CYPRESS CY7C192-12VC

CY7C192
64K x 4 Static RAM
with Separate I/O
Features
Functional Description
• High speed
The CY7C192 is a high-performance CMOS static RAM
organized as 65,536 x 4 bits with separate I/O. Easy memory
expansion is provided by active LOW Chip Enable (CE) and
tri-state drivers. It has an automatic power-down feature,
reducing the power consumption by 75% when deselected.
— 12 ns
• CMOS for optimum speed/power
• Low active power
Writing to the device is accomplished when the Chip Enable
(CE) and write enable (WE) inputs are both LOW.
— 860 mW
• Low standby power
Data on the four input pins (I0 through I3) is written into the
memory location specified on the address pins (A0 through
A15).
— 55 mW
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
Reading the device is accomplished by taking the Chip Enable
(CE) LOW while the Write Enable (WE) remains HIGH. Under
these conditions the contents of the memory location specified
on the address pins will appear on the four data output pins.
• Available in non Pb-free 28-Lead Molded SOJ package.
The output pins stay in high-impedance state when Write
Enable (WE) is LOW, or Chip Enable (CE) is HIGH.
A die coat is used to insure alpha immunity.
Logic Block Diagram
Pin Configurations
I0
SOJ
Top View
I1
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
I0
I1
CE
GND
I2
I3
INPUT BUFFER
64K x 4
ARRAY
SENSE AMPS
O0
ROW DECODER
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
O1
O2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A5
A4
A3
A2
A1
A0
I3
I2
O3
O2
O1
O0
WE
O3
POWER
DOWN
CE
A10
A11
A12
A13
A14
A15
COLUMN
DECODER
WE
Selection Guide
-12
12
155
10
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Cypress Semiconductor Corporation
Document #: 38-05047 Rev. *C
•
198 Champion Court
-15
15
145
10
•
Unit
ns
mA
mA
San Jose, CA 95134-1709
•
408-943-2600
Revised August 3, 2006
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CY7C192
DC Input Voltage[1].................................... −0.5V to VCC + 0.5V
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ..................................... −65°C to +150°C
Ambient Temperature with
Power Applied.................................................. −55°C to +125°C
Supply Voltage to Ground Potential .................−0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State[1] ........................................ −0.5V to VCC + 0.5V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage............................................. >900V
(per MIL-STD-883, Method 3015)
Latch-Up Current .................................................... >200 mA
Operating Range
Range
Commercial
Ambient
Temperature[2]
VCC
0°C to +70°C
5V ± 10%
Electrical Characteristics Over the Operating Range
-12
Parameter
Description
Test Conditions
Min.
-15
Max.
Min.
VOH
Output HIGH Voltage
VCC = Min., IOH = −4.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input HIGH Voltage
2.2
VCC + 0.3V
VIL
Input LOW Voltage[1]
−0.5
0.8
IIX
Input Leakage Current
GND < VI < VCC
−5
+5
IOZ
Output Leakage Current
GND < VO < VCC, Output Disabled
−5
+5
ICC
VCC Operating
Supply Current
VCC = Max., IOUT = 0 mA,
f = fMAX = 1/tRC
ISB1
ISB2
2.4
Max.
Unit
2.4
V
0.4
0.4
V
2.2
VCC + 0.3V
V
−0.5
0.8
V
−5
+5
µA
−5
+5
µA
155
145
mA
Automatic CE Power-Down Max. VCC, CE > VIH, VIN > VIH or
Current—TTL Inputs
VIN < VIL, f = fMAX
30
30
mA
Automatic CE Power-Down Max. VCC, CE > VCC − 0.3V,
Current—CMOS Inputs
VIN > VCC − 0.3V or VIN < 0.3V, f = 0
10
10
mA
Capacitance[3]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Max.
