SpeciFic applicatioNs socKets WWW.PRECIDIP.COm TEL +41 32 421 04 00 Solder tail / StaGGered DIL aNd SIL socKets [email protected] Quad-in-line sockets and staggered (zig-zag) strips are suitable for ic's with staggered double row dual-in-line type pin patterns. tecHNical speciFicatioNs (For GeNeral specs, see paGe 127) INSUL ATOR FL AmmABILIT Y Sleeve CoNtact clip (4 FiNGer) Accepted piN Ø Forces mECHANICAL LIFE Rated cUrreNt coNtact resistaNce Dielectric streNGtH Black glass filled polyester pct-Gf30-fr ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) 0.40 to 0.56 mm 2 n typ. insertion 1 n typ. withdrawal (polished steel gauge Ø 0.43 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 1’000 Vrms orderiNG iNFormatioN ROHS COmPLIANT PARTS PP PlatiNG code Sleeve Clip 87 83 tin tin flash gold 0.75 µm gold other plating on request (see page 178 for plating specs). QUad-iN-liNe socKet No. oF polessee Order Codes 64 110-PP-064-01-505101 fig. 1 Note: suitable for quad-in-line packages with 19.05 / 23.50 mm row spacing acc. to Jedec Mo-030. Quad-in-line socket layout requires 19.05 / 24.13 mm row spacing. fig. 1 StaGGered ziG-zaG strips No. oF poles A C 14* 19.005.0 Fig. 2 16 21.505.0 20 26.575.0 24 31.655.0 fig. 3 28 36.735.0 30 39.275.0 * 14-pin strips are not stackable end to end 150 P128P151.indd 150 40 52.005.0 versioNsee Order Codes left right left right left right left right left right left right left right 410-PP-214-10-001101 410-PP-214-10-002101 410-PP-216-10-001101 410-PP-216-10-002101 410-PP-220-10-001101 410-PP-220-10-002101 410-PP-224-10-001101 410-PP-224-10-002101 410-PP-228-10-001101 410-PP-228-10-002101 410-PP-230-10-001101 410-PP-230-10-002101 410-PP-240-10-001101 410-PP-240-10-002101 fig. 2 fig. 3 fig. 2 fig. 3 fig. 2 fig. 3 fig. 2 fig. 3 fig. 2 fig. 3 fig. 2 fig. 3 fig. 2 fig. 3 due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:14 SpeciFic applicatioNs socKets WWW.PRECIDIP.COm TEL +41 32 421 04 00 [email protected] Crystal, relay aNd display socKets / Solder tail partially equipped dil sockets and display sockets. tecHNical speciFicatioNs (For GeNeral specs, see paGe 127) FL AmmABILIT Y Sleeve CoNtact clip (4 FiNGer) CoNtact clip (6 FiNGer) Accepted piN Ø Forces mECHANICAL LIFE Rated cUrreNt coNtact resistaNce Dielectric streNGtH Black glass filled polyester pct-Gf30-fr ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) (series 510...504101) 0.40 to 0.56 mm 2 n typ. (0.7 n typ. 510...504101) insertion 1 n typ. (0.4 n typ. 510...504101) withdrawal (polished steel gauge Ø 0.43 mm) (6 finger: Ø 0.46 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 1’000 Vrms orderiNG iNFormatioN ROHS COmPLIANT PARTS PP PlatiNG code Sleeve Clip 87 83 tin tin flash gold 0.75 µm gold fig. 1 fig. 6 fig. 2 fig. 7 fig. 3 fig. 8 fig. 4 fig. 9 fig. 5 fig. 10 other plating on request (see page 178 for plating specs). Partially eQUipped DIL socKets dil socKets INSUL ATOR No. oF poles total equippedA Bcsee 10 / 6 10 / 8 12.6 12.6 5.08 7.6 5.08 7.6 fig. 1 110-PP-210-01-742101 fig. 2 110-PP-210-01-839101 12 14 14 16 16 16 28 28 15.2 17.7 17.7 20.3 20.3 20.3 35.5 35.5 7.62 7.62 7.62 7.62 7.62 7.62 7.62 7.62 fig. 3 fig. 4 fig. 5 fig. 6 fig. 7 fig. 8 fig. 9 fig. 10 / 6 / 4 / 8 / 4 / 8 / 8 / 14 / 16 10.1 10.1 10.1 10.1 10.1 10.1 10.1 10.1 Order Codes 110-PP-312-01-680101 110-PP-314-10-001101 110-PP-314-10-002101 110-PP-316-01-822101 110-PP-316-01-931101 110-PP-316-10-003101 110-PP-328-01-777101 110-PP-328-01-762101 other pin count and arrangement please consult Display socKets For 7 seGmeNt displays (1 or 2 diGits) fig. 11 fig. 12 No. oF polessee Order Codes 10 18 510-PP-010-01-504101 510-PP-018-01-504101 please consult for other display sockets, single or multidigits due to technical progress, all information provided is subject to change without prior notice. P128P151.indd 151 fig. 11 fig. 12 151 23.08.12 10:14 PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUicK Selector CHart PGA / BGA / PLCC WWW.PRECIDIP.COm TEL +41 32 421 04 00 [email protected] PGA 2.54 mm Grid INTERSTITIAL 1.27 mm BGA 1.27 mm PLCC 1 mm SOCKetssee page solder tail 156 161 165 173 surface mount 156161165166 169 172 solderless compliant press-fit 157 161 carrier 158 162 interconnect pin 158162165167 