contact us directly.
Do not use our products in life-supporting systems,
military, aviation, or aerospace applications! Unless
explicitly agreed to otherwise in writing between the
parties, Micronas’ products are not designed, intended
or authorized for use as components in systems
intended for surgical implants into the body, or other
applications intended to support or sustain life, or for
any other application in which the failure of the product
could create a situation where personal injury or death
could occur.
No part of this publication may be reproduced, photocopied, stored on a retrieval system or transmitted
without the express written consent of Micronas.
2
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
Contents
Page
Section
Title
4
4
5
1.
1.1.
1.2.
Introduction
Features
Major Applications
5
5
2.
2.1.
Ordering Information
Device-Specific Ordering Codes
6
6
7
7
7
7
10
12
12
13
13
3.
3.1.
3.2.
3.2.1.
3.2.2.
3.2.2.1.
3.2.2.2.
3.2.2.3.
3.2.2.4.
3.3.
3.4.
Functional Description
General Function
Signal path and Register Definition
Signal path
Register Definition
RAM registers
EEPROM register
NVRAM Registers
Setpoint linearization accuracy
On-board Diagnostic features
Calibration of the sensor
14
14
19
19
20
20
20
21
22
22
22
23
24
24
25
25
4.
4.1.
4.2.
4.3.
4.4.
4.4.1.
4.4.2.
4.5.
4.5.1.
4.5.2.
4.6.
4.7.
4.8.
4.9.
4.10.
4.10.1.
Specifications
Outline Dimensions
Solderability, Welding, Assembly
Pin Connections and Short Descriptions
Physical Dimensions
Dimensions of Sensitive Area
Package Parameter and Position of Sensitive Areas
Absolute Maximum Ratings
Storage and Shelf Life for TO92UT Package
Storage and Shelf Life for SOIC8 Package
Recommended Operating Conditions
Characteristics
Open-Circuit Detection
Overvoltage and Undervoltage Detection
Magnetic Characteristics
Definition of Sensitivity Error ES
27
27
27
27
5.
5.1.
5.2.
5.3.
Application Notes
Application Circuit
Use of two HAL 242x in Parallel
Ambient Temperature
28
28
29
29
6.
6.1.
6.2.
6.3.
Programming of the Sensor
Programming Interface
Programming Environment and Tools
Programming Information
30
7.
Data Sheet History
Micronas
Nov. 26, 2014; PD000211_004EN
3
HAL 242x
PRELIMINARY DATA SHEET
High-Precision Programmable Linear Hall-Effect
Sensor with Arbitrary Output Characteristics
Release Note: Revision bars indicate significant
changes to the previous edition.
It is also possible to compensate offset drift over temperature generated by the customer application with a
first order temperature coefficient for the sensor offset.
This enables operation over the full temperature range
with high accuracy.
The calculation of the individual sensor characteristics
and the programming of the EEPROM can easily be
done with a PC and the application kit from Micronas.
1. Introduction
HAL 242x is a new family of Micronas’ programmable
linear Hall-effect sensors. This family consists of two
members: the HAL 2420 and the HAL 2425.
Both devices are universal magnetic field sensors with
a linear output based on the Hall effect. Major characteristics like magnetic field range, sensitivity, output
quiescent voltage (output voltage at B=0 mT), and output voltage range are programmable in a non-volatile
memory. The sensors have a ratiometric output characteristic, which means that the output voltage is proportional to the magnetic flux and the supply voltage.
Additionally, both sensors offer wire-break detection.
The HAL 2425 offers 16 setpoints to change the output
characteristics from linear to arbitrary or vice versa.
The sensors are designed for hostile industrial and
automotive applications and operate with typically 5 V
supply voltage in the junction temperature range from
40 °C up to 170 °C. The HAL 242x is available in the
very small leaded package TO92UT-1/-2 and in the
SOIC8-1 package.
1.1. Features
– High-precision linear Hall-effect sensors with 12-bit
analog output
– 16 setpoints for various output signal shapes
(HAL 2425)
– 16 bit digital signal processing
– Multiple customer programmable magnetic characteristics in a non-volatile memory with redundancy
and lock function
Table 1–1: HAL 242x family members
Device
Key Function
HAL 2420
2 Setpoints (calibration points)
HAL 2425
16 Setpoints
– Programmable temperature compensation for sensitivity and offset
– Magnetic field measurements in the range of
200 mT
The HAL 242x features a temperature-compensated
Hall plate with spinning current offset compensation,
an A/D converter, digital signal processing, a D/A converter with output driver, an EEPROM with redundancy
and lock function for the calibration data, a serial interface for programming the EEPROM, and protection
devices at all pins. The internal digital signal processing is of great benefit because analog offsets, temperature shifts, and mechanical stress do not degrade digital signals.
The easy programmability allows a 2-point calibration
by adjusting the output signal directly to the input signal (like mechanical angle, distance, or current). Individual adjustment of each sensor during the final manufacturing process is possible. With this calibration
procedure, the tolerances of the sensor, the magnet,
and the mechanical positioning can be compensated
in the final assembly.
In addition, the temperature compensation of the Hall
IC can be fit to all common magnetic materials by programming first and second order temperature coefficients of the Hall sensor sensitivity.
– Low output voltage drifts over temperature
– Active open-circuit (ground and supply line break
detection) with 5 k pull-up and pull-down resistor,
overvoltage and undervoltage detection
– Programmable clamping function
– Digital readout of temperature and magnetic field
information in calibration mode
– Programming and operation of multiple sensors at
the same supply line
– Active detection of output short between two sensors
– High immunity against mechanical stress, ESD,
EMC
– Operates from TJ = 40 °C up to 170 °C
– Operates from 4.5 V up to 5.5 V supply voltage in
specification and functions up to 8.5 V
– Operates with static magnetic fields and dynamic
magnetic fields up to 2 kHz
– Overvoltage and reverse-voltage protection at all
pins
– Short-circuit protected push-pull output
4
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
1.2. Major Applications
2.1. Device-Specific Ordering Codes
Due to the sensors’ versatile programming characteristics and low temperature drifts, the HAL 242x is the
optimal system solution for applications such as:
HAL 242x is available in the following package and
temperature variants.
– Contactless potentiometers,
Table 2–1: Available packages
– Angle sensors (like throttle position, pedal position
and EGR applications),
– Distance and linear movement measurements,
Package Code (PA)
Package Type
UT
TO92UT-1/-2
DJ
SOIC8-1
– Magnetic field and current measurement.
2. Ordering Information
Table 2–2: Available temperature ranges
A Micronas device is available in a variety of delivery
forms. They are distinguished by a specific ordering
code:
XXX NNNN PA-T-C-P-Q-SP
Further Code Elements
Temperature Range
Package
Temperature Code (T)
Temperature Range
A
TJ = 40 °C to +170 °C
The relationship between ambient temperature (TA)
and junction temperature (TJ) is explained in
Section 5.4. on page 29.
Product Type
Product Group
Fig. 2–1: Ordering Code Principle
For a detailed information, please refer to the brochure:
“Hall Sensors: Ordering Codes, Packaging, Handling”.
Micronas
For available variants for Configuration (C), Packaging
(P), Quantity (Q), and Special Procedure (SP) please
contact Micronas.
Table 2–3: Available ordering codes and
corresponding package marking
Available Ordering Codes
Package Marking
HAL2420UT-A-[C-P-Q-SP]
2420A
HAL2420DJ-A-[C-P-Q-SP]
2420A
HAL2425UT-A-[C-P-Q-SP]
2425A
HAL2425DJ-A-[C-P-Q-SP]
2425A
Nov. 26, 2014; PD000211_004EN
5
HAL 242x
PRELIMINARY DATA SHEET
