Environmental Management and Materials Information Product Content Information for: DS3102GN+ Links Qualifications Package Description Chemical Composition Summary Detailed Package Component Data Qualifications Top Lead−Free Qualified Yes REACH Yes: 20−Jun−11 RoHS Qualified Yes Green No Moisture Sensitivity Level L3 Flammability Meets UL−94 (V−0 Rating) Yes Assembler Qualified SCS Package Description Top Package Code X81+1 Package Type CSBGA Package Description Chip−Scale Ball−Grid Array Package Option Standard Footprint Area (mm2) 100 Body Size 394 Pin Count 81 Unit Weight in Grams 0.327746 Chemical Composition Summary Top Maxim NIA/NIU Substance List (PDF, 24k) Substance CAS Number Aluminum (Al) 7429−90−5 0 0 Antimony (Sb2O3) 1309−64−4 0 0 0 0 0 0 BCB Resin Bromine (Br) 7726−95−6 Amount (grams) % of Unit Weight 1 Carbon (C) 7440−44−0 0 0 Carbon Black 1333−86−4 0.000344 0.10496 Ceramic (BaTiO3) 12047−27−7 0 0 Chromium (Cr) 7440−47−3 0 0 Cobalt (Co) 7440−48−4 0 0 Copper (Cu) 7440−50−8 0.007264 2.21635 Gold (Au) 7440−57−5 0.001352 0.41251 Indium (In) 7440−74−6 0 0 0 0 Insulator (Polyimide) Iron (Fe) 7439−89−6 0 0 FeO2 12411−15−36 0 0 Lead (Pb) 7439−92−1 0 0 Magnesium (Mg) 7439−95−4 0 0 Manganese (Mn) 7439−96−5 0 0 0 0 0.00062 0.18917 NiPdAu 0 0 Nickel−V (NiV) 0 0 MnO3 Nickel (Ni) 7440−02−0 Palladium (Pd) 7440−05−3 0 0 Phosphorus (P) 7723−14−0 0 0 Silica (SiO2) 11126−22−0 0.098812 30.14896 Silicon (Si) 7440−21−3 0.013692 4.17763 Silver (Ag) 7440−22−4 0.077818 23.74339 Solder Mask 0.014884 4.54132 Solder Paste 0 0 Spheron Polymer Passivation 0 0 Sulfur (S) 7704−34−9 0 0 Tin (Sn) 7440−31−5 0.065444 19.96790 Titanium (Ti) 7440−32−6 0 0 0 0 Titanium−W (TiW) Tungsten (W) 7440−33−7 0 0 Vanadium (V) 7440−62−2 0 0 Zinc (Zn) 7440−66−6 0 0 ZnO 1314−13−2 0 0 Zirconium (Zr) 7440−67−7 0 0 Detailed Package Component Data Top 2 Bond Wire Components Summary Component Weight 0.0013 Substance Amount (grams) % of Component Weight % of Unit Weight Gold (Au) 0.001300 100.00000 0.39665 0 0 0 Aluminum (Al) Die Attach Epoxy Components Summary Die Attach Material Component Weight Substance 0.078626 Amount (grams) Aromatic Amine % of Component Weight % of Unit Weight 0 0 Copper (Cu) 0 0 0 Diester 0 0 0 Epoxy 0.002843 3.61585 0.86744 Functionalized Ester 0 0 0 Functionalized Urethane 0 0 0 Indium (In) 0 0 0 Lactone 0 0 0 Lead (Pb) 0 0 0 0 0 0 0 0 0 0.075783 96.38415 23.12248 Tin (Sn) 0 0 0 Other 0 0 0 Polymeric Polyoxypropylenediamine 0 Resin Silver Filler (Ag) Mold Compound Components Summary Mold Material Resin Type Epoxy &Phenol Component Weight Substance Antimony (Sb2O3) 0.114631 Amount (grams) % of Component Weight % of Unit Weight 0 0 3 Bromine (Br) Carbon Black Epoxy 0 0 0.000344 0.30009 0.10496 0 0 0 0 0 1.49959 0.52449 0 0 Epoxy Cresol Novolac Metal Hydroxide 0.001719 Phenol Novolac Silica (SiO2) 0.098812 86.20007 30.14896 Resin 0.013756 12.00024 4.19715 0 0 Other Silicon Chip Components Substance Amount (grams) % of Component Weight % of Unit Weight Silicon Chip 0.013692 100 4.17763 Solder Ball Components Summary Component Weight 0.067818 Substance Amount (grams) % of Component Weight % of Unit Weight Copper (Cu) 0.000339 0.49987 0.10343 0 0 Lead (Pb) Nickel (Ni) 0 0 0 Silver (Ag) 0.002035 3.00068 0.62091 Tin (Sn) 0.065444 96.49945 19.96790 Substrate Components Summary Substrate Weight 0.05168 Substrate Material PCB, BT 2 layers Substrate Core Material Bromine−Free N Substance Amount (grams) % of Component Weight % of Unit Weight Copper 0.006925 13.39977 2.11292 Gold 0.000052 0.10062 0.01587 Nickel 0.000620 1.19969 0.18917 Substrate Core Material 0.029199 56.49961 8.90903 4 Solder Mask Triazol Other 0.014884 28.80031 4.54132 0 0 0 0 0 5 Notes: 1. Lead Form: GW − Gull Wing, TH − Through Hole. 2. Refer to product data sheet to confirm actual wire diameter. 3. 'ND' means None Detected, negligible amount present. This part is qualified as lead−free. Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for particular package types qualified as lead−free or in the qualification process). This report was generated on 2012−01−23. For additional information, please visit the Maxim/Dallas Environmental Management and Materials Information website located at: http://www.maxim−ic.com/emmi 6