interconnect pin 167 169 surface mount BGa pin-adapter 166 169 154 P154P155.indd 154 due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:14 PGA / BGA / PLCC GeNeral speciFicatioNs WWW.PRECIDIP.COm TEL +41 32 421 04 00 [email protected] the values listed below are general specs applying for preci-dip pGa, BGa and plcc sockets. please see individual catalog page for additional and product specific technical data. OperatiNg temperatUre raNge Climatic categorY (IEC) OperatiNg HUmidit Y raNge ma X. worKiNg voltage -55 ... +125 °c 55/125/21 annual mean 75% 100 Vrms /150 Vdc (2.54 mm grid) preci-dip connectors designated « series preci-dip connector » are recognized by ul llc and listed under « connectors for use in data, signal, control and power applications », file nr. e174442. PacKagiNg mecHaNical cHaracteristics Min. 40 n (no displacement under axial force applied) Min. 3.3 n acc. to Mil-dtl-83734, pt 4.6.4.2 Clip reteNtioN CoNtact reteNtioN Electrical cHaracteristics INsUlatioN resistaNce betweeN aNY two adJaceNt coNtacts CapacitaNce betweeN aNY two adJaceNt coNtacts SelF iNdUctaNce per coNtact Min. 10’000 MΩ at 500 Vac Max. 1 pf (plcc max. 2 pf) Max. 2 nh • s tandard packaging for pGa, BGa and plcc sockets is tube packaging. • sMd mount sockets available on request with tape & reel packaging acc. to eia standard 481. these products are marked with the symbol: T & R Packaging the sockets withstand the following environmental tests without mechanical and electrical defects: • dry heat steady state iec 60512-11-9.11i / 60068-2-2.Bb: 125 °c, 16 h • d amp heat cyclic iec 60512-11-12.11m / 60068-2-30.db: 25/55 °c, 90 – 100 %rh, 1 cycle of 24 h • cold steady state iec 60512-11-10.11j / 60068-2-1.a: -55 °c, 2 h • thermal shock iec 60512-11-4.11d / 60068-2-14.na: -55/125 °c, 5 cycles 30 min. • sinusoidal vibrations iec 60512-6-4.6d / 60068-2-6.fc: 10 to 500 hz, 10 g, 1 octave/min., 10 cycles for each axis • shock iec 60512-6-3.6c / 60068-2-27.ea: 50 g, 11 ms, 3 shocks in three axis during the above two tests, no contact interruption >50 ns does appear. please consult www.precidip.com for availability size of tape, size of reel, number of components per reel, packing units and part numbers. pga / bga / plcc socKets ENviroNmeNtal cHaracteristics • solderability J-std-002a, test a, 245 °c, 5 s, solder alloy snag3.8cu0.7 • resistance to soldering heat J-std-020c, 260 °c, 20 s • Moisture sensitivity J-std-020c level 1 • resistance to corrosion: 1) salt spray test iec 60068-2-11.ka: 48 h 2) s ulfur dioxide (so2) test iec 60068-2-42 kc: 96 h at 25 ppm so2, 25 °c, 75 %rh 3) h ydrogen sulfide (h2s) test iec 60068-2-43 kd: 96 h at 12 ppm h2s, 25 °c, 75 %rh Solderless compliaNt Press-Fit cHaracteristics Press-Fit cHaracteristics measUred acc. to IEC 60352-5 • press-in force: • push-out force: • push-out 3rd cycle: 90 n max. (at min. hole dia.) / 65 n typ. 30 n min. (at max. hole dia.) / 50 n typ. 20 n min. (at max. hole dia.) PCB Hole DImENSIONS • 2.54 mm gridfinished hole Ø: 1 + 0.09/-0.06 mm drilled hole Ø: 1.15 ± 0.025 mm • interstitial gridfinished hole Ø: 0.7 + 0.09/-0.06 mm drilled hole Ø: 0.8 ± 0.02 mm PCB Hole PL ATING pcB surface finish hole plating • tin 5-15 µm tin over min. 25 µm copper • copper min. 25 µm copper • Gold over nickel0.05-0.2 µm gold over 2.5-5 µm nickel over min. 25 µm copper due to technical progress, all information provided is subject to change without prior notice. 155 PIN GRId ARRAy SOCKETS SOLdER TAIL / SuRFACE mOuNT WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] pin grid array sockets, standard solder version and surface mount with floating contacts. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE CONTACT CLIp (6 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Black glass filled polyester pct-Gf30-fr ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) 0.40 to 0.56 mm 0.7 n typ. insertion 0.4 n typ. withdrawal (polished steel gauge Ø 0.46 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 1’000 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdESLEEvECLIp 87 83 tin tin flash gold 0.75 µm gold DImENSIONS calculate with n1 = number of contacts in one line and n2 = characteristic size of the window a = n1x2.54 B = (n1-1)x2.54 c = (n2x2.54)-0.40 other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on pages 159 to 160. for example a 17x17 pin configuration with window and 168 contacts as shown on page 160 becomes 510-83-168-17-101101. Options: please consult for availability - pGa sockets with optional standoffs - pGa sockets with solder tails, length 4.2 mm - pGa sockets with low profile contacts and solder tails of 2.8 mm length - pGa interconnect sockets with other contact lengths. 