In the supply voltage range from 4.5 V up to 5.5 V, the
sensor generates an analog output voltage. After
detecting a command, the sensor reads or writes the
memory and answers with a digital signal on the output
pin. The analog output is switched off during the communication. Several sensors in parallel to the same
supply and ground line can be programmed individually. The selection of each sensor is done via its output
pin.
3. Functional Description
3.1. General Function
The HAL 242x is a monolithic integrated circuit which
provides an output voltage proportional to the magnetic flux through the Hall plate and proportional to the
supply voltage (ratiometric behavior).
The external magnetic field component perpendicular
to the branded side of the package generates a Hall
voltage. The Hall IC is sensitive to magnetic north and
south polarity. This voltage is converted to a digital
value, processed in the Digital Signal Processing Unit
(DSP) according to the settings of the EEPROM registers, converted back to an analog voltage with ratiometric behavior, and buffered by a push-pull output
transistor stage.
The open-circuit detection provides a defined output
voltage if the VSUP or GND line is broken.
Internal temperature compensation circuitry and the
choppered offset compensation enables operation
over the full temperature range with minimal changes
in accuracy and high offset stability. The circuitry also
reduces offset shifts due to mechanical stress from the
package. The non-volatile memory consists of redundant EEPROM cells. In addition, the sensor IC is
equipped with devices for overvoltage and reversevoltage protection at all pins.
The setting of a LOCK bit disables the programming of
the EEPROM memory for all time. This bit cannot be
reset by the customer.
As long as the LOCK bit is not set, the output characteristic can be adjusted by programming the EEPROM
registers. The IC is addressed by modulating the output voltage.
VSUP
Internally
Stabilized
Supply and
Protection
Devices
Temperature
Dependent
Bias
Oscillator
Switched
Hall Plate
A/D
Converter
Digital
Signal
Processing
Temperature
Sensor
A/D
Converter
Open-circuit,
Overvoltage,
Undervoltage
Detection
Linearization
16 Setpoints
(HAL 2425)
EEPROM Memory
D/A
Converter
Protection
Devices
Analog
Output
OUT
Programming
Interface
Lock Control
GND
Fig. 3–1: HAL 242x block diagram
6
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
3.2. Signal path and Register Definition
3.2.1. Signal path
D
Output
Clamping
A
(Magnetic Ranges)
Hall-Plate
Barrel Shifter
CFX
MIC_COMP
Micronas
Offset & Gain
Trimming
SETPT
CUST_COMP
Customer
Offset & Gain
Trimming
Setpoint
Linearization
DAC Gain
& Offset
Scaling
TEMP_ADJ
-C-
Micronas
Temp-Sensor
Trimming
DAC Drift
Compensation
Output
Clamping
DAC
GAINOFF
Temp-Sensor
DAC
Fig. 3–2: Signal path of HAL 242x
3.2.2. Register Definition
CFX
The DSP is the major part of this sensor and performs
the signal conditioning. The parameters for the DSP
are stored in the EEPROM registers. The details are
shown in Fig. 3–2 and Fig. 3–2.
The CFX register represents the magnetic field information directly after A/D conversion, decimation filter
and magnetic range (barrel shifter) selection. The register content is not temperature compensated. The
temperature variation of this register is specified in
Section 4.10. on page 25 by the parameter RANGEABS.
Terminology:
GAIN: Name of the register or register value
Gain: Name of the parameter
The sensors signal path contains two kinds of registers. Registers that are readout only (RAM) and programmable registers (EEPROM & NVRAM). The RAM
registers contain measurement data at certain positions of the signal path and the EEPROM registers
have influence on the sensors signal processing.
3.2.2.1. RAM registers
Note: During application design, it must be taken into
consideration that CFX should never overflow in
the operational range of the specific application
and especially over the full temperature range.
In case of a potential overflow the barrels shifter
should be switched to the next higher range.
This register has a length of 16 bit and it is two’s-complemented coded. Therefor the register value can vary
between 32768 ... 32767. CFX register values will
increase for positive magnetic fields (south pole) on
the branded side of the package (positive CFX values)
and it will decrease with negative magnetic field polarity.
TEMP_ADJ
MIC_COMP
The TEMP_ADJ register contains the calibrated temperature sensor information. TEMP_ADJ can be used
for the sensor calibration over temperature. This register has a length of 16 bit and it is two’s-complemented
coded. Therefor the register value can vary between
32768 ... 32767.
Micronas
The MIC_COMP register is representing the magnetic
field information directly after the Micronas temperature trimming. The register content is temperature
compensated and has a typical gain drift over temperature of 0 ppm/k. Also the offset and its drift over temperature is typically zero. The register has a length of
16 bit and it is two’s-complemented coded. Therefor
the register value can vary between 32768 ... 32767.
Nov. 26, 2014; PD000211_004EN
7
HAL 242x
PRELIMINARY DATA SHEET
CUST_COMP
DIAGNOSIS
The CUST_COMP register is representing the magnetic field information after the customer temperature
trimming. For HAL 242x it is possible to set a customer
specific gain of second order over temperature as well
as a customer specific offset of first order over temperature. The customer gain and offset can be set with
the EEPROM registers TCCO0, TCCO1 for offset and
TCCG0 ... TCCG2 for gain. Details of these registers
are described on the following pages.
The DIAGNOSIS register enables the customer to
identify certain failures detected by the sensor.
HAL 242x performs certain self tests during power-up
of the sensor and also during normal operation. The
result of these self tests is stored in the DIAGNOSIS
register. DIAGNOSIS register is a 16 bit register.
Bit No. Function
Description
The register has a length of 16 bit and it is two’s-complemented coded. Therefor the register value can vary
between 32768 ... 32767.
15:6
None
Reserved
5
State Machine
(DSP) Self test
This bit is set to 1 in case that
the statemaschine self test fails.
(continuously running)
SETPT
4
EEPROM Self
test
The SETPT register offers the possibility to read the
magnetic field information after the linearization of the
magnetic field information with 16 setpoints. This information is also required for the correct setting of the
sensors DAC GAIN and OFFSET in the following
block.
This bit is set to 1 in case that
the EEPROM self test fails.
(Performed during power-up
only)
3
ROM Check
This bit is set to 1 in case that
ROM parity check fails.
(continuously running)
2
Adder overflow
This bit is set to 1 in case that
an overflow occurs during
calculation of the Micronas
temperature compensation
1:0
None
Reserved
The register has a length of 16 bit and it is two’s-complemented coded. Therefor the register value can vary
between 32768 ... 32767.
GAINOFF
The GAINOFF register offers the possibility to read the
magnetic field information after the DAC GAIN and
OFFSET scaling.
Details on the sensor self tests can be found in
Section 3.3. on page 13.
This register has a length of 16 bit and it is two’s-complemented coded. Therefor the register value can vary
between 32768 ... 32767.
DAC
The DAC register offers the possibility to read the magnetic field information at the end of the complete signal
path. The value of this register is then converted into
an analog output voltage.
The register has a length of 16 bit and it is two’s-complemented coded. Therefor the register value can vary
between 32768 ... 32767.
MIC_ID1 and MIC_ID2
The two registers MIC_ID1 and MIC_ID2 are used by
Micronas to store production information like, wafer
number, die position on wafer, production lot, etc. Both
