Materials Analysis

Environmental Management and Materials Information
Product Content Information for: MAX9450EHJ+
Links
Qualifications
Package Description
Chemical Composition Summary
Detailed Package Component Data
Qualifications Top
Lead−Free Qualified
Yes
REACH
Yes: 2011−06−20
RoHS Qualified
Yes
Starting Date Code: 0546+
Green
Moisture Sensitivity Level
L1
Flammability Meets UL−94 (V−0 Rating)
Yes
Assembler Qualified
ATP
Package Description Top
Package Code
H32E+6
Package Type
TQFP−EP
Package Description
Thin Quad Flatpack, Exposed Pad
Package Option
Exposed pad
Footprint Area (mm2)
51.8
Body Size
5x5x1.0mm
Pin Count
32
Unit Weight in Grams
0.07559
Chemical Composition Summary Top
Maxim NIA/NIU Substance List (PDF, 24k)
Substance
CAS
Number
Aluminum (Al)
7429−90−5
0
0
Antimony (Sb2O3)
1309−64−4
0
0
0
0
0
0
BCB Resin
Bromine (Br)
7726−95−6
Amount
(grams)
% of
Unit Weight
1
Carbon (C)
7440−44−0
0
0
Carbon Black
1333−86−4
0
0
Ceramic (BaTiO3)
12047−27−7
0
0
Chromium (Cr)
7440−47−3
0.0001
0.13229
Cobalt (Co)
7440−48−4
0
0
Copper (Cu)
7440−50−8
0.0256
33.86691
Gold (Au)
7440−57−5
0.0012
1.58751
Indium (In)
7440−74−6
0
0
0
0
Insulator (Polyimide)
Iron (Fe)
7439−89−6
0
0
FeO2
12411−15−36
0
0
Lead (Pb)
7439−92−1
0
0
Magnesium (Mg)
7439−95−4
0
0
Manganese (Mn)
7439−96−5
0
0
0
0
0
0
NiPdAu
0
0
Nickel−V (NiV)
0
0
MnO3
Nickel (Ni)
7440−02−0
Palladium (Pd)
7440−05−3
0
0
Phosphorus (P)
7723−14−0
0
0
Silica (SiO2)
11126−22−0
0.0319
42.20135
Silicon (Si)
7440−21−3
0.0075
9.92195
Silver (Ag)
7440−22−4
0.00264
3.49253
Solder Mask
0
0
Solder Paste
0
0
Spheron Polymer Passivation
0
0
Sulfur (S)
7704−34−9
0
0
Tin (Sn)
7440−31−5
0.0017
2.24897
Titanium (Ti)
7440−32−6
0
0
0
0
Titanium−W (TiW)
Tungsten (W)
7440−33−7
0
0
Vanadium (V)
7440−62−2
0
0
Zinc (Zn)
7440−66−6
5e−05
0.06615
ZnO
1314−13−2
0
0
Zirconium (Zr)
7440−67−7
0
0
Detailed Package Component Data Top
2
Bond Wire Components
Summary
Component Weight
0.0012
Substance
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Gold (Au)
0.0012
100.00000
1.58751
0
0
0
Aluminum (Al)
Die Attach Epoxy Components
Summary
Die Attach Material
Ablebond 8290
Component Weight
0.0026
% of
Component Weight
% of
Unit Weight
0
0
0
0
0
0
23.07692
0.79376
Functionalized Ester
0
0
Functionalized Urethane
0
0
0
0
0
0
0
0
Polymeric
0
0
Polyoxypropylenediamine
0
0
0
0
0
0.002
76.92308
2.64585
0
0
0
0
0
Substance
Amount
(grams)
Aromatic Amine
Copper (Cu)
0
Diester
Epoxy
Indium (In)
0.0006
0
Lactone
Lead (Pb)
Resin
Silver Filler (Ag)
Tin (Sn)
0
Other
Lead Finish/Plating Components
Summary
Lead Finish Plating
100% Tin
Assembly Lead Finish Process
Component Weight
Substance
Lead (Pb)
0.0017
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0
0
0
3
Tin (Sn)
0.0017
100.00000
2.24897
NiPdAu
0
0
0
Gold (Au)
0
0
0
Nickel (Ni)
0
0
0
Lead Frame Components
Summary
Lead Frame Material
Copper EFTEC64T
Component Weight
0.02639
% of
Component Weight
% of
Unit Weight
Aluminum (Al)
0
0
Carbon (C)
0
0
0.37893
0.13229
0
0
97.00644
33.86691
0
0
0
0
0
0
0
0
0
0
0
0
Palladium (Pd)
0
0
Phosphorus (P)
0
0
Silicon (Si)
0
0
2.42516
0.84667
Sulfur (S)
0
0
Tin (Sn)
0
0
5e−05
0.18947
0.06615
0
0
0
Substance
Chromium (Cr)
Amount
(grams)
0.0001
Cobalt (Co)
Copper (Cu)
0.0256
Gold (Au)
Iron (Fe)
ND
Lead (Pb)
Magnesium (Mg)
ND
Manganese (Mn)
Nickel (Ni)
Silver (Ag)
Zinc (Zn)
Zirconium (Zr)
ND
0.00064
Mold Compound Components
Summary
Mold Material
Sumitomo G700L
Resin Type
Multi−Functional
Component Weight
Substance
0.0362
Amount
(grams)
% of
Component Weight
% of
Unit Weight
4
Antimony (Sb2O3)
ND
0
0
Bromine (Br)
ND
0
0
Carbon Black
0
0
Epoxy
0
0
Epoxy Cresol Novolac
0
0
Metal Hydroxide
0
0
Phenol Novolac
0
0
Silica (SiO2)
0.0319
88.12155
42.20135
Resin
0.0043
11.87845
5.68858
0
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
0.0075
100
9.92195
Other
Silicon Chip Components
Substance
Silicon Chip
Substrate Components
Summary
Substrate Weight
Substrate Material
0
Substrate Core Material
0
Bromine−Free
0
Amount
(grams)
% of
Component Weight
% of
Unit Weight
Copper
0
0
0
Gold
0
0
0
Nickel
0
0
0
Substrate Core Material
0
0
0
Solder Mask
0
0
0
Triazol
0
0
Other
0
0
Substance
5
Notes:
1.
Lead Form: GW − Gull Wing, TH − Through Hole.
2.
Refer to product data sheet to confirm actual wire diameter.
3.
'ND' means None Detected, negligible amount present.
+
Existing inventory of non Halogen−free product will be sold first. Halogen−free product is
identified by date code only. If you need to confirm delivery of Halogen−free product, please
contact Customer Service.
This part is qualified as lead−free.
Parts qualified as lead−free can be manufactured and supplied as lead−free, if and only if, the customer
makes such requests to the Maxim Business Units for approval. The navigation bar on the EMMI website
contains information regarding the lead−free process (e.g. MSL's, Peak reflow Temperatures, JEDEC
methods, frequently asked questions and answers, lead−free package tables, and status/qualification plans for
particular package types qualified as lead−free or in the qualification process).
This report was generated on 2012−01−23. For additional information, please visit the
Maxim/Dallas Environmental Management and Materials Information website located at:
http://www.maxim−ic.com/emmi
6