Xeon 1 Power Infrared Emitter LED OSI3XNE1E1E VER C.2 ■Features ■Outline ● Highest luminous flux ● Super energy efficiency ● Very long operating life ● Superior ESD protection Dimension ■Applications ● Night Vision ● Camera Anode ● Outdoor./Indoor applications Unit:mm Tolerance:±0.30mm Maximum Rating Item ■Directivity (Ta=25℃) Symbol Value Unit DC Forward Current IF 1000 mA Pulse Forward Current* IFP 2000 mA Reverse Voltage VR 5 V Power Dissipation PD 1700 mW Operating Temperature Topr -30 ~ +85 ℃ Storage Temperature Tstg -40~ +100 ℃ Lead Soldering Temperature Tsol 260℃/5sec - *Pulse width Max.10ms ■Electrical 0 Duty ratio max 1/10 -Optical Characteristics ■Forward (Ta=25℃) Item Symbol Condition Min. Typ. Max. Unit DC Forward Voltage VF IF=350mA - 1.5 1.7 V DC Reverse Current 0 IR VR=5V - - 10 µA Peak Wavelength λP IF=350mA - 850 - nm Radiant Power PO IF=350mA 110 - - mW 1000 Rth(J-a)=20℃/W 800 600 2θ1/2 IF=350mA - 140 - Note: Advises please attach heat sink to use if Power Dissipation is more than 0.5W. LED & Application Technologies deg Rth(J-a)=30℃/W Rth(J-a)=40℃/W 400 200 0 0 50% Power Angle Operating Current (DC) 1200 Forward Current, IF (mA) ■Absolute Cathode 20 40 60 Ambient Temperature, TA ( ) 80 100 Xeon 1 Power Infrared Emitter LED OSI3XNE1E1E VER C.2 ■ Soldering Heat Reliability : Reflow soldering Profile · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. Solder Average ramp-up rate = 3ºC/sec. max. Preheat temperature: 150º~180ºC Preheat time = 120 sec. max. Ramp-down rate = 6ºC/sec. max. Peak temperature = 220ºC max. Time within 3ºC of actual peak temperature = 25 sec. max. Duration above 200ºC is 40 sec. max. LED & Application Technologies