registers have a length of 16 bit each and are readout
only.
8
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
PROG_DIAGNOSIS
The PROG_DIAGNOSIS register enables the customer to identify errors occurring during programming
and writing of the EEPROM or NVRAM memory. The
customer must either check the status of this register
after each write or program command or alternatively
the second acknowledge. Please check the Programming Guide for HAL 242x.
The PROG_DIAGNOSIS register is a 16 bit register.
The following table shows the different bits indicating
certain errors possibilities.
Bit No. Function
Description
15:11
None
Reserved
10
Charge Pump
Error
This bit is set to 1 in case that
the internal programming
voltage was to low
9
Voltage Error
This bit is set to 1 in case that
during Program/ the internal supply voltage was
Erase
to low during program or erase
8
NVRAM Error
This bit is set to 1 in case that
the programming of the
NVRAM failed
7:0
Memory
Programming
For further information please
refer to the Programming
Guide for HAL 242x
Micronas
Nov. 26, 2014; PD000211_004EN
9
HAL 242x
PRELIMINARY DATA SHEET
3.2.2.2. EEPROM register
EEPROM
TCCOx
TCCGx
A
D
(Magnetic Ranges)
Hall-Plate
Barrel Shifter
CUSTOMER SETUP
Micronas
Offset & Gain
Trimming
Customer
Offset & Gain
Trimming
SCALE_GAIN
SCALE_OFFSET
SETPOINTx
DAC_GAIN
DAC_OFFSET
Setpoint
Linearization
DAC Gain
& Offset
Scaling
Digital Signal Processing
Temp-Sensor
-C-
Micronas
Temp-Sensor
Trimming
DAC Drift
Compensation
Output
Clamping
DAC
DAC_CMPLO
DAC_CMPHI
Fig. 3–3: Details of EEPROM and Digital Signal Processing
CUST_ID1 and CUST_ID2
The two registers CUST_ID1 and CUST_ID2 can be
used to store customer information. Both registers
have a length of 16 bit each.
Barrel Shifter (Magnetic ranges)
The signal path of HAL 242x contains a Barrel Shifter
to emulate magnetic ranges. The customer can select
between different magnetic ranges by changing the
Barrel shifter setting. After decimation filter the signal
path has a word length of 22 bit. The Barrel Shifter
selects 16 bit out of the available 22 bit.
Note: In case that the external field exceeds the magnetic field range the CFX register will be
clamped either to 32768 or 32767 depending
on the sign of the magnetic field.
10
Table 3–1: Relation between Barrel Shifter setting and
emulated magnetic range
BARREL SHIFTER Used bits
Typ. magnetic range
0
22...7
not used
1
21...6
200 mT
2
20...5
100 mT
3
19...4
 50 mT
4
18...3
 25 mT
5
17...2
12 mT
6
16...1
 6 mT
The Barrel Shifter bits are part of the CUSTOMER
SETUP register (bits 14...12). The CUSTOMER
SETUP register is described on the following pages.
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
Sensitivity and Offset Scaling before setpoint linearization SCALE_GAIN/SCALE_OFFSET
Magnetic Sensitivity TCCG
The TCCG (Sensitivity) registers (TCCG0 ... TCCG2)
contain the customer setting for the multiplier in the
DSP. The multiplication factor is a second order polynomial of the temperature.
All three polynomial coefficients have a bit length of 16
bit and they are two’s-complemented coded. Therefor
the register values can vary between 32768 ... 32767.
In case that the target polynomial is based on normalized values, then each coefficient can vary between
1 ... +1. To store each coefficient into the EEPROM it
is necessary to multiply the normalized coefficients
with 32768.
Example:
– Tccg0 = 0.5102 => TCCG0 = 16719
The setpoint linearization uses the full 16 bit number
range 0...32767 (only positive values possible). So the
signal path should be properly scaled for optimal
usage of all 16 setpoints.
For optimum usage of the number range an additional
scaling stage is added in front of the set point algorithm. The setpoint algorithm allows positive input
numbers only.
The input scaling for the linearization stage is done
with the EEPROM registers SCALE_GAIN and
SCALE_OFFSET. The register content is calculated
based on the calibration angles. Both registers have a
bit length of 16 bit and are two’s-complemented coded.
– Tccg1 = 0.0163 => TCCG1 = 536
Analog output signal scaling with DAC_GAIN/
DAC_OFFSET
– Tccg2 = 0.0144 => TCCG2 = 471
In case that the polynomial was calculated based on
not normalized values of TEMP_ADJ and MIC_COMP,
then it is not necessary to multiply the polynomial coefficients with a factor of 32768.
Magnetic Sensitivity TCCO
The TCCO (Offset) registers (TCCO0 and TCCO1)
contain the parameters for the adder in the DSP of the
sensor. The added value is a first order polynomial of
the temperature.
Both polynomial coefficients have a bit length of 16 bit
and they are two’s-complemented coded. Therefor the
register values can vary between 32768 ... 32767.
In case that the target polynomial is based on normalized values, then each coefficient can vary between
1 ... +1. To store each coefficient into the EEPROM it
is necessary to multiply the normalized coefficients
with 32768.
The required output voltage range of the analog output
is defined by the registers DAC_GAIN (Gain of the output) and DAC_OFFSET (Offset of the output signal).
Both register values can be calculated based on the
angular range and the required output voltage range.
They have a bit length of 16 bit and are two’s-complemented coded.
Clamping Levels
The clamping levels DAC_CMPHI and DAC_CMPLO
define the maximum and minimum output voltage of
the analog output. The clamping levels can be used to
define the diagnosis band for the sensor output. Both
registers have a bit length of 16 bit and are two’s-complemented coded. Both clamping levels can have values between 0% and 100% of VSUP.
In case that the polynomial was calculated based on
not normalized values of TEMP_ADJ and MIC_COMP,
then it is not necessary to multiply the polynomial coefSETPOINTS
HAL 2425 features a linearization function based on
16 setpoints. The setpoint linearization in general
allows to linearize a given output characteristic by
applying the inverse compensation curve.
Each of the 16 setpoints (SETPT) registers have a
length of 16 bit. The setpoints have to be computed
and stored in a differential way. This means that if all
setpoints are set to 0, then the linearization is set to
neutral and a linear curve is used.
Micronas
Nov. 26, 2014; PD000211_004EN
11
HAL 242x
PRELIMINARY DATA SHEET
3.2.2.3. NVRAM Registers
3.2.2.4. Setpoint linearization accuracy
Customer Setup
The set point linearization in general allows to linearize
a given output characteristic by applying the inverse
compensation curve.
The CUST_SETUP register is a 16 bit register that
enables the customer to activate various functions of
the sensor like, customer burn-in mode, diagnosis
modes, functionality mode, customer lock, etc.
Table 3–2: Functions in CUST_SETUP register
For this purpose the compensation curve will be
divided into 16 segments with equal distance. Each
segment is defined by two setpoints, which are stored
in EEPROM. Within the interval, the output is calculated by linear interpolation according to the position
within the interval.
Bit No. Function
Description
15
None
Reserved
4
14:12
Barrel Shifter
Magnetic Range
(see Section Table 3–1: on
page 10)
3
1
4
None
Reserved
9:8
Output Short
Detection
0: Disabled
1: High & low side over current
detection -> OUT = VSUP in
error case
2: High & low side over current
detection -> OUT = GND in
error case
3: Low side over current
detection -> OUT = Tristate in
error case
2
0
-1
-2
-4
-4
Reserved
5
Functionality
Mode
1: Normal
4
Communication
Mode (POUT)
Communication via output pin
0: Disabled
1: Enabled
3
Overvoltage
Detection
0: Overvoltage detection active
1: Overvoltage detection
disabled
ysn+1
Diagnosis Latch
Latching of diagnosis bits
-1
0
1
2
3
4
Fig. 3–4: Linearization - Principle
0: No latching
1: Latched till next POR
(power-on reset)
Diagnosis
-2
4
None
1
-3
x 10
7:6
2
Linearized
Distorted
Compensation
-3
output
11:10
x 10
yl
ysn

