Materials Analysis

Environmental Management and Materials Information
Product Content Information for: DS3100GN+
Links
Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
Qualifications Top
Lead−Free Qualified
Yes
REACH
Yes: 20−Jun−11
RoHS Qualified
Yes
Green
No
Moisture Sensitivity Level
L3
Flammability Meets UL−94 (V−0 Rating)
Yes
Assembler Qualified
ATP
Package Description Top
Package Code
X256+3
Package Type
CSBGA
Package Description
Chip−Scale Ball−Grid Array
Package Option
Standard
Footprint Area (mm2)
289
Body Size
669
Pin Count
256
Unit Weight in Grams
0.634137
Chemical Composition Summary Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance
CAS
Number
Aluminum (Al)
7429−90−5
0
0
Antimony (Sb2O3)
1309−64−4
0.0017
0.26808
0
0
0.001
0.15769
BCB Resin
Bromine (Br)
7726−95−6
Amount
(grams)
% of
Unit Weight
1
Carbon (C)
7440−44−0
0
0
Carbon Black
1333−86−4
0
0
Ceramic (BaTiO3)
12047−27−7
0
0
Chromium (Cr)
7440−47−3
0
0
Cobalt (Co)
7440−48−4
0
0
Copper (Cu)
7440−50−8
0.0339
5.34585
Gold (Au)
7440−57−5
0.008136834
1.28314
Indium (In)
7440−74−6
0
0
0
0
Insulator (Polyimide)
Iron (Fe)
7439−89−6
0
0
FeO2
12411−15−36
0
0
Lead (Pb)
7439−92−1
0
0
Magnesium (Mg)
7439−95−4
0
0
Manganese (Mn)
7439−96−5
0
0
0
0
0.0104
1.64002
NiPdAu
0
0
Nickel−V (NiV)
0
0
MnO3
Nickel (Ni)
7440−02−0
Palladium (Pd)
7440−05−3
0
0
Phosphorus (P)
7723−14−0
0
0
Silica (SiO2)
11126−22−0
0.2931
46.22030
Silicon (Si)
7440−21−3
0.05
7.88473
Silver (Ag)
7440−22−4
0.0104
1.64002
Solder Mask
0.0289
4.55737
Solder Paste
0
0
Spheron Polymer Passivation
0
0
Sulfur (S)
7704−34−9
0
0
Tin (Sn)
7440−31−5
0.0983
15.50138
Titanium (Ti)
7440−32−6
0
0
0
0
Titanium−W (TiW)
Tungsten (W)
7440−33−7
0
0
Vanadium (V)
7440−62−2
0
0
Zinc (Zn)
7440−66−6
0
0
ZnO
1314−13−2
0
0
Zirconium (Zr)
7440−67−7
0
0
Detailed Package Component Data Top
2
Bond Wire Components
Summary
Component Weight
0.006336834
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au)
0.006336834
100.00000
0.99928
0
0
0
Aluminum (Al)
Die Attach Epoxy Components
Summary
Die Attach Material
Component Weight
Substance
0.0081
Amount
(grams)
Aromatic Amine
% of
Component Weight
% of
Unit Weight
0
0
Copper (Cu)
0
0
0
Diester
0
0
0
Epoxy
0.0018
22.22222
0.28385
Functionalized Ester
0
0
0
Functionalized Urethane
0
0
0
Indium (In)
0
0
0
Lactone
0
0
0
Lead (Pb)
0
0
0
0
0
0
0
0
0
0.0063
77.77778
0.99348
Tin (Sn)
0
0
0
Other
0
0
0
Polymeric
Polyoxypropylenediamine
0
Resin
Silver Filler (Ag)
Mold Compound Components
Summary
Mold Material
Resin Type
Component Weight
Substance
Antimony (Sb2O3)
0.3396
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0.0017
0.50059
0.26808
3
Bromine (Br)
0.0010
0.29446
0.15769
0
0
0
0
Epoxy Cresol Novolac
0
0
Metal Hydroxide
0
0
Phenol Novolac
0
0
Carbon Black
Epoxy
0
Silica (SiO2)
0.2931
86.30742
46.22030
Resin
0.0438
12.89753
6.90702
0
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0.0500
100
7.88473
Other
Silicon Chip Components
Substance
Silicon Chip
Solder Ball Components
Summary
Component Weight
Substance
Copper (Cu)
0.1029
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0.0005
0.48591
0.07885
0
0
Lead (Pb)
Nickel (Ni)
0
0
0
Silver (Ag)
0.0041
3.98445
0.64655
Tin (Sn)
0.0983
95.52964
15.50138
Substrate Components
Summary
Substrate Weight
0.1272
Substrate Material
CCL−HL832 (BT)
Substrate Core Material
Bromine−Free
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Copper
0.0334
26.25786
5.26700
Gold
0.0018
1.41509
0.28385
Nickel
0.0104
8.17610
1.64002
Substrate Core Material
0.0527
41.43082
8.31051
Substance
4
Solder Mask
Triazol
Other
0.0289
22.72013
4.55737
0
0
0
0
0
5
Notes:
1.
Lead Form: GW − Gull Wing, TH − Through Hole.
2.
Refer to product data sheet to confirm actual wire diameter.
3.
'ND' means None Detected, negligible amount present.
This part is qualified as lead−free.
Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer
makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website
contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC
methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for
particular package types qualified as lead−free or in the qualification process).
This report was generated on 2012−01−23. For additional information, please visit the
Maxim/Dallas Environmental Management and Materials Information website located at:
http://www.maxim−ic.com/emmi
6