Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Overview
KEMET Power Solutions (KPS) Automotive Series stacked
capacitors utilize a proprietary lead-frame technology to
vertically stack one or two multilayer ceramic chip capacitors
into a single compact surface mount package. The attached
lead-frame mechanically isolates the capacitor/s from the
printed circuit board, therefore offering advanced mechanical
and thermal stress performance. Isolation also addresses
concerns for audible, microphonic noise that may occur when
a bias voltage is applied. A two chip stack offers up to double
the capacitance in the same or smaller design footprint when
compared to traditional surface mount MLCC devices. Providing
up to 10 mm of board flex capability, KPS Series capacitors
are environmentally friendly and in compliance with RoHS
legislation. Available in X7R dielectric, these devices are
capable of Pb-Free reflow profiles and provide lower ESR, ESL
and higher ripple current capability when compared to other
dielectric solutions.
Combined with the stability of an X7R dielectric, KEMET’s KPS
Series devices exhibit a predictable change in capacitance
with respect to time and voltage and boast a minimal change in
capacitance with reference to ambient temperature. Capacitance
change is limited to ±15% from -55°C to +125°C.
KPS Series automotive grade capacitors meet the demanding
Automotive Electronics Council's AEC–Q200 qualification
requirements.
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Ordering Information
C
2220
C
106
M
5
Ceramic
Case Size
(L" x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance1
Rated Voltage
(VDC)
1210
1812
2220
C = Standard
Two significant
digits + number
of zeros
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
A = 250
R
2
Dielectric Failure Rate/Design
R = X7R
1 = KPS Single
Chip Stack
2 = KPS Double
Chip Stack
C
AUTO
Termination
Finish2
Packaging/Grade
(C-Spec)3
C = 100%
Matte Sn
AUTO = 7" Reel/
Embossed Plastic
AUTO 7289 = 13"
Reel/Embossed
Plastic
Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance.
Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.
2
Additional termination finish options may be available. Contact KEMET for details.
3
Additional reeling or packaging options may be available. Contact KEMET for details.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L"x W") and thickness dimension. See "Chip Thickness/Packaging Quantities" and
"Tape & Reel Packaging Information" sections of this document.
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information" section of this document.
3
All Automotive packaging C-Specs listed exclude packaging of laser mark components. Please contact KEMET if you require a laser marked option.
1
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding
test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These
products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This
C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without
the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist.
This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as
other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit , function, and /or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
1
Process/Product change
Obsolescence*
Days prior to
implementation
KEMET assigned1
Yes (with approval and
sign off)
Yes
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET
Automotive
C-Spec
1
PPAP (Product Part Approval Process) Level
1
2
3
4
5
KEMET
assigned1
●
●
●
●
●
AUTO
○
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Dimensions – Millimeters (Inches)
TOP VIEW
Single or Double Chip Stack
PROFILE VIEW
Double Chip Stack
Single Chip Stack
L
L
W
H
H
LW
Number EIA Size Metric Size
of Chips Code
Code
Single
Double
L Length
LW
W Width
H Height
LW Lead Width
Mounting
Technique
1210
3225
3.50 (.138) ±0.30 (.012) 2.60 (.102) ±0.30 (.012) 3.35 (.132) ±0.10 (.004) 0.80 (.032) ±0.15 (.006)
1812
4532
5.00 (.197) ±0.50 (.020) 3.50 (.138) ±0.50 (.020) 2.65 (.104) ±0.35 (.014) 1.10 (.043) ±0.30 (.012)
2220
5650
1210
3225
6.00 (.236) ±0.50 (.020) 5.00 (.197) ±0.50 (.020) 3.50 (.138) ±0.30 (.012) 1.60 (.063) ±0.30 (.012) Solder Reflow
Only
3.50 (.138) ±0.30 (.012) 2.60 (.102) ±0.30 (.012) 6.15 (.242) ±0.15 (.006) 0.80 (.031) ±0.15 (.006)
1812
4532
5.00 (.197) ±0.50 (.020) 3.50 (.138) ±0.50 (.020) 5.00 (.197) ±0.50 (.020) 1.10 (.043) ±0.30 (.012)