0: Diagnosis errors force
output to error band (VSUP)
1: Diagnosis errors do not
force output to error band
(VSUP)
0
Customer Lock
Bit must be set to 1 to lock the
sensor memory
xsn xnl
xsn+1
input
Fig. 3–5: Linearization - Detail
xnl: non linear distorted input value
yl: linearized value
 remaining error
12
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
The constraint of the linearization is that the input characteristic has to be a monotonic function. In addition to
that it is recommended that the input does not have a
saddle point or inflection point, i.e. regions where the
input is nearly constant. This would require a high density of set points
3.3. On-board Diagnostic features
The HAL 242x features two groups of diagnostic functions. The first group contains basic functions that are
always active. The second group can be activated by
the customer and contains supervision and self-tests
related to the signal path and sensor memory.
Diagnostic features that are always active:
– Wire break detection for supply and ground line
– Undervoltage detection
– Thermal supervision of output stage (overcurrent,
short circuit, etc.)
Diagnostic features that can be activated by customer:
– Overvoltage detection
– EEPROM self-test at power-on
– Continuous ROM parity check
– Continuous state machine self-test
– Adder overflow
The sensor indicates a fault immediately by switching
the output signal to the upper diagnosis level (max.
Vout) in case that the diagnostic mode is activated by
the customer. The sensor switches the output to
tristate if an over temperature is detected by the thermal supervision. The sensor switches the output to
ground in case of a VSUP wire break.
3.4. Calibration of the sensor
For calibration in the system environment, the application kit from Micronas is recommended. It contains the
hardware for the generation of the serial telegram for
programming (HAL-APB V1.5) and the corresponding
LabView based programming environment for the input
of the register values.
For the individual calibration of each sensor in the customer application, a two point calibration is recommended.
A detailed description of the calibration software, calibration algorithm, programming sequences and register value calculation can be found in the Application
Note “HAL 242x Programming Guide”.
Micronas
Nov. 26, 2014; PD000211_004EN
13
HAL 242x
PRELIMINARY DATA SHEET
4. Specifications
4.1. Outline Dimensions
DETAIL Z
x
5
8
Bd
E
E1
y
center of sensitive
area
L
PIN 1 INDEX
4
1
e
A4
hx45°
D
bbb
A
c
b*
A1
A2
CO C
SEATING PLANE
C
Z
"D" and "E1" are reference data and do not include mold flash or protrusion.
Mold flash or protrusion shall not exceed 150 µm per side.
* does not include dambar protrusion of 0.1 max. per side
5
0
A4, Bd, x,y=these dimensions are different for each sensor type and are
specified in the data sheet
10 mm
scale
UNIT
A
A1
A2
b
bbb
c
CO
D
E
E1
e
h
L
Θ
mm
1.65
0.25
0.1
1.45
0.4
0.25
0.22
0.1
5.0
4.8
6.0
4.0
3.8
1.27
0.3
0.41
min.
8°
max.
JEDEC STANDARD
ISSUE
ITEM NO.
F
MS-012
ISSUE DATE
YY-MM-DD
DRAWING-NO.
ZG-NO.
09-07-21
06690.0001.4 Bl. 1
ZG001090_Ver.05
© Copyright 2009 Micronas GmbH, all rights reserved
Fig. 4–1:
SOIC8-1: Plastic Small Outline IC package, 8 leads, gullwing bent, 150 mil
Ordering code: DJ
Weight approximately 0.086 g
14
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
A2
E1
Bd
A3
A4
F1
D1
y
Center of sensitive area
1
2
3
L
F2
e
b
Θ
c
physical dimensions do not include moldflash.
0
solderability is guaranteed between end of pin and distance F1.
2.5
5 mm
scale
Sn-thickness might be reduced by mechanical handling.
A4, Bd, y= these dimensions are different for each sensor type and are specified in the data sheet.
min/max of D1 are specified in the datasheet.
UNIT
A2
A3
b
c
D1
e
E1
F1
F2
L
Θ
mm
1.55
1.45
0.7
0.42
0.36
4.05
1.27
4.11
4.01
1.2
0.8
0.60
0.42
14.5
min
45°
JEDEC STANDARD
ANSI
ISSUE
ITEM NO.
-
-
ISSUE DATE
YY-MM-DD
DRAWING-NO.
ZG-NO.
10-04-29
06615.0001.4
ZG001015_Ver.07
© Copyright 2007 Micronas GmbH, all rights reserved
Fig. 4–2:
TO92UT-2 Plastic Transistor Standard UT package, 3 leads
Weight approximately 0.12 g
Micronas
Nov. 26, 2014; PD000211_004EN
15
HAL 242x
PRELIMINARY DATA SHEET
A2
E1
Bd
A3
A4
F1
D1
y
Center of sensitive area
F3
F2
3
L1
2
L
1
e
c
Θ
b
physical dimensions do not include moldflash.
2.5
0
solderability is guaranteed between end of pin and distance F1.
5 mm
scale
Sn-thickness might be reduced by mechanical handling.
A4, Bd, y= these dimensions are different for each sensor type and are specified in the data sheet.
min/max of D1 are specified in the datasheet.
UNIT
A2
A3
b
c
D1
e
E1
F1
F2
F3
L
L1
Θ
mm
1.55
1.45
0.7
0.42
0.36
4.05
2.54
4.11
4.01
1.2
0.8
0.60
0.42
4.0
2.0
14.5
min
14.0
min
45°
JEDEC STANDARD
ANSI
ISSUE
ITEM NO.
-
-
ISSUE DATE
YY-MM-DD
DRAWING-NO.
ZG-NO.
10-04-29
06609.0001.4
ZG001009_Ver.07
© Copyright 2007 Micronas GmbH, all rights reserved
Fig. 4–3:
TO92UT-1 Plastic Transistor Standard UT package, 3 leads, spread
Weight approximately 0.12 g
16
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
Fig. 4–4:
TO92UT-2: Dimensions ammopack inline, not spread
Micronas
Nov. 26, 2014; PD000211_004EN
17
HAL 242x
PRELIMINARY DATA SHEET
Fig. 4–5:
TO92UT-1: Dimensions ammopack inline, spread
18
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
4.2. Solderability, Welding, Assembly
Please check the Micronas Document “Guidelines for the Assembly of HAL Packages” for further informations about
solderability, welding, assembly, and second-level packaging. The document is available on the Micronas website or
on the service portal.
4.3. Pin Connections and Short Descriptions
Pin No.
Pin Name
Type
Short Description
1
VSUP
SUPPLY
Supply Voltage
2
GND
GND
Ground
4
OUT
I/O
Output and Programming Pin
SOIC8 Package
All remaining pins (3, 5, 6, 7, 8) must be connected to ground
Pin No.
Pin Name
Type
Short Description
1
VSUP
SUPPLY
Supply Voltage
2
GND
GND
Ground
3
OUT
I/O
Output and Programming Pin
TO92UT Package
1
VSUP
OUT
4
2 GND
(3, 5, 6, 7, 8)
Fig. 4–6: Pin configuration (SOIC8)
1
VSUP
OUT
Pin 3
2
GND
Fig. 4–7: Pin configuration (TO92UT)
Micronas
Nov. 26, 2014; PD000211_004EN
19
HAL 242x
PRELIMINARY DATA SHEET
4.4. Physical Dimensions
4.4.1. Dimensions of Sensitive Area
250 µm x 250 µm
4.4.2. Package Parameter and Position of Sensitive Areas
SOIC8-1
TO92UT-1/-2
A4
0.48 mm nominal
0.4 mm nominal
Bd
0.3 mm
0.3 mm
x
0 mm nominal (center of package)
y
0.13 mm nominal
1.55 mm nominal
D1
-
4.05 mm ± 0.05 mm
H1
-
min. 22.0 mm
max. 24.1 mm
20
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
4.5. Absolute Maximum Ratings
Stresses beyond those listed in the “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only. Functional operation of the device at these conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods will affect device reliability.
This device contains circuitry to protect the inputs and outputs against damage due to high static voltages or electric
fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than absolute maximum-rated voltages to this circuit.
All voltages listed are referenced to ground (GND).
Symbol
Parameter
Pin
Min.
Max.
Unit
Condition
VSUP
Supply Voltage
VSUP
8.5
10
V
t < 96 h4)
18
18
V
t < 1h4)
t < 1h4)
VOUT
Output Voltage
OUT
61)
18
V
VOUT  VSUP
Excess of Output Voltage
over Supply Voltage
OUT,
VSUP

