Materials Analysis

Environmental Management and Materials Information
Product Content Information for: MAX3674ECM+
Links
Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
Qualifications Top
Lead−Free Qualified
Yes
REACH
Yes: 2011−06−20
RoHS Qualified
Yes
Starting Date Code: 1146+
Green
Moisture Sensitivity Level
L1
Flammability Meets UL−94 (V−0 Rating)
Yes
Assembler Qualified
Carsem S
Package Description Top
Package Code
C48+3
Package Type
TQFP
Package Description
Thin Quad Flatpack
Package Option
Standard
Footprint Area (mm2)
84.6
Body Size
7x7x1.4 mm
Pin Count
48
Unit Weight in Grams
0.20813
Chemical Composition Summary Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance
CAS
Number
Aluminum (Al)
7429−90−5
0
0
Antimony (Sb2O3)
1309−64−4
0
0
0
0
0
0
BCB Resin
Bromine (Br)
7726−95−6
Amount
(grams)
% of
Unit Weight
1
Carbon (C)
7440−44−0
0
0
Carbon Black
1333−86−4
0
0
Ceramic (BaTiO3)
12047−27−7
0
0
Chromium (Cr)
7440−47−3
0
0
Cobalt (Co)
7440−48−4
0
0
Copper (Cu)
7440−50−8
0.06911
33.20521
Gold (Au)
7440−57−5
0.00255
1.22520
Indium (In)
7440−74−6
0
0
0
0
2e−05
0.00961
Insulator (Polyimide)
Iron (Fe)
7439−89−6
FeO2
12411−15−36
0
0
Lead (Pb)
7439−92−1
0
0
Magnesium (Mg)
7439−95−4
0.00011
0.05285
Manganese (Mn)
7439−96−5
0
0
0
0
0.00188
0.90328
NiPdAu
0
0
Nickel−V (NiV)
0
0
MnO3
Nickel (Ni)
7440−02−0
Palladium (Pd)
7440−05−3
0
0
Phosphorus (P)
7723−14−0
0
0
Silica (SiO2)
11126−22−0
0.09672
46.47096
Silicon (Si)
7440−21−3
0.015
7.20703
Silver (Ag)
7440−22−4
0.00162
0.77836
Solder Mask
0
0
Solder Paste
0
0
Spheron Polymer Passivation
0
0
Sulfur (S)
7704−34−9
0
0
Tin (Sn)
7440−31−5
0.00384
1.84500
Titanium (Ti)
7440−32−6
0
0
0
0
Titanium−W (TiW)
Tungsten (W)
7440−33−7
0
0
Vanadium (V)
7440−62−2
0
0
Zinc (Zn)
7440−66−6
2e−05
0.00961
ZnO
1314−13−2
0
0
Zirconium (Zr)
7440−67−7
0
0
Detailed Package Component Data Top
2
Bond Wire Components
Summary
Component Weight
0.00255
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au)
0.00255
100.00000
1.22520
0
0
0
Aluminum (Al)
Die Attach Epoxy Components
Summary
Die Attach Material
Loctite QMI519
Component Weight
0.00106
% of
Component Weight
% of
Unit Weight
0
0
0
0
0
0
15.09434
0.07688
Functionalized Ester
0
0
Functionalized Urethane
0
0
0
0
0
0
0
0
Polymeric
0
0
Polyoxypropylenediamine
0
0
0
0
0
0.0009
84.90566
0.43242
0
0
0
0
0
Substance
Amount
(grams)
Aromatic Amine
Copper (Cu)
0
Diester
Epoxy
Indium (In)
0.00016
0
Lactone
Lead (Pb)
Resin
Silver Filler (Ag)
Tin (Sn)
0
Other
Lead Finish/Plating Components
Summary
Lead Finish Plating
100% Tin
Assembly Lead Finish Process
Component Weight
Substance
Lead (Pb)
0.00384
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0
0
0
3
Tin (Sn)
0.00384
100.00000
1.84500
NiPdAu
0
0
0
Gold (Au)
0
0
0
Nickel (Ni)
0
0
0
Lead Frame Components
Summary
Lead Frame Material
Copper C7025
Component Weight
0.07186
% of
Component Weight
% of
Unit Weight
Aluminum (Al)
0
0
Carbon (C)
0
0
0
0
0
0
96.17311
33.20521
0
0
0.02783
0.00961
0
0
0.15308
0.05285
0
0
2.61620
0.90328
Palladium (Pd)
0
0
Phosphorus (P)
0
0
Silicon (Si)
0
0
1.00195
0.34594
Sulfur (S)
0
0
Tin (Sn)
0
0
2e−05
0.02783
0.00961
0
0
0
Substance
Chromium (Cr)
Amount
(grams)
ND
Cobalt (Co)
Copper (Cu)
0.06911
Gold (Au)
Iron (Fe)
2e−05
Lead (Pb)
Magnesium (Mg)
0.00011
Manganese (Mn)
Nickel (Ni)
Silver (Ag)
Zinc (Zn)
Zirconium (Zr)
0.00188
0.00072
Mold Compound Components
Summary
Mold Material
Sumitomo G700L
Resin Type
Multi−Functional
Component Weight
Substance
0.11382
Amount
(grams)
% of
Component Weight
% of
Unit Weight
4
Antimony (Sb2O3)
ND
0
0
Bromine (Br)
ND
0
0
Carbon Black
0
0
Epoxy
0
0
Epoxy Cresol Novolac
0
0
Metal Hydroxide
0
0
Phenol Novolac
0
0
0.09672
84.97628
46.47096
0.0171
15.02372
8.21602
0
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0.015
100
7.20703
Silica (SiO2)
Resin
Other
Silicon Chip Components
Substance
Silicon Chip
Substrate Components
Summary
Substrate Weight
Substrate Material
0
Substrate Core Material
0
Bromine−Free
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Copper
0
0
0
Gold
0
0
0
Nickel
0
0
0
Substrate Core Material
0
0
0
Solder Mask
0
0
0
Triazol
0
0
Other
0
0
Substance
5
Notes:
1.
Lead Form: GW − Gull Wing, TH − Through Hole.
2.
Refer to product data sheet to confirm actual wire diameter.
3.
'ND' means None Detected, negligible amount present.
+
Existing inventory of non Halogen−free product will be sold first. Halogen−free product is
identified by date code only. If you need to confirm delivery of Halogen−free product, please
contact Customer Service.
This part is qualified as lead−free.
Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer
makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website
contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC
methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for
particular package types qualified as lead−free or in the qualification process).
This report was generated on 2012−01−23. For additional information, please visit the
Maxim/Dallas Environmental Management and Materials Information website located at:
http://www.maxim−ic.com/emmi
6