FT-CAP (Ultra-Stable X8R

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R
Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic
Capacitor in Ultra-Stable X8R dielectric incorporates a unique,
flexible termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy is
utilized between the base metal and nickel barrier layers of
KEMET’s standard termination system in order to establish
pliability while maintaining terminal strength, solderability and
electrical performance. This technology was developed in order
to address the primary failure mode of MLCCs– flex cracks,
which are typically the result of excessive tensile and shear
stresses produced during board flexure and thermal cycling.
Flexible termination technology inhibits the transfer of board
stress to the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures.
Combined with the stability of KEMET’s Ultra-Stable high
temperature dielectric technology, these flex-robust devices
are RoHS Compliant, offer up to 5 mm of flex-bend capability
and feature a 150°C maximum operating temperature. UltraStable X8R dielectric offers the same temperature capability as
conventional X8R but without the capacitance loss due to applied
DC voltage. These devices exhibit no change in capacitance with
respect to voltage and boast a minimal change in capacitance
with reference to ambient temperature. They are also suitable
replacements for higher capacitance and larger footprint devices
that fail to offer capacitance stability. Capacitance change with
respect to temperature is limited to ±15% from −55°C to +150°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive Electronics
Council's AEC-Q200 qualification requirements.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide superior
flex performance over standard termination systems. FT-CAP
complements KEMET’s Open Mode, Floating Electrode (FECAP), Floating Electrode with Flexible Termination (FF-CAP),
and KEMET Power Solutions (KPS) product lines by providing a
complete portfolio of flex mitigation solutions.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
1206
Case Size Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
1
1
X
X = Flexible
Termination
104
J
3
H
A
C
AUTO
Capacitance
Code (pF)
Capacitance
Tolerance
Reated Voltage
(VDC)
Dielectric
Failure Rate/
Design
Termination
Finish1
Packaging/Grade
(C-Spec)
Two
significant
digits +
number of
zeros.
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3 = 25
5 = 50
1 = 100
H = UltraStable X8R
A = N/A
C = 100%
Matte Sn
L = SnPb (5%
Pb minimum)
See
"Packaging
C-Spec
Ordering
Options Table"
below
Additional termination finish options may be available. Contact KEMET for details. SnPb termination finish option is not available on Automotive Grade product.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)
Packaging Type
Commercial Grade1
Bulk Bag
7" Reel / Unmarked
13" Reel / Unmarked
7" Reel / Unmarked / 2 mm pitch2
13" Reel / Unmarked / 2 mm pitch2
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade3
7" Reel
13" Reel / Unmarked
7" Reel / Unmarked / 2 mm pitch2
13" Reel / Unmarked / 2 mm pitch2
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain capacitors that have
not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size
devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel Packaging
Quantities” and “Tape & Reel Packaging Information”.
3
For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more
information see “Capacitor Marking”.
1
1
Benefits
•
•
•
•
•
•
•
−55°C to +150°C operating temperature range
Superior flex performance (up to 5 mm)
Lead (Pb)-Free, RoHS and REACH compliant
EIA 0603, 0805, 1206, 1210, and 1812 case sizes
DC voltage ratings of 25 V, 50 V, and 100 V
Capacitance offerings ranging from 430 pF to 0.22 μF
Available capacitance tolerances of ±1%, ±2%, ±5%, ±10%,
and ±20%
• Extremely low ESR and ESL
•
•
•
•
•
•
High thermal stability
High ripple current capability
No capacitance change with respect to applied rated DC voltage
Non-polar device, minimizing installation concerns
Commercial & Automotive (AEC–Q200) Grades available
100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb plated termination finish option available upon request
(5% Pb minimum)
Applications
Typical applications include decoupling, bypass, filtering and transient voltage suppression in critical and safety relevant circuits without
(integrated) current limitation including those subject to high levels of board flexure or temperature cycling.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding
test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These
products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This
C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without
the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist.