2
V
TJ
Junction Temperature
Range
50
1902)
°C
t < 96h4)
VESD_SOIC8
ESD Protection for SOIC8
package
8.03)
8.03)
kV
Pin 3 soldered and connected to GND.
2.03)
2.03)
8.03)
8.03)
VESD_TO92
ESD Protection for
TO92UT package
1) internal protection resistor = 50 
2)
for 96 hrs - Please contact Micronas for
3)
AEC-Q-100-002 (100 pF and 1.5 k)
4) No cumulated stress
Micronas
VSUP,
OUT
VSUP,
OUT
Pin 3 not connected
kV
other temperature requirements.
Nov. 26, 2014; PD000211_004EN
21
HAL 242x
PRELIMINARY DATA SHEET
4.5.1. Storage and Shelf Life for TO92UT Package
The permissible storage time (shelf life) of the sensors is unlimited, provided the sensors are stored at a maximum of
30 °C and a maximum of 85% relative humidity. At these conditions, no Dry Pack is required.
Solderability is guaranteed for two years from the date code on the package.
4.5.2. Storage and Shelf Life for SOIC8 Package
The SOIC8 package is a moisture-sensitive Surface Mount Device. The Moisture Sensitivity Level (MSL) is defined
according to JEDEC J-STD-020 (Moisture/ Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices). The device is packed acc. to IPC/JEDEC J-STD-033: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices. By using these procedures, safe and damage-free reflow can be
achieved.
Please follow the instructions printed on each Moisture Barrier Bag. These instructions contain information about the
Moisture Sensitivity Level “MSL”, the maximum reflow temperature “Peak Package Body Temp.” and the time frame
“Time for Mounting after opening the MBB”. The dry-bag shelf life capability of sealed dry-bags is minimum 12
months starting from the “Bag seal date” printed on each bag.
If moisture-sensitive components have been exposed to ambient air for longer than the specified time according to
their MSL, or the humidity indicator card indicates too much moisture after opening a Moisture Barrier Bag (MBB),
the components have to be baked prior to the assembly process. Please refer to IPC/ JEDEC J-STD-033 for details.
Please be aware that packing materials may not withstand higher baking temperatures.
4.6. Recommended Operating Conditions
Functional operation of the device beyond those indicated in the “Recommended Operating Conditions/Characteristics” is not implied and may result in unpredictable behavior, reduce reliability and lifetime of the device.
All voltages listed are referenced to ground (GND).
Symbol
Parameter
Pin
Min.
Typ.
Max.
Unit
Remarks
VSUP
Supply Voltage
VSUP
4.5
5
5.5
V
IOUT
Continuous Output Current
OUT
1.2

