3.5x2.8x1.9mm Infrared SMD LED OSI3NAS1C1A ■Features ■Outline ● High Radiant Power PLCC2 Top SMD LEDs ● 3.5x2.8x1.9mm Standard Directivity ● Superior Weather-resistance ● UV Resistant Epoxy ● Water Clear Type 1 ● Automatic Control System ● Photo Detector ● Computer I/O Peripheral 1,Anode 2,Cathode ℃ (Ta=25 ) Maximum Rating Item ■Directivity Symbol Value Unit DC Forward Current IF 100 mA Pulse Forward Current* IFP 200 mA Reverse Voltage VR 5 V Power Dissipation PD 180 mW Operating Temperature Topr -30 ~ +85 Storage Temperature Tstg -40~ +100 Lead Soldering Temperature Tsol 260 *Pulse width Max.10ms ■Electrical Anode 2 ■Applications ■Absolute Dimension ℃ ℃ ℃/5sec - Duty ratio max 1/10 ℃ (Ta=25 ) -Optical Characteristics Item Symbol Condition Min. Typ. Max. Unit DC Forward Voltage VF IF=100mA - 1.6 1.8 V DC Reverse Current IR VR=5V - - 10 µA Peak Wavelength λp IF=100mA - 850 - nm Radiant Power PO IF=100mA 27 - - mW Radiant Intensity Ie IF=100mA 30 40 - mW/Sr 50% Power Angle 2θ1/2 IF=100mA - 120 - deg *1 Tolerance of peak wavelength is +1nm *2 Tolerance of Radiant Power is +15% LED & Application Technologies 0 0 3.5x2.8x1.9mm Infrared SMD LED OSI3NAS1C1A AlGaAs LED TYPICAL ELECTRICAL/OPTICAL CHARACTERISTIC CURVES IF -V F Relative Power-IF (Pulse, tw ≦100μ s, Duty ≦1/100,Ta=25 ℃) 100 240 0 Relative Power ) A2 00 m ( fI tn1 60 er ru12 0 C dr 8 0 a w ro F4 0 0.5 1.0 2.5 2 1.5 1 0.1 3.5 3 F orw ard V oltage V f (V ) 10 100 10 1 1000 Forward Current: IF(mA) ) 2.5 V ( 2.0 f V eg 1.5 at lo V 1.0 dr a 0.5 rw oF 0 Relative Intensity-Ta Vf_Ta 4.0 A m 2.0 0 0 1 C ° @ 1.5 y t 5 i 2 s n @ e t n e I z1.0 i e l v a i t m a r l 0.5 o e R N d -25 0 50 25 100 75 -20 Ambient Temperature Ta (°C) Wavelength Characteristics 40 60 80 100 If_ T a Ta=25°C 200 100 yit sn et nI su on i m uL ev tia le R 20 0 Ambient Temperature Ta (°C) ) 160 A m ( fI 1 2 0 tn er ru 8 0 C dr a 40 w ro F 80 60 40 20 R th (J -a )= 2 5 0 ℃ /W R th (J-a )= 3 0 0 ℃ /W R th (J -a )= 3 5 0 ℃ /W 0 0 -3 0 -2 0 700 750 800 850 900 LED & Application Technologies 950 1000 0 20 40 60 80 100 A m b ie n t T e m p e ra tu re T a (°C ) 3.5x2.8x1.9mm Infrared SMD LED OSI3NAS1C1A RELIABILITY TEST REPORT CLASSIFICATION TEST ITEM TEST CONDTION OPERATION If:20mA LIFE Ta:25+5 TEST TIME=1000HRS(-24HRS,+72HRS) ENDURANCE HIGH R.H:90~95% TEMPERTURE Ta:65+5 HIGH HUMIDITY TEST TIME=240HRS(+2HRS) ℃ TEST STORAGE ℃ HIGH Ta:105+5 TEMPERTURE TEST TIME=500HRS(-24HRS,+48HRS) STORAGE ℃ LOW Ta:-55+5 TEMPERTURE TEST TIME=500HRS(-24HRS,+48HRS) STORAGE ℃~25℃~-55℃~25℃ TEMPERTURE 105 CYCLING 60min 10min 60min 10min 20cycles ENVIRONMENTAL ℃~-55℃ THERMAL 105 SHOCK 10min 10min 10cycles ℃ TEST SOLDER Ta:260+5 RESISTANCE TEST TIME=10+1sec SOLDERABILITY Ta:230+5 ℃ TEST TIME=5+1sec JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY MEASURING ITME SYMBOL CONDITIONS LUMINOUS INTENSITY IV IF=20mA FORWARD VOLTAGE VF IF=20mA FAILURE IV<0.5*INITIAL VALUE VF>1.2*INITIAL VALUE REVERSE CURRENT IR Vr=5V IR>2*SPEC LED & Application Technologies 3.5x2.8x1.9mm Infrared SMD LED OSI3NAS1C1A OPERATION LIFE TEST LUMINANCE RATE CURVE Operating Life Test(If=100mA,Ta=25degC) IV% Infrared 120% 100% 100.0% 102.0% 99.7% 97.4% 80% 60% 40% 20% 0% Time(Hours) 0 168 500 1000 *Burn-in condition: 100mA *Projection of Statistical Average Light Output Degradation Performance for LED Technology Extrapolated from OptoSupply QA Dept. Test Data. *According to OptoSupply outgoing Packaged Products Specification *MTBF:50,000hrs, 90% Confidence (A Failure is Any LED Which is Open, shorted or fails to Emit Light) *The Projected Data is Base on The Feature of LED Itself Under Normal Operation Conditions. *Any Improper Circuit Design or External Factors Might Cause a Different Result. LED & Application Technologies 3.5x2.8x1.9mm Infrared SMD LED OSI3NAS1C1A Soldering Heat Reliability : IR Reflow soldering Profile · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. · Repairing should not be done after the LEDs have been soldered. a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. LED & Application Technologies When repairing is unavoidable, 3.5x2.8x1.9mm Infrared SMD LED OSI3NAS1C1A PACKING DIMENTIONS AA A A Notes: 1. Unit: mm 2. 2000pcs/Reel LED & Application Technologies