Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Open Mode capacitor in X7R dielectric is
designed to significantly minimize the probability of a low IR or
short circuit condition when forced to failure in a board stress
flex situation, thus reducing the potential for catastrophic failure.
The Open Mode capacitor may experience a drop in capacitance; however, a short is unlikely because a crack will not
typically propagate across counter electrodes within the device’s
“active area.” Since there will not be any current leakage associated with a typical Open Mode flex crack, there is no localized
heating and therefore little chance for a catastrophic and potentially costly failure event.
Driven by the demand for a more robust and reliable component, the Open Mode capacitor was designed for critical
applications where higher operating temperatures and mechanical stress are a concern. These capacitors are widely used in
automotive circuits as well as power supplies (input and output
filters) and general electronic applications.
mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex
performance over standard termination systems. When combined
with flexible termination technology these devices offer the ultimate
level of protection against a low IR or short circuit condition. Open
Mode devices compliment KEMET's Floating Electrode (FECAP) and Floating Electrode with Flexible Termination (FF-CAP)
product lines by providing a fail-safe design optimized for mid to
high range capacitance values. These devices exhibit a predictable change in capacitance with respect to time and voltage and
boast a minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from -55°C
to +125°C.
Concerned with flex cracks resulting from excessive tensile
and shear stresses produced during board flexure and thermal
cycling? These devices are available with KEMET's Flexible
termination technology which inhibits the transfer of board
stress to the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures. Although flexible termination technology does not eliminate the potential for
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
1210
J
685
K
3
R
A
C
TU
Ceramic
Case Size
(L" x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Voltage
Dielectric
Failure Rate/
Design
Termination
Finish1
Packaging/Grade
(C-Spec)2
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
R = X7R
A = N/A
C = 100%
Matte Sn
L = SnPb
(5% minimum)
See "Packaging
C-Spec
Ordering
Options Table"
below
0805
1206
1210
1812
F = Open Mode Two significant
J = Open Mode digits + number of
with Flexible
zeros
Termination
K = ±10%
M = ±20%
Additional termination finish options may be available. Contact KEMET for details.
SnPb termination finish option is not available on automotive grade product.
2
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1, 2
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type
Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag
7" Tape & Reel/Unmarked
7" Tape & Reel/Marked
Blank
TU
TM
Automotive Grade2
7" Reel
13" Reel/Punched Paper
13" Reel/Embossed Plastic
AUTO
AUTO 7411
AUTO 7210
C-Spec not required when ordering "Bulk Bag" packaging option.
The terms "Marked" and "Unmarked" pertain to laser marking option of components.
2
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L"x W") and thickness dimension. See "Chip Thickness/Packaging Quantities" and
"Tape & Reel Packaging Information" sections of this document.
2
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information" section of this document.
2
All Automotive packaging C-Specs listed exclude packaging of laser mark components. Please contact KEMET if you require a laser marked option.
1
1
Benefits
•
•
•
•
•
•
•
•
-55°C to +125°C operating temperature range
Open Mode/fail open design
Mid to high capacitance flex mitigation
Lead (Pb)-Free, RoHS and REACH compliant
EIA 0805, 1206, 1210, and 1812 case sizes
DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V
Capacitance offerings ranging from 1,000 pF to 6.8 μF
Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Commercial and Automotive (AEC–Q200) grades available
• SnPb termination finish option available upon request (5%
minimum)
• Flexible termination option available upon request
Applications
Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot be fused to open
when short circuits occur due to flex cracks. Markets include automotive applications that are directly connected to the battery and/or
involve conversion to a 42 V system and raw power input side filtering in power conversion.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding
test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These
products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This
C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without
the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist.