1.2
mA
RL
Load Resistor
OUT
5.0
10

k
CL
Load Capacitance
OUT
0.33
10
600
nF
NPRG
Number of EEPROM Programming Cycles1)



100
cycles
0°C < Tamb < 55°C
NPRGNV
Number of NVRAM Programming Cycles



5
cycles
0°C < Tamb < 55°C
TJ
Junction Temperature
Range2)

40
40
40

125
150
170
°C
for 8000 h3)
for 2000 h3)
for 1000 h3)
Can be pull-up or pull-down
resistor
1)
In the EEPROM, it is not allowed to program only one single address within a 'bank' in the memory. In case of
programming one single address the complete bank has to be programmed.
2)
Depends on the temperature profile of the application. Please contact Micronas for life time calculations.
3)
Time values are not cumulative.
22
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
4.7. Characteristics
at TJ = 40 °C to +170 °C, VSUP = 4.5 V to 5.5 V, GND = 0 V after programming and locking,
at Recommended Operation Conditions if not otherwise specified in the column “Conditions”.
Typical Characteristics for TJ = 25 °C and VSUP = 5 V.
Symbol
Parameter
Pin
Min.
Typ.
Max.
Unit
Conditions
ISUP
Supply Current
over Temperature Range
VSUP

7
10
mA
Resolution5)
OUT

12

bit
ratiometric to VSUP 1)
DNL
Differential Non-Linearity of D/A
Converter4)
OUT
0.9
0
0.9
LSB
Test limit at 25 °C ambient
temperature
INL
Non-Linearity of Output Voltage over
Temperature6)
OUT
0.3
0
0.3
%VSUP
2)
For Vout = 0.35 V ... 4.65 V;
VSUP = 5 V ; Linear Setpoint
Characteristics
ER
Ratiometric Error of Output
over Temperature
(Error in VOUT / VSUP)
OUT
0.25 0
0.25
%
Max of [VOUT5  VOUT4.5 and
VOUT5.5  VOUT5] at VOUT = 10%
and 90% VSUP
Voffset
Offset Drift over Temperature Range6) OUT
VOUT(B = 0 mT)25°C VOUT(B =
0 mT)max
0
0.1
0.2
%VSUP
VSUP = 5 V ; BARREL SHIFTER =
3 (± 50 mT)
VOUTCL
Accuracy of Output Voltage at
Clamping Low Voltage over
Temperature Range5)
OUT
11
0
11
mV
VOUTCH
Accuracy of Output Voltage at
Clamping High Voltage over
Temperature Range5)
OUT
11
0
11
mV
RL = 5 k, VSUP = 5 V
Spec values are derived from
resolution of the registers
DAC_CMPHI/LO and Voffset.
VOUTH
Upper Limit of Signal Band3)
OUT
93


%VSUP
VSUP = 5 V, 1 mA IOUT 1mA
VOUTL
Lower Limit of Signal Band3)
OUT


7
%VSUP
VSUP = 5 V, 1 mA IOUT 1mA
fOSC
Internal Oscillator Frequency over
Temperature Range