This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as
other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit , function, and /or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
1
Process/Product change
Obsolescence*
Days prior to
implementation
KEMET assigned1
Yes (with approval and
sign off)
Yes
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET
Automotive
C-Spec
1
PPAP (Product Part Approval Process) Level
1
2
3
4
5
KEMET
assigned1
●
●
●
●
●
AUTO
○
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA
Size
Code
Metric
Size
Code
0603
1608
0805
B
Bandwidth
S
Separation
Minimum
1.60 (0.063) ± 0.17 (0.007) 0.80 (0.032) ± 0.15 (0.006)
0.45 (0.018) ±0.15 (0.006)
0.58 (0.023)
2012
2.00 (0.079) ± 0.30 (0.012) 1.25 (0.049) ± 0.30 (0.012)
0.50 (0.02) ±0.25 (0.010)
0.75 (0.030)
1206
3216
3.30 (0.130) ± 0.40 (0.016) 1.60 (0.063) ± 0.35 (0.013)
1210
3225
See Table 2 for
0.60 (0.024) ±0.25 (0.010)
Thickness
3.30 (0.130) ± 0.40 (0.016) 2.60 (0.102) ± 0.30 (0.012)
0.60 (0.024) ± 0.25 (0.010)
1812
4532
4.50 (0.178) ± 0.40 (0.016) 3.20 (0.126) ± 0.30 (0.012)
L
Length
W
Width
T
Thickness
0.70 (0.028) ±0.35 (0.014)
N/A
Mounting
Technique
Solder Wave
or
Solder Reflow
Solder Reflow
Only
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
1
2
3
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Minimum Limit @ 25°C
−55°C to +150°C
±15%
0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50mA)
2.5%
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120 ±5 seconds @ 25°C)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
1
2
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Ultra-Stable X8R
All
All
3.0
Capacitance
Shift
Insulation
Resistance
0.3% or ±0.25 pF 10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)
50
100
25
50
100
100
25
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ET
EF
EH
EH
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ET
ET
EH
EH
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FE
FZ
FU
FJ
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FA
FZ
FU
FM
FN
FN
FN
FN
FN
FN
FE
FA
FZ
FU
FM
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GN
Rated Voltage (VDC)
100
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ES
EF
EH
EH
50
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DS
DG
100
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DF
50
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DF
DG
25
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
100
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
1
50
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
5
25
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
1
100
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
5
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
3
25
Capacitance
Code
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
1
100
Capacitance
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
5
50
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
473
563
683
823
104
124
154
184
224
3
25
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
100,000 pF
120,000 pF
150,000 pF
180,000 pF
220,000 pF
C1812X
1
50
Capacitance Tolerance
C1210X
5
100
Rated Voltage (VDC)
C1206X
3
50
1
25
5
100
C0805X
3
50
Capacitance
Code
C0603X
Voltage Code
25
Capacitance
Case Size/Series
Voltage Code
3
5
1
3
5
1
3
5
1
3
5
1
5
1
Case Size/Series
C0603X
C0805X
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1206X
C1210X
C1812X
C1063_X8R_FT-CAP_SMD • 3/3/2016
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
CJ
DR
DD
DS
DF
DG
EQ
ER
ES
ET
EF
EH
FN
FQ
FE
FA
FZ
FU
FM
FJ
GB
GD
GH
GK
GN
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
0.80 ± 0.15
0.78 ± 0.20
0.90 ± 0.10
1.00 ± 0.20
1.10 ± 0.10
1.25 ± 0.15
0.78 ± 0.20
0.90 ± 0.20
1.00 ± 0.20
1.10 ± 0.20
1.20 ± 0.15
1.60 ± 0.20
0.78 ± 0.20
0.90 ± 0.20
1.00 ± 0.10
1.10 ± 0.15
1.25 ± 0.20
1.55 ± 0.20
1.70 ± 0.20
1.85 ± 0.20
1.00 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.60 ± 0.20
1.70 ± 0.20
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1
Plastic Quantity
7" Reel
13" Reel
7" Reel
13" Reel
7" Reel
13" Reel
7" Reel
13" Reel
4,000
0
0
0
0
0
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
15,000
0
0
0
0
0
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Paper Quantity1
0
4,000
4,000
2,500
2,500
2,500
4,000
4,000
2,500
2,500
2,500
2,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric)
case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec
N/A 2
Case Size
Packaging Quantities (pieces/unit packaging)
1
EIA (in)
Metric (mm)
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
Minimum
Maximum
50,000
1
20,000
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th
through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without
a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through
22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "Bulk Bag" packaging.