This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as
other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit , function, and /or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
1
Process/Product change
Obsolescence*
Days prior to
implementation
KEMET assigned1
Yes (with approval and
sign off)
Yes
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET
Automotive
C-Spec
1
PPAP (Product Part Approval Process) Level
1
2
3
4
5
KEMET
assigned1
●
●
●
●
●
AUTO
○
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
W
B
T
S
EIA
Size
Code
Metric
Size
Code
0805
2012
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
1206
3216
1210
3225
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) See Table 2 for 0.50 (0.02) ± 0.25 (.010)
Thickness 0.50 (0.02) ± 0.25 (.010)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
1812
4532
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
0.50 (0.02) ± 0.25 (.010)
0.75 (.030)
N/A
0.60 (.024) ± 0.35 (.014)
Mounting
Technique
Solder Wave or
Solder Reflow
Solder Reflow Only
Dimensions – Millimeters (Inches) – Flexible Termination
EIA
Size
Code
Metric
Size
Code
0805
2012
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
1206
3216
1210
3225
3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008) See Table 2 for 0.60 (.024) ± 0.25 (.010)
Thickness 0.60 (.024) ± 0.25 (.010)
3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)
1812
4532
4.50 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012)
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
0.50 (0.02) ± 0.25 (.010)
0.75 (.030)
0.70 (.028) ± 0.35 (.014)
N/A
Mounting
Technique
Solder Wave or
Solder Reflow
Solder Reflow Only
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance and Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
-55°C to +125°C
±15%
3.0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)
See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC
Voltage
Capacitance
Value
> 25
X7R
16/25
< 16
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
±20%
10% of Initial Limit
3.0
All
5.0
7.5
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Insulation Resistance Limit Table (X7R Dielectric)
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201
N/A
ALL
0402
< 0.012 µF
≥ 0.012 µF
0603
< 0.047 µF
≥ 0.047 µF
0805
< 0.15 µF
≥ 0.15 µF
1206
< 0.47 µF
≥ 0.47 µF
1210
< 0.39 µF
≥ 0.39 µF
1808
ALL
N/A
1812
< 2.2 µF
≥ 2.2 µF
1825
ALL
N/A
2220
< 10 µF
≥ 10 µF
2225
ALL
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes)
Capacitance
Capacitance
Code
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
2.7 µF
3.3 µF
3.9 µF
4.7 µF
6.8 µF
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
395
475
685
Capacitance
Capacitance
Code
Case Size/
Series
C0805F
C1206F
C1210F
C1812F
Voltage Code
4
3
5
1
2
4
3
5
1
2
4
3
5
1
2
3
5
1
2
Rated Voltage (VDC)
16
25
50
100
200
16
25
50
100
200
16
25
50
100
200
25
50
100
200
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GN
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GN
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GD
GF
GK
GM
GB
GB
GB
GB
GB
GB
GB
GB
GC
GF
GK
GL
GK
GK
Capacitance
Tolerance
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
K
M
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DG
DG
DG
DG
DG
DP
DP
DP
DE
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DG
DG
DG
DG
DP
DP
DG
DG
DG
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DG
DG
DG
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DG
DG
DG
DG
DE
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DG
DG
DG
DG
DG
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EG
EG
EG
EG
EG
EG
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EG
EG
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EC
EH
EC
EH
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EG
ED
EC
EC
EC
EC
EC
EG
EG
EG
EG
EG
EG
EC
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FH
FH
FJ
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FG
FH
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FG
FG
FH
FH
FJ
FM
FM
FD
FD
FD
FD
FD
FD
FG
FG
FH
FH
FJ
FR
FR
FR
FS
FD
FD
FG
FG
FH
FH
FS
FM
EH
FG
FS
FM
FS
Rated Voltage (VDC)
16
25
50
100
200
16
25
50
100
200
16
25
50
100
200
25
50
100
200
Voltage Code
4
3
5
1
2
4
3
5
1
2
4
3
5
1
2
3
5
1
2
Case Size/
Series
C0805F
C1206F
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1210F
C1812F
C1012_X7R_OPENMODE_SMD • 2/11/2015
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
DP
DE
DG
EC
ED
EG
EH
FD
FG
FH
FM
FJ
FR
FS
GB
GC
GD
GF
GK
GN
GL
GM
0805
0805
0805
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
0.90 ± 0.10*
1.00 ± 0.10
1.25 ± 0.15
0.90 ± 0.10
1.00 ± 0.10
1.60 ± 0.15
1.60 ± 0.20
0.95 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
1.85 ± 0.20
2.25 ± 0.20
2.50 ± 0.30
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.50 ± 0.10
1.60 ± 0.20
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
4,000
2,500
2,000
2,000
4,000
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
500
0
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
0805
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
12101
3225
1.50
1.60
2.90
5.60
3.90
1.40
1.40
2.80
4.70
3.30
1.30
1.20
2.70
4.00
3.00
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
1
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
0805
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.65
1.90
5.90
2.90
1.50
1.45
1.80
5.00
2.30
1.40
1.25
1.70
4.30
2.00
1210
3225
1.60
1.65
2.80
5.90
3.80
1.50
1.45
2.70
5.00
3.20
1.40
1.25
2.60
4.30
2.90
1812
4532
2.10
1.80
3.60
7.00
4.60
2.00
1.60
3.50
6.10
4.00
1.90
1.40
3.40
5.40
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
C
V2
X
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
Ramp-Up Rate (TL to TP)
Termination Finish
SnPb
100°C
150°C
60 – 120 seconds
100% Matte Sn
150°C
200°C
60 – 120 seconds
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
30 seconds maximum
Time 25°C to Peak
Temperature
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
TL
tL
Tsmax
Tsmin
tS
3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)
Ramp-Down Rate (TP to TL)
TP
Temperature
Profile Feature
25
25° C to Peak
Time
6°C/second maximum 6°C/second maximum
6 minutes maximum
8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling
JESD22 Method JA–104
Biased Humidity
MIL–STD–202 Method 103
Moisture Resistance
MIL–STD–202 Method 106
1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
Thermal Shock
MIL–STD–202 Method 107
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
Storage Life
MIL–STD–202 Method 108
150°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202 Method 204
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method 213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MIL–STD–202 Method 215
Add aqueous wash chemical, OKEM Clean or equivalent.