Unit
8
pF
10
pF
AC Test Loads and Waveforms[4]
R1 481Ω
5V
OUTPUT
R1 481Ω
5V
ALL INPUT PULSES
OUTPUT
R2
255Ω
30 pF
INCLUDING
JIG AND
SCOPE
(a)
3.0V
R2
255Ω
5 pF
INCLUDING
JIG AND
SCOPE
(b)
GND
10%
90%
< tr
90%
10%
< tr
Equivalent to:
THÉVENIN EQUIVALENT
167Ω
OUTPUT
1.73V
Notes:
1. Minimum voltage is equal to –2.0V for pulse durations of less than 20 ns.
2. TA is the case temperature.
3. Tested initially and after any design or process changes that may affect these parameters.
4. tr = < 3 ns for the -12 and -15 speeds. tr = < 5 ns for the -20 and slower speeds.
Document #: 38-05047 Rev. *C
Page 2 of 8
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CY7C192
Switching Characteristics Over the Operating Range[5]
-12
Parameter
Description
Min.
-15
Max.
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
12
tAA
Address to Data Valid
tOHA
Output Hold from Address Change
tACE
CE LOW to Data Valid
[6]
tLZCE
CE LOW to Low Z
CE HIGH to High Z
tPU
CE LOW to Power-Up
tPD
Write
12
3
3
15
15
5
ns
ns
7
0
12
ns
ns
3
0
CE HIGH to Power-Down
ns
3
12
[6,7]
tHZCE
15
ns
ns
15
ns
Cycle[8]
tWC
Write Cycle Time
12
15
ns
tSCE
CE LOW to Write End
9
10
ns
tAW
Address Set-Up to Write End
9
10
ns
tHA
Address Hold from Write End
0
0
ns
tSA
Address Set-Up to Write Start
0
0
ns
tPWE
WE Pulse Width
8
9
ns
tSD
Data Set-Up to Write End
8
9
ns
tHD
Data Hold from Write End
0
0
ns
Z[6]
tLZWE
WE HIGH to Low
tHZWE
WE LOW to High Z[6,7]
3
3
7
ns
7
ns
Notes:
5. Test conditions assume signal transition time of 3 ns or less for -12 and -15 speeds, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output
loading of the specified IOL/IOH and 30-pF load capacitance.
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZW\E is less than tLZWE for any given device. These parameters are guaranteed by
design and not 100% tested.
7. tHZCE and tHZWE are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
8. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
Document #: 38-05047 Rev. *C
Page 3 of 8
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CY7C192
Switching Waveforms
Read Cycle No. 1[9, 10]
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2[9, 11]
tRC
CE
tACE
DATA OUT
tHZCE
HIGH IMPEDANCE
HIGH
IMPEDANCE
DATA VALID
tLZCE
VCC
SUPPLY
CURRENT
tPD
tPU
ICC
50%
50%
ISB
Write Cycle No. 1 (WE Controlled)[8]
tWC
ADDRESS
tSCE
CE
tSA
tAW
tHA
tPWE
WE
tSD
DATA IN
DATA VALID
tHZWE
DATA OUT
tHD
tLZWE
HIGH IMPEDANCE
DATA UNDEFINED
Notes:
9. WE is HIGH for read cycle.
10. Device is continuously selected, CE = VIL.
11. Address valid prior to or coincident with CE transition LOW.
Document #: 38-05047 Rev. *C
Page 4 of 8
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CY7C192
Switching Waveforms (continued)
Write Cycle No. 2 (CE Controlled)[8, 12]
tWC
ADDRESS
tSA
tSCE
CE
tAW
tHA
tPWE
WE
tHD
tSD
DATA IN
DATA VALID
tHZWE
DATA OUT
HIGH IMPEDANCE
Note:
12. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
Document #: 38-05047 Rev. *C
Page 5 of 8
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CY7C192
Typical DC and AC Characteristics
SB
1.4
1.2
ICC
0.8
VIN =5.0V
TA =25°C
0.4
0.2
1.0
0.8
0.6
VCC =5.0V
VIN =5.0V
0.4
0.2
ISB
0.0
4.0
1.2
4.5
5.0
5.5
ISB
0.0
–55
6.0
1.6
1.3
1.4
NORMALIZED tAA
NORMALIZED tAA
1.4
1.2
1.1
TA =25°C
1.0
1.2
1.0
VCC =5.0V
0.8
0.9
4.5
5.0
5.5
6.0
0.6
-55
80
VCC =5.0V
TA =25°C
60
40
20
0
0.0
1.0
25
TYPICAL POWER-ON CURRENT
vs. SUPPLY VOLTAGE
2.5
25.0
DELTA t AA (ns)
30.0
2.0
1.5
1.0
3.0
4.0
OUTPUT SINK CURRENT
vs. OUTPUT VOLTAGE
140
120
100
80
60
VCC =5.0V
TA =25°C
40
20
0
0.0
125
1.0
2.0
3.0
4.0
OUTPUT VOLTAGE (V)
TYPICAL ACCESS TIME CHANGE
vs. OUTPUT LOADING
3.0
2.0
OUTPUT VOLTAGE (V)
AMBIENT TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
NORMALIZED I CC vs. CYCLE TIME
1.25
20.0
15.0
VCC =4.5V
TA =25°C
10.0
1.00
VCC =5.0V
TA =25°C
VIN =0.5V
0.75
5.0
0.5
0.0
0.0
100
125
NORMALIZED ACCESS TIME
vs. AMBIENT TEMPERATURE
NORMALIZED ACCESS TIME
vs. SUPPLY VOLTAGE
0.8
4.0
120
AMBIENT TEMPERATURE(°C)
SUPPLY VOLTAGE (V)
NORMALIZED IPO
25
OUTPUT SINK CURRENT (mA)
0.6
ICC
OUTPUT SOURCE CURRENT
vs. OUTPUT VOLTAGE
NORMALIZED ICC
1.0
NORMALIZED ICC
NORMALIZED ICC
SB
1.4
OUTPUT SOURCE CURRENT (mA)
NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE
1.0
2.0
3.0
4.0
SUPPLY VOLTAGE (V)
Document #: 38-05047 Rev. *C
5.0
0.0
0
200
400
600
800 1000
CAPACITANCE (pF)
0.50
10
20
30
40
CYCLE FREQUENCY (MHz)
Page 6 of 8
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CY7C192
Ordering Information
Speed (ns)
Ordering Code
12
CY7C192-12VC
15
CY7C192-15VC
Package Diagram
51-85031
Package Type
Operating Range
28-Lead Molded SOJ
Commercial
Package Diagram
28-Lead (300-Mil) Molded SOJ (51-85031)
NOTE :
1. JEDEC STD REF MO088
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.006 in (0.152 mm) PER SIDE
MIN.
MAX.
3. DIMENSIONS IN INCHES
DETAIL
A
EXTERNAL LEAD DESIGN
PIN 1 ID
14
1
0.291
0.300
15
0.330
0.350
28
OPTION 1
0.697
0.713
0.014
0.020
OPTION 2
SEATING PLANE
0.120
0.140
0.050
TYP.
0.026
0.032
0.013
0.019
A
0.007
0.013
0.004
0.025 MIN.
0.262
0.272
51-85031-*C
All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05047 Rev. *C
Page 7 of 8
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY7C192
Document History Page
Document Title: CY7C192 64K x 4 Static RAM with Separate I/O
Document Number: 38-05047
REV.
ECN NO.
Issue
Date
Orig. of
Change
Description of Change
**
107149
09/10/01
SZV
Change Spec number from: 38-00076 to 38-05047
*A
359716
See ECN
AJU
Changed Static Discharge Voltage limit in the Maximum Ratings section
(page 2) from 2001V to 900V
Removed references to CY7C191
*B
419549
See ECN
AJU
Added Pb-free parts to the Ordering Information table and replaced the
Package Name column with Package Diagram
*C
492500
See ECN
NXR
Removed 20 ns and 25 ns speed bins
Changed the Low active power from 220 mW to 55 mW
Changed the description of IIX from Input Load Current to Input Leakage
Current in DC Electrical Characteristics table
Removed IOS parameter from DC Electrical Characteristics table
Removed 28-Lead (300-Mil) PDIP package from product offering
Updated Ordering Information table
Document #: 38-05047 Rev. *C
Page 8 of 8
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