2220
5650
6.00 (.236) ±0.50 (.020) 5.00 (.197) ±0.50 (.020) 5.00 (.197) ±0.50 (.020) 1.60 (.063) ±0.30 (.012)
Benefits
•
•
•
•
•
•
•
•
•
AEC–Q200 automotive qualified
-55°C to +125°C operating temperature range
Reliable and robust termination system
EIA 1210, 1812, and 2220 Case sizes
DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 250 V
Capacitance offerings ranging from 0.1 μF up to 47 μF
Available capacitance tolerances of ±10% and ±20%
Higher capacitance in the same footprint
Potential board space savings
• Advanced protection against thermal and mechanical stress
• Provides up to 10 mm of board flex capability
• Reduces audible, microphonic noise
• Extremely low ESR and ESL
• Lead (Pb)-Free, RoHS and REACH compliant
• Capable of Pb-Free reflow profiles
• Non-polar device, minimizing installation concerns
• Tantalum and electrolytic alternative
Applications
Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction (piezoelectric/
mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current
limitation and any application that is subject to high levels of board flexure or temperature cycling.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Qualification/Certification
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25ºC
Insulation Resistance (IR) Limit at 25°C
-55°C to +125°C
±15%
3.0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)
See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds at 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
> 25
X7R
16/25
< 16
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
±20%
10% of Initial Limit
3.0
All
5.0
7.5
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Insulation Resistance Limit Table
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
1210
< 0.39 µF
≥ 0.39 µF
1812
< 2.2 µF
≥ 2.2 µF
2220
< 10 µF
≥ 10 µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Electrical Characteristics
Z and ESR C2220C476M3R2C
Z and ESR
C1210C475M5R1C
C1210C475M5R1C
Z and ESR
4
3
10
10
ESR
ESR
Z
Z
2
2
10
1
10
Magnitude Ohms
Magnitude Ohms
10
0
10
10
10
10
-1
0
10
10
10
-2
-3
10
0
2
10
4
10
10
6
8
10
10
10
10
-2
-4
-6
10
Frequency (Hz)
2
10
4
10
10
6
8
10
10
10
Frequency (Hz)
ESR – 1812, .10 µF, 50 V X7R
Impedance – 1812, .10 µF, 50 V X7R
ESR vs. Frequency
10
0
Impedance vs. Frequency
10000
C1812C104K5R2C (2 Chip Stack)
C1812C104K5R1C (1 Chip Stack)
C1812C104K5R2C (2 Chip Stack)
C1812C104K5R1C (1 Chip Stack)
Impedance (Ohms)
1000
100
ESR (Ohms)
1
0.1
10
1
0.1
0.01
1.E+03
1.E+04
1.E+05
1.E+06
Frequency (Hz)
1.E+07
1.E+08
0.01
1.E+03
ESR – 1210, .22 µF, 50 V X7R
1.E+05
1.E+06
Frequency (Hz)
1.E+07
1.E+08
Impedance – 1210, .22 µF, 50 V X7R
ESR vs. Frequency
10
1.E+04
C1210C224K5R2C (2 Chip Stack)
C1210C224K5R1C (1 Chip Stack)
ESR (Ohms)
0.1
C1210C224K5R2C (2 Chip Stack)
C1210C224K5R1C (1 Chip Stack)
100
Impedance (Ohms)
1
Impedance vs. Frequency
1000
10
1
0.1
0.01
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
1.E+08
0.01
1.E+03
1.E+04
Frequency (Hz)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
1.E+05
1.E+06
Frequency (Hz)
1.E+07
1.E+08
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Electrical Characteristics cont'd
Microphonics – 1210, 4.7 µF, 50 V, X7R
60
50
40
30
20
10
0
Sound Pressure (dB)
Sound Pressure (dB)
Microphonics – 2220, 22 µF, 50 V, X7R
Standard SMD MLCC
KPS - 1 Chip Stack
0
5
Vp-p
10
50
40
30
20
Standard SMD MLCC
KPS - 2 Chip Stack
10
0
0
15
50
40
30
20
Standard SMD MLCC
KPS - 2 Chip Stack
10
0
0
5
10
Vp-p
15
4
Vp-p
6
Microphonics – 1210, 22 µF, 25 V, X7R
Sound Pressure (dB)
Sound Pressure (dB)
Microphonics – 2220, 47 µF, 25 V, X7R
2
50
40
30
20
Standard SMD MLCC
KPS - 2 Chip Stack
10
0
0
20
2
Vp-p
4
6
Competitive Comparision
60
50
40
30
20
10
0
Ripple Current (Arms) 2220, 22 µF, 50 V
Absolute Temperature (C)
Sound Pressure (dB)
Microphonics – 1210, 4.7 µF, 50 V, X7R
Competitor
KEMET - KPS
0
5
Vp-p
10
15
120
100
80
60
40
KEMET KPS, 2220, 22µF, 50V rated (2 Chip Stack)
20
Competitor 2220, 22µF, 50V rated (2 Chip Stack)
0
0
10
20
Ripple Current (Arms)
30
Note: Refer to Table 4 for test method.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Electrical Characteristics cont'd
Board Flex vs. Termination Type
Board Flex vs. Termination Type
Weibull
X7R 1210 10 uF – (22uF KPS Stacked)
2
Percent
80
70
60
50
40
30
20
80
70
60
50
40
30
20
10
10
1.5
1.0
2.0
3.0
4.0
Board Flexure (mm)
6.0
5.0
1.0
7. 0 8.0 9.0 10.0
2
1.5
0
3.