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Dielectric Material
Barrier Layer
(BaTiO3)
(Ni)
Termination Finish
(100% Matte Sn /
Base Metal
SnPb - 5% min)
(Cu)
Inner Electrodes
(Ni)
Base Metal
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
Base Metal
(Ni)
(Cu)
Termination Finish
(100% Matte Sn /
Epoxy Layer
SnPb - 5% min)
(Ag)
Dielectric Material
(BaTiO3)
Inner Electrodes
(Ni)
Base Metal
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Termination Finish
(100% Matte Sn /
SnPb - 5% min)
C1012_X7R_OPENMODE_SMD • 2/11/2015
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identifier(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
• X7R dielectric products in capacitance values outlined below
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
KEMET
ID
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
2-Digit
Capacitance
Code
C1012_X7R_OPENMODE_SMD • 2/11/2015
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Alpha
Character
9
A
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
0
1
2
3
4
0.1
10
10
100
1,000
10,000
B
0.11
1.1
11
110
1,100
11,000
C
0.12
12
12
120
1,200
12,000
D
0.13
13
13
130
1,300
E
0.15
15
15
150
1,500
5
6
7
8
100,000
1,000,000
10,000,000
100,000,000
110,000
1,100,000
11,000,000
110,000,000
120,000
1,200,000
12,000,000
120,000,000
13,000
130,000
1,300,000
13,000,000
130,000,000
15,000
150,000
1,500,000
15,000,000
150,000,000
160,000,000
Capacitance (pF)
F
0.16
16
16
160
1,600
16,000
160,000
1,600,000
16,000,000
G
0.18
18
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.2
20
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
22
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.3
30
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
33
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
36
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
39
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
43
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
56
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
62
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
68
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
75
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
82
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
25
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
35
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.4
40
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
45
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.5
50
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.6
60
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.7
70
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.8
80
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.9
90
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
Embossed Plastic
EIA Case Size
Tape size (W)*
7" Reel
13" Reel
Punched Paper
7" Reel
Pitch (P1)*
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
4
4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD 1
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E1
P0
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
R Reference S1 Minimum
Note 2
Note 3
25.0
(0.984)
2.0 ±0.05
0.600
(0.079 ±0.002)
(0.024)
30
(1.181)
P2
T
Maximum
T1
Maximum
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
(0.138 ±0.002)
5.5 ±0.05
(0.217 ±0.002)
7.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.0 ±0.10
(0.315 ±0.004)
12.0 ±0.10
(0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
P2
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
R Reference
Note 2
25
(0.984)
T Maximum
W Maximum
A0 B 0
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8,12
16 – 200
Bo
Maximum
Rotation (
20
10
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
°
s
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 56
10
72 – 200
5
°
S)
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
C1012_X7R_OPENMODE_SMD • 2/11/2015
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3 (Includes
Access Hole at
Slot Location
(Ø 40 mm minimum)
flange distortion
at outer edge)
W2 (Measured at hub)
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
W1 (Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape width
without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Sasso Marconi, Italy
Tel: 39-051-939111
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Skopje, Macedonia
Tel: 389-2-55-14-623
Shenzhen, China
Tel: 86-755-2518-1306
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Kamen, Germany
Tel: 49-2307-438110
North America
Northern Europe
Harlow, United Kingdom
Tel: 44-1279-460122
Taipei, Taiwan
Tel: 886-2-27528585
Espoo, Finland
Tel: 358-9-5406-5000
Southeast Asia
Singapore
Tel: 65-6701-8033
2835 KEMET Way
Simpsonville, SC 29681
Southeast
Lake Mary, FL
Tel: 407-855-8886
Northeast
Wilmington, MA
Tel: 978-658-1663
Central
Novi, MI
Tel: 248-306-9353
Beijing, China
Tel: 86-10-5877-1075
Shanghai, China
Tel: 86-21-6447-0707
Seoul, South Korea
Tel: 82-2-6294-0550
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 2/11/2015
23