Package Information MECHANICAL DIMENSIONS PWP 24-Pin Thin Small Shrink Outline (TSSOP) Power 3 2 1 E P E D F A H SEATING PLANE DIM A B C D E F G H L M P *LC B G Millimeters MIN MAX 0.80 1.05 0.19 0.30 0.09 0.180 7.70 7.90 4.30 4.48 0.65 BSC 0.05 0.15 — 1.10 0.50 0.70 0° 8° 6.25 6.50 — 0.10 M L C Inches MIN MAX 0.032 0.041 0.007 0.012 0.0035 0.0071 0.303 0.311 0.169 0.176 0.025 BSC 0.002 0.005 — 0.0433 0.020 0.028 0° 8° 0.246 0.256 — 0.004 * Lead Coplanarity Note: 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.15mm (.006") on any side. Lead dimension shall not include solder coverage. LinFinity Microelectronics Inc., 11861 Western Ave., Garden Grove, CA. 92841 - (714) 898-8121 - Fax: (714) 893-2570 LIN Faxback System: (714) 372-3848 World Wide Web: www.linfinity.com Copyright © 1997 Rev. 1.0 12/97 1