W 2.8

5.6 x 3.0 x 0.8mm SMD
OSXX5630C1D
Ver.A.2
■Features
■Outline
●
Top view white LED (5.6x3.0x0.8mm)
●
Super high brightness of surface mount LED
●
Lead frame package with individual 4 pins
●
ESD protection
●
Compatible to IR reflow soldering.
Dimension
Recommended Soldering Pad Design
■Applications
●
General lighting
●
Decoration lighting
●
Indicator
■Absolute
Maximum Rating
Symbo
Item
■Directivity
(Ta=25℃)
l
Value
Unit
DC Forward Current
IF
150
mA
Pulse Forward Current*
IFP
200
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
540
mW
Operating Temperature
Topr
-30 ~ +85
Storage Temperature
Tstg
-40~ +100
Lead Soldering Temperature
Tsol
0
℃
℃
℃/10sec
260
0
-
*Pulse width Max 0.1ms, Duty ratio max 1/10
■
Electrical
-Optical
Characteristics
(Ta=25℃
(Ta=25℃)
Part Number
Color
OSW55630C1D Cool White W
OSW35630C1D
White
W
OSM75630C1D Warm White M
OSM55630C1D Warm White M
OSB55630C1D
OSG45630C1D
Blue
B
Pure Green PG
OSR55630C1D
Red
R
OSY55630C1D
Yellow
Y
VF (V)
IR(µA)
Φv(lm)
Min. Typ. Max.
Max.
Min. Typ. Max.
IF=150mA
VR=5V
■
■
■
■
■
■
■
■
2θ1/2(deg)
CRI
Max.
Typ.
Min.
CCT
Min.
Typ.
IF=150mA
2.8
3.1
3.6
10
40
-
55
8000K
-
16000K
120
70
2.8
3.1
3.6
10
45
-
60
5000K
-
6000K
120
80
2.8
3.1
3.6
10
45
-
55
3500K
-
4500K
120
80
2.8
3.1
3.6
10
40
-
55
2800K
-
3500K
120
80
2.8
3.1
3.6
10
5
-
10
455
465
470
120
-
2.8
3.1
3.6
10
25
-
35
510
515
520
120
-
1.8
2.1
2.6
10
10
-
20
620
625
630
120
-
1.8
2.1
2.6
10
10
-
20
585
590
595
120
-
Note: * Vf tolerance: ±0.05V
* Luminous flux measurement allowance is:±10%
LED & Application Technologies
http://www.optosupply.com
VER A.0
5.6 x 3.0 x 0.8mm SMD
OSXX5630C1D
Ver.A.2
■Rank
* Correspondence Table of Luminous
Luminous Flux (IF=150mA)
* Correspondence Table of Luminous Flux (IF=65mA)
Bin Code
Flux (lm)
Min
Max
1
17
19
2
19
22
3
22
25
4
25
29
5
29
33
6
33
37
*VF bin Limit (IF=150mA)
■Chromaticity
Diagram
LED & Application Technologies
http://www.optosupply.com
VER A.0
5.6 x 3.0 x 0.8mm SMD
OSXX5630C1D
Ver.A.2
*Color coordinate is derived from the CIE 1931 chromaticity.
LED & Application Technologies
http://www.optosupply.com
VER A.0
5.6 x 3.0 x 0.8mm SMD
OSXX5630C1D
Ver.A.2
■Recommended
Reflow Soldering Profile
Surface mounting condition
In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces
or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical
damages of the devices.
Soldering reflow
-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications.
-SMD LEDs are designed for reflow soldering.
-In the reflow soldering, too high temperature and too large temperature gradient such as rapid
heating/cooling may cause electrical & optical failures and damages of the devices.
-Wellypower can’t guarantee the LEDs after they have been assembled using the solder dipping method.
LED & Application Technologies
http://www.optosupply.com
VER A.0
5.6 x 3.0 x 0.8mm SMD
OSXX5630C1D
Ver.A.2
■Package
Model
Loaded Quantity: 3000pcs/Reel
Reel Part
Optosupply
Label
LED & Application Technologies
http://www.optosupply.com
VER A.0