4

MHz
tr(O)
Step Response Time of Output6)
OUT

0.5
0.6
ms
CL = 10 nF, time from 10% to 90%
of final output voltage for a step
like signal Bstep from 0 mT to
Bmax
tPOD
Power-Up Time (Time to Reach
Certain Output Accuracy)6)
OUT




1.7
8.0
ms
ms
Additional error of 1% Full-Scale
Full accuracy
BW
Small Signal Bandwidth (3 dB)6)
OUT

2

kHz
VOUTrms
Output Noise Voltage RMS
OUT


4
mV
BARREL SHIFTER=3
Overall gain in signal path =1
External circuitry according to
Fig. 5–1with low-noise supply
ROUT
Output Resistance over
Recommended Operating Range
OUT

1
10

VOUTLmax VOUT VOUTHmin
6)
1)
2)
Output DAC full scale = 5 V ratiometric, Output DAC offset = 0 V, Output DAC LSB = VSUP/4096
if more than 50% of the selected magnetic field range is used and the temperature compensation is suitable.
INL = VOUT - VOUTLSF with VOUTLSF = Least Square Fit through measured output voltage
3)
Signal Band Area with full accuracy is located between VOUTL and VOUTH. The sensor accuracy is reduced below VOUTL
and above VOUTH
4) External package stress or overmolding might change this parameter
5) Guaranteed by Design
6) Characterized on small sample size, not tested
Micronas
Nov. 26, 2014; PD000211_004EN
23
HAL 242x
Symbol
PRELIMINARY DATA SHEET
Parameter
Pin
Min.
Typ.
Max.
Unit
Conditions
SOIC8 Package
Thermal Resistance
Rthja
Junction to Air



142
K/W
Measured with a 1s0p board
Rthjc
Junction to Case



33
K/W
Measured with a 1s0p board
Rthjs
Junction to Solder Point



tbd
K/W
Measured with a 1s1p board
TO92UT Packages
Thermal Resistance
Rthja
Junction to Air



235
K/W
Measured with a 1s0p board
Rthjc
Junction to Case



61
K/W
Measured with a 1s0p board
Rthjs
Junction to Solder Point



128
K/W
Measured with a 1s1p board
4.8. Open-Circuit Detection
at TJ = 40 °C to +170 °C, Typical Characteristics for TJ = 25 °C
Symbol
Parameter
Pin
Min.
Typ.
Max.
Unit
Comment
VOUT
Output Voltage at
Open VSUP Line
OUT
0
0
0.15
V
VSUP = 5 V
RL = 10 kto 200 k
0
0
0.2
V
VSUP = 5 V
RL = 5 kto 10 k
4.85
4.9
5.0
V
VSUP = 5 V
RL = 10 kto 200 k
4.8
4.9
5.0
V
VSUP = 5 V
RL = 5 kto 10 k
VOUT
Output Voltage at
Open GND Line
OUT
RL: Can be pull-up or pull-down resistor
4.9. Overvoltage and Undervoltage Detection
at TJ = 40 °C to +170 °C, Typical Characteristics for TJ = 25 °C, after programming and locking
Symbol
Parameter
Pin
Min.
Typ.
Max.
Unit
VSUP,UV
Undervoltage Detection Level
VSUP
3.3
3.9
4.3
V
VSUP,UVhyst
Undervoltage Detection Level
Hysteresis1)
VSUP

200

mV
VSUP,OV
Overvoltage Detection Level
VSUP
5.6
6.2
6.9
V
VSUP,OVhyst
Overvoltage Detection Level
Hysteresis1)
VSUP

225

mV
1)
24
Test Conditions
Characterized on small sample size, not tested
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
4.10.Magnetic Characteristics
at TJ = 40 °C to +170 °C, VSUP = 4.5 V to 5.5 V, GND = 0 V after programming and locking,
at Recommended Operation Conditions if not otherwise specified in the column “Conditions”.
Typical Characteristics for TJ = 25 °C and VSUP = 5 V.
Symbol
Parameter
Pin
Min.
Typ.
Max.
Unit
Test Conditions
SENS
Magnetic Sensitivity



320
mV/mT
Programmable VSUP = 5 V and TJ = 25 °C;
BARREL SHIFTER= ±12 mT Vout = 4 V
RANGEABS
Absolute Range of CFX Register (Magnetic Range)1)

100
200
235
%
See Section 3.2. on page 7 for CFX
register definition.
BOffset
Magnetic Offset1)
OUT
0.4
0
0.4
mT
B = 0 mT, IOUT = 0 mA, TJ = 25 °C,
unadjusted sensor
BOffset/T
Magnetic Offset Change
due to TJ1)