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)
EIA
Size
Code
Metric
Size
Code
0603
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0805
2012
0.99
1.44
1.66
4.47
2.71
0.89
1.24
1.56
3.57
2.11
0.79
1.04
1.46
2.42
1.81
1206
3216
1.59
1.62
2.06
5.85
3.06
1.49
1.42
1.96
4.95
2.46
1.39
1.22
1.86
4.25
2.16
1210
3225
1.59
1.62
3.01
5.90
4.01
1.49
1.42
2.91
4.95
3.41
1.39
1.22
2.81
4.25
3.11
1812
4532
2.10
1.80
3.60
7.00
4.60
2.00
1.60
3.50
6.10
4.00
1.90
1.40
3.40
5.40
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
C
V2
X
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Ramp-Up Rate (TL to TP)
Termination Finish
SnPb
100% Matte Sn
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
30 seconds maximum
Time 25°C to Peak
Temperature
TL
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
tL
Tsmax
Tsmin
tS
3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)
Ramp-Down Rate (TP to TL)
TP
Temperature
Profile Feature
25
25° C to Peak
Time
6°C/second maximum 6°C/second maximum
6 minutes maximum
8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling
JESD22 Method JA–104
1,000 cycles (−55°C to +150°C). Measurement at 24 hours +/- 4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85%RH and rated voltage. Add 100K ohm resistor. Measurement
at 24 hours +/- 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at
24 hours +/- 4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours. +/- 4 hours after test
conclusion.
−55°C/+150. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell
time – 15 minutes. Air – Air.
Biased Humidity
MIL–STD–202 Method 103
Moisture Resistance
MIL–STD–202 Method 106
Thermal Shock
MIL–STD–202 Method 107
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
Storage Life
MIL–STD–202 Method 108
150°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202 Method 204
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method 213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MIL–STD–202 Method 215
Add aqueous wash chemical, OKEM Clean or equivalent.
1,000 hours at 150°C with 2 X rated voltage applied.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Dielectric Material
(CaZrO3)
End Termination/
Barrier Layer
External Electrode
(Ni)
(Cu)
Termination Finish
(100% Matte Sn /
Epoxy Layer
SnPb - 5% Pb min)
(Ag)
Dielectric Material
(CaZrO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Capacitor Marking (Optional):
Laser marking option is not available on:
•
•
•
•
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Punched Paper
7" Reel
Pitch (P1)*
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
C-3190
C-3191
C-7081
C-7082
Packaging Type/Options
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD 1
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E1
P0
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
R Reference S1 Minimum
Note 2
Note 3
25.0
(0.984)
2.0 ±0.05
0.600
(0.079 ±0.002)
(0.024)
30
(1.181)
P2
T
Maximum
T1
Maximum
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
(0.138 ±0.002)
5.5 ±0.05
(0.217 ±0.002)
7.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.0 ±0.10
(0.315 ±0.004)
12.0 ±0.10
(0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
P2
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
G Minimum
0.10
(0.004)
Maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
T Maximum
W Maximum
A0 B 0
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
T1 Maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8,12
16 – 200
Bo
Maximum
Rotation (
20
10
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
°
s
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 56
10
72 – 200
5
°
S)
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
C1063_X8R_FT-CAP_SMD • 3/3/2016
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3 (Includes
Access Hole at
Slot Location
(Ø 40 mm minimum)
flange distortion
at outer edge)
W2 (Measured at hub)
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
W1 (Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape width
without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Sasso Marconi, Italy
Tel: 39-051-939111
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Skopje, Macedonia
Tel: 389-2-55-14-623
Shenzhen, China
Tel: 86-755-2518-1306
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Kamen, Germany
Tel: 49-2307-438110
North America
Northern Europe
Wyboston, United Kingdom
Tel: 44-1480-273082
Taipei, Taiwan
Tel: 886-2-27528585
Espoo, Finland
Tel: 358-9-5406-5000
Southeast Asia
Singapore
Tel: 65-6701-8033
2835 KEMET Way
Simpsonville, SC 29681
Northeast
Wilmington, MA
Tel: 978-658-1663
Southeast
Lake Mary, FL
Tel: 407-855-8886
Central
Novi, MI
Tel: 248-994-1030
Beijing, China
Tel: 86-10-5877-1075
Shanghai, China
Tel: 86-21-6447-0707
Seoul, South Korea
Tel: 82-2-6294-0550
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Irving, TX
Tel: 972-915-6041
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1063_X8R_FT-CAP_SMD • 3/3/2016
20