2.0
0
4.
0
5.
0
6.
Board Flexure (mm)
Board Flexure to 10 mm
0
0
7. 8. 9.0 10.0
Board Flexure to 10 mm
Weibull
X7R 1210 4.7 uF 50V
2
90
80
70
60
50
40
30
Weibull
X7R 1812 47uF 16V
90
20
Percent
Percent
Standard Termination
KPS – 2 Chip Stack
90
Standard Termination
KPS – 2 Chip Stack
90
Percent
Weibull
X7R 2220 22uF 25V – (47uF KPS Stacked)
2
10
80
70
60
50
40
30
20
10
0
1.
5
1.
0
2.
0
3.
0
4.
0
5.
0
6.
0
7.
0 0 0
8. 9. 10.
Board Flexure (mm)
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Board Flexure (mm)
10
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
1
A
16
250
5
100
3
50
4
25
A
250
50
1
100
25
5
Case Size/Series
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
UD
UD
UD
UD
UD
UD
UD
UD
UD
UD
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
UD
UD
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
250
UD
UD
UD
100
UD
UD
UD
UD
50
GP
GP
GP
GP
GP
GP
GP
25
GP
GP
GP
GP
GP
GP
GP
GP
16
8
Double Chip Stack
GP
GP
GP
GP
GP
GP
GP
GP
250
Voltage Code
FV
100
Rated Voltage (VDC)
FV
FV
FV
FV
50
FW
FW
FW
FW
FW
FW
FW
FW
FW
FV
FV
FV
FV
FV
FV
FV
25
FW
FW
FW
FW
FW
FW
FW
FW
FW
FV
FV
FV
FV
FV
FV
FV
FV
16
M
M
M
M
M
M
M
M
M
M
M
Single Chip Stack
250
FV
FV
FV
FV
FV
FV
FV
FV
100
FV
FV
FV
FV
FV
FV
FV
FV
50
Capacitance
Cap
Code
3
25
104
224
474
105
225
335
475
106
226
336
476
K
K
K
K
K
K
K
K
K
K
4
16
0.10 µF
0.22 µF
0.47 µF
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
22 µF
33 µF
47 µF
M
M
M
M
M
M
M
M
M
M
10
104
224
474
105
225
335
475
106
156
226
A
C2220C
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
0.10 µF
0.22 µF
0.47 µF
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
15 µF
22 µF
1
50
5
25
3
16
4
250
8
C1812C
100
Voltage Code
Rated Voltage (VDC)
16
Cap
Code
C1210C
10
Capacitance
Case Size/Series
4
3
5
1
A
4
3
5
1
A
4
3
5
1
A
C1210C
C1812C
JR
JR
JR
JR
JR
JR
UD
C2220C
UD = Under development
These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts.
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
FV
FW
GP
GR
JP
JR
1210
1210
1812
1812
2220
2220
3.35 ± 0.10
6.15 ± 0.15
2.65 ± 0.35
5.00 ± 0.50
3.50 ± 0.30
5.00 ± 0.50
0
0
0
0
0
0
0
0
0
0
0
0
600
300
500
400
300
200
2,000
1,000
2,000
1,700
1,300
800
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Table 3 – KPS Land Pattern Design Recommendations (mm)
EIA SIZE
CODE
METRIC
SIZE
CODE
1210
V1
Median (Nominal) Land Protrusion
C
Y
X
V1
V2
3225
1.50
1.14
1.75
5.05
3.40
1812
4532
2.20
1.35
2.87
6.70
4.50
2220
5650
2.69
2.08
4.78
7.70
6.00
Y
Image at right based on an EIA 1210 case size.