5
0
5
T/K
B = 0 mT, IOUT = 0 mA
BARREL SHIFTER = 3 (±50 mT)
ES
Error in Magnetic Sensitivity
SOIC8
TO92UT
OUT
1.5
1
0
0
1.5
1
%
1)
VSUP = 5 V
BARREL SHIFTER = 3 (±50 mT)
Characterized on small sample size, not tested
4.10.1.Definition of Sensitivity Error ES
ES is the maximum of the absolute value of 1 minus
the quotient of the normalized measured value1) over
the normalized ideal linear2) value:
ES = max  abs  meas
------------ – 1 
ideal
 Tmin, Tmax 
In the below example, the maximum error occurs at
°C:
10
ES = 1.001
------------- – 1 = 0.8%
0.993
1) normalized to achieve a least-square-fit straight-line
that has a value of 1 at 25 °C
2) normalized to achieve a value of 1 at 25 °C
Micronas
Nov. 26, 2014; PD000211_004EN
25
HAL 242x
PRELIMINARY DATA SHEET
ideal 200 ppm/k
1.03
relative sensitivity related to 25 °C value
least-square-fit straight-line of
normalized measured data
measurement example of real
sensor, normalized to achieve a
value of 1 of its least-square-fit
straight-line at 25 °C
1.02
1.01
1.001
1.00
0.993
0.99
0.98
–50
–25
-10
0
25
50
75 100
temperature [°C]
125
150
175
Fig. 4–8: ES definition example
26
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
5. Application Notes
5.3. Ambient Temperature
5.1. Application Circuit
Due to the internal power dissipation, the temperature
on the silicon chip (junction temperature TJ) is higher
than the temperature outside the package (ambient
temperature TA).
For EMC protection, it is recommended to connect one
ceramic 47 nF capacitor each between ground and the
supply voltage, respectively the output voltage pin.
T J = T A + T
VSUP
OUT
At static conditions and continuous operation, the following equation applies:
GND
T = I SUP  V SUP  R thjx
HAL242x
47 nF
47 nF
Fig. 5–1: Recommended application circuit
5.2. Use of two HAL 242x in Parallel
Two different HAL 242x sensors which are operated in
parallel to the same supply and ground line can be programmed individually as the communication with the
sensors is done via their output pins.
VSUP
OUT A
47 nF
HAL242x
Sensor A
47 nF
HAL242x
Sensor B
For typical values, use the typical parameters. For
worst case calculation, use the max. parameters for
ISUP and Rthjx (x is representing the different Rth value,
like junction to ambient Rthja), and the max. value for
VSUP from the application.
For VSUP = 5.5 V, Rth = 235 K/W, and ISUP = 10 mA,
the temperature difference T = 12.93 K.
For all sensors, the junction temperature TJ is specified. The maximum ambient temperature TAmax can be
calculated as:
OUT B
T Amax = T Jmax – T
47 nF
GND
Fig. 5–2: Parallel operation of two HAL 242x
Micronas
Nov. 26, 2014; PD000211_004EN
27
HAL 242x
PRELIMINARY DATA SHEET
6. Programming of the Sensor
tbittime
HAL 242x features two different customer modes. In
Application Mode the sensor provides a ratiometric
analog output voltage. In Programming Mode it is
possible to change the register settings of the sensor.
tbittime
or
logical 0
After power-up the sensor is always operating in the
Application Mode. It is switched to the Programming
Mode by a pulse on the sensor output pin.
tbittime
tbittime
or
6.1. Programming Interface
logical 1
In Programming Mode the sensor is addressed by
modulating a serial telegram on the sensors output
pin. The sensor answers with a modulation of the output voltage.
Fig. 6–1: Definition of logical 0 and 1 bit
A logical “0” is coded as no level change within the bit
time. A logical “1” is coded as a level change of typically 50% of the bit time. After each bit, a level change
occurs (see Fig. 6–1).
A description of the communication protocol and the
programming of the sensor is available in a separate
document (Application Note Programming HAL 242x).
50%
50%
50%
50%
The serial telegram is used to transmit the EEPROM
content, error codes and digital values of the angle
information from and to the sensor.
Table 6–1: Telegram parameters (All voltages are referenced to GND.)
Symbol
VOUTL
VOUTH
Parameter
Pin
Limit Values
Unit Test Conditions
Min.
Typ.
Max.
Voltage for Output Low
OUT
Level during Programming
through Sensor Output Pin
0

0.2*VSUP V
0

1.0
V
Voltage for Output High
OUT
Level during Programming
through Sensor Output Pin
0.8*VSUP 
VSUP
V
4.0

5.0
V
for VSUP = 5 V
Supply voltage for
bidirectional
communication via
output pin.
VSUPProgram VSUP Voltage for EEPROM
programming (after PROG
and ERASE)
VSUP
5.7
6.0
6.5
V
tbittime
Biphase Bit Time
OUT
900
1000
1100
µs
Slew rate
OUT

2.0

V/µs
28
for VSUP = 5 V
Nov. 26, 2014; PD000211_004EN
Micronas
HAL 242x
PRELIMINARY DATA SHEET
6.2. Programming Environment and Tools
For the programming of HAL 242x during product
development and also for production purposes a programming tool including hardware and software is
available on request. It is recommended to use the
Micronas tool kit (HAL-APB V1.x & Lab View Programming Environment) in order to easy the product development. The details of programming sequences are
also available on request.
Note: For production HAL-APB V1.5 or higher must be
used.
6.3. Programming Information
For reliability in service, it is mandatory to set the
LOCK bit to one and the POUT bit to zero after final
adjustment and programming of HAL 242x.
The success of the LOCK process must be checked by
reading the status of the LOCK bit after locking and by
a negative communication test after a power on reset.
It is also mandatory to check the acknowledge (first
and second) of the sensor or to read/check the status
of the PROG_DIAGNOSIS register after each write
and store sequence to verify if the programming of the
sensor was successful. Please check HAL 242x Programming Guide for further details.
Electrostatic Discharges (ESD) may disturb the programming pulses. Please take precautions against
ESD.
Micronas
Nov. 26, 2014; PD000211_004EN
29
HAL 242x
PRELIMINARY DATA SHEET
7. Data Sheet History
1. Preliminary Data Sheet: “HAL 242x High-Precision
Programmable Linear Hall-Effect Sensor”, May 3,
2013, PD000211_001EN. First release of the preliminary data sheet.
2. Preliminary Data Sheet: “HAL 242x High-Precision
Programmable Linear Hall-Effect Sensor with Arbitrary Output Characteristics”, July 4 2014,
PD000211_002EN. Second release of the preliminary data sheet.
Major Change: SOIC8 package added
3. Preliminary Data Sheet: “HAL 242x High-Precision
Programmable Linear Hall-Effect Sensor with Arbitrary Output Characteristics”, Sept. 19, 2014
PD000211_003EN. Third release of the preliminary
data sheet.
Major Changes:
– SOIC8 package drawing updated
– Absolute Maximum Ratings – Specification of
ESD Protection for SOIC8 package
4. Preliminary Data Sheet: “HAL 242x High-Precision
Programmable Linear Hall-Effect Sensor with Arbitrary Output Characteristics”, Nov. 26, 2014,
PD000211_004EN. Fourth release of the preliminary data sheet.
Major Changes:
– SOIC8 package drawing updated
– Position of Sensitive Areas: A4 value changed to
0.48 mm
Micronas GmbH
Hans-Bunte-Strasse 19  D-79108 Freiburg  P.O. Box 840  D-79008 Freiburg, Germany
Tel. +49-761-517-0  Fax +49-761-517-2174  E-mail: [email protected]  Internet: www.micronas.com
30
Nov. 26, 2014; PD000211_004EN
Micronas