Y
X
X
C
C
V2
Grid Placement Courtyard
Soldering Process
To prevent degradation of temperature cycling capability, care
must be taken to prevent solder from flowing into the inner side
of the lead frames (inner side of "J" lead in contact with the
circuit board).
After soldering, the capacitors should be air cooled to room
temperature before further processing. Forced air cooling is not
recommended.
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be taken
to avoid contact of the soldering iron to the capacitor body. The
iron should be used to heat the solder pad, applying solder
between the pad and the lead, until reflow occurs. Once reflow
occurs, the iron should be removed immediately. (Preheating is
required when hand soldering to avoid thermal shock.)
Profile Feature
SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (TSmax)
150°C
200°C
Time (ts) from Tsmin to Tsmax)
60 – 120 seconds
60 – 120 seconds
Ramp-up Rate (TL to TP)
3°C/seconds maximum
3°C/seconds maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
Time within 5°C of Maximum
Peak Temperature (tP)
Ramp-down Rate (TP to TL)
235°C
250°C
20 seconds maximum
10 seconds maximum
6°C/seconds maximum
6°C/seconds maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
TP
TL
Temperature
KEMET’s KPS Series devices are compatible with IR reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended profile
conditions for IR reflow reflect the profile conditions of the
IPC/J–STD–020D standard for moisture sensitivity testing.
tP
Maximum Ramp Up Rate = 3ºC/seconds
Maximum Ramp Down Rate = 6ºC/seconds
tL
Tsmax
Tsmin
25
tS
25ºC to Peak
Time
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3)
Leadframe
(Phosphor Bronze - Alloy 510)
Leadframe Attach
(High Melting Point Solder)
Inner Electrodes
(Ni)
Base Metal
(Cu)
Dielectric Material
(BaTiO3)
Termination Finish
(Sn)
Base Metal
(Cu)
Barrier Layer
(Ni)
Barrier Layer
(Ni)
Termination Finish
(Sn)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Product Marking
Laser marking option is not available on:
•
•
•
•
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Table 4 – Carrier Tape Configuration – Embossed Plastic (mm)
EIA Case Size
Tape Size (W)*
Pitch (P1)*
01005 – 0402
8
2
0603 – 1210
8
4
1805 – 1808
12
4
≥ 1812
12
8
KPS 1210
12
8
KPS 1812 & 2220
16
12
Array 0508 & 0612
8
4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 5 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD 1
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E1
P0
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
R Reference S1 Minimum
Note 2
Note 3
25.0
(0.984)
2.0 ±0.05
0.600
(0.079 ±0.002)
(0.024)
30
(1.181)
P2
T
Maximum
T1
Maximum
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ± 0.05
12.0 ± 0.10
(0.138 ± 0.002) (0.157 ± 0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8,12
16 – 200
Bo
Maximum
Rotation (
20
10
°
T)
Typical Component Centerline
Ao
Figure 3 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
°
s
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 56
10
72 – 200
5
°
S)
Figure 4 – Bending Radius
Embossed
Carrier
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 5 – Reel Dimensions
Full Radius,
See Note
W3 (Includes
Access Hole at
Slot Location
(Ø 40 mm minimum)
flange distortion
at outer edge)
W2 (Measured at hub)
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
W1 (Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape width
without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 7 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Sasso Marconi, Italy
Tel: 39-051-939111
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Skopje, Macedonia
Tel: 389-2-55-14-623
Shenzhen, China
Tel: 86-755-2518-1306
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Kamen, Germany
Tel: 49-2307-438110
North America
Northern Europe
Harlow, United Kingdom
Tel: 44-1279-460122
Taipei, Taiwan
Tel: 886-2-27528585
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Tel: 358-9-5406-5000
Southeast Asia
Singapore
Tel: 65-6701-8033
2835 KEMET Way
Simpsonville, SC 29681
Southeast
Lake Mary, FL
Tel: 407-855-8886
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Tel: 978-658-1663
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Novi, MI
Tel: 248-306-9353
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Tel: 86-10-5877-1075
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Tel: 86-21-6447-0707
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Tel: 82-2-6294-0550
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Tel: 60-4-6430200
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Tel: 91-806-53-76817
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1021_X7R_KPS_AUTO_SMD • 3/4/2015
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