510-PP-NNN-XX-XXX101 pGa sockets with standard solder tails, length 3.17 mm. 514-PP-NNN-XX-XXX117 pGa sockets with self-aligning sMd floating contacts. contact diameter of soldering end 0.98 mm, allowing pcB pads as small as 1.1 mm. 156 P156P173.indd 156 due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 PIN GRId ARRAy SOCKETS PRESS-FIT TERmINATIONS WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] pin grid array sockets with compliant press-fit terminations. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE CONTACT CLIp (6 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Black glass filled polyester pct-Gf30-fr ul 94V-o Bronze cusn4pb4Zn4 (c54400) Beryllium copper (c17200) 0.40 to 0.56 mm 0.7 n typ. insertion 0.4 n typ. withdrawal (polished steel gauge Ø 0.46 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 1’000 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdESLEEvECLIp 87 83 tin tin flash gold 0.75 µm gold other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on pages 159 to 160. for example a 17x17 pin configuration with window and 168 contacts as shown on page 160 becomes 546-83-168-17-101136. DImENSIONS calculate with n1 = number of contacts in one line and n2 = characteristic size of the window a = n1x2.54 B = (n1-1)x2.54 c = (n2x2.54)-0.40 pGA / bGA / pLCC SOCKETS 546-PP-NNN-XX-XXX136 pGa sockets with solderless compliant press-fit terminations for 1.5 to 2.0 mm pcB thickness. hole diameter 1 (+0.09/-0.06) mm after metallization (drill diameter 1.15±0.025 mm). 546-PP-NNN-XX-XXX135 pGa sockets with solderless compliant press-fit terminations for 2.1 to 3.2 mm pcB thickness. hole diameter 1 (+0.09/-0.06) mm after metallization (drill diameter 1.15±0.025 mm). due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 157 157 23.08.12 10:15 PIN GRId ARRAy SOCKETS INTERCONNECT pIN ANd CARRIERS WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] pin grid array sockets, interconnect pin and carriers with disposable plastic body. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE CONTACT CLIp (3 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Black glass filled polyester pct-Gf30-fr ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) 0.40 to 0.56 mm 0.8 n typ. insertion 0.4 n typ. withdrawal (polished steel gauge Ø 0.46 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 1’000 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdETERmINATIONCONNECTING pIN 10 (serie 550) 80 (serie 550) 0.25 µm gold tin 0.25 µm gold tin PP PL ATING COdESLEEvECLIp 87 (serie 614) 83 (serie 614) tin tin flash gold 0.75 µm gold DImENSIONS calculate with n1 = number of contacts in one line and n2 = characteristic size of the window other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on pages 159 to 160. for example a 17x17 pin configuration with window and 168 contacts as shown on page 160 becomes 550-10-168-17-101101. Options: please consult for availability -pGa interconnect sockets with other contact lengths -pGa carrier sockets with other contacts. a = n1x2.54 B = (n1-1)x2.54 c = (n2x2.54)-0.40 550-PP-NNN-XX-XXX101 pGa interconnect sockets with through hole solder tails and connecting pin Ø 0.47 mm. 614-PP-NNN-XX-XXX112 pGa carrier sockets with disposable plastic body. low profile ultra thin contacts with solder termination Ø 0.95 mm that requires Ø 1 mm holes in pcB. 158 P156P173.indd 158 due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 PIN GRId ARRAy SOCKETS 2.54 mm GRId / FOOTpRINTS / TOp vIEw WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] 10x10 …-064-10-051… 10x10 …-068-10-061… 10x10 …-084-10-031… 11x11 …-068-11-061… 11x11 …-073-11-061… 11x11 …-084-11-042… 11x11 …-085-11-041… 13x13 …-088-13-081… 13x13 …-100-13-062… 13x13 …-100-13-063… 13x13 …-101-13-061… 13x13 …-114-13-061… 13x13 …-121-13-061… 13x13 …-124-13-041… 13x13 …-128-13-041… 13x13 …-132-13-041… 13x13 …-144-13-041… 14x14 …-132-14-071… 14x14 …-133-14-071… 15x15 …-145-15-081… 15x15 …-149-15-063… 15x15 …-177-15-061… 15x15 …-181-15-051… 16x16 …-175-16-072… due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 159 13x13 …-114-13-062… pGA / bGA / pLCC SOCKETS 5x5 …-012-05-001… 15x15 …-176-15-061… 159 23.08.12 10:15 PIN GRId ARRAy SOCKETS 2.54 mm GRId / FOOTpRINTS / TOp vIEw WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] 17x17 …-168-17-101… 17x17 …-169-17-101… 17x17 …-192-17-081… 17x17 …-207-17-081… 17x17 …-208-17-081… 17x17 …-209-17-081… 18x18 …-179-18-111… 18x18 …-179-18-112… 18x18 …-191-18-091… 18x18 …-223-18-091… 18x18 …-224-18-091… 18x18 …-225-18-091… 19x19 …-238-19-101… 19x19 …-280-19-081… 19x19 …-281-19-081… 20x20 …-257-20-111… 20x20 …-299-20-091… 18x18 …-241-18-071… 21x21 …-273-21-121… 160 P156P173.indd 160 due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 PIN GRId ARRAy SOCKETS INTERSTITIAL / SOLdER TAIL / SuRFACE mOuNT PRESS-FIT TERmINATIONS WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] pin grid array sockets with interstitial contact rows, solder tails, surface mount floating contacts and solderless compliant. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE CONTACT CLIp (6 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Black glass filled polyester pct-Gf30-fr ul 94V-o Brass cuZn36pb3 (c36000) (Bronze cusn4pb4Zn4 (c54400) for press-fit contacts) Beryllium copper (c17200) 0.40 to 0.56 mm 0.4 n typ. insertion 0.2 n typ. withdrawal (polished steel gauge Ø 0.46 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 700 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdESLEEvECLIp 87 83 tin tin flash gold 0.75 µm gold DImENSIONS calculate with n1 = number of contacts on the external row and n2 = characteristic size of the window other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on pages 163 to 164. for example a 19x19 pin configuration with window and 296 contacts as shown on page 163 becomes 517-83-296-19-131111. Options: please consult for availability -pGa sockets with optional standoffs. a = (n1x2.54)+1.30 B = (n1-1)x2.54 c = (n2x2.54)-0.40 pGA / bGA / pLCC SOCKETS 517-PP-NNN-XX-XXX111 interstitial pGa sockets with through hole solder tails, length 3.17 mm. 514-PP-NNN-XX-XXX154 interstitial pGa sockets with self-aligning sMd floating contacts. contact diameter of soldering end 0.8 mm allowing pcB pads with 0.9 mm diameter. 546-PP-NNN-XX-XXX147 interstitial pGa sockets with solderless compliant press-fit terminations for 1.2 to 2.5 mm pcB thickness. hole diameter 0.7 (+0.07/-0.05) mm after metallization (drill diameter 0.85±0.025 mm). due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 161 161 23.08.12 10:15 PIN GRId ARRAy SOCKETS INTERSTITIAL / INTERCONNECT pIN ANd CARRIER WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] pin grid array sockets with intersitial contact rows, interconnect pin and carriers with disposable plastic body. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE / pIN CONTACT CLIp (3 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Black glass filled polyester pct-Gf30-fr ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) 0.40 to 0.56 mm 0.3 n typ. insertion 0.15 n typ. withdrawal (polished steel gauge Ø 0.46 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 700 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdETERmINATIONCONNECTING pIN 10 (serie 550) 80 (serie 550) 0.25 µm gold tin 0.25 µm gold tin PP PL ATING COdESLEEvECLIp 87 (serie 614) 83 (serie 614) tin tin flash gold 0.75 µm gold DImENSIONS calculate with n1 = number of contacts on the external row and n2 = characteristic size of the window other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on pages 163 to 164. for example a 19x19 pin configuration with window and 296 contacts as shown on page 163 becomes 550-10-296-19-131135. Options: please consult for availability -pGa pin header interconnect sockets with other contact lengths -pGa carrier sockets with other contacts. a = (n1x2.54)+1.30 B = (n1-1)x2.54 c = (n2x2.54)-0.40 550-PP-NNN-XX-XXX135 interstitial pGa interconnect sockets with through hole solder tails and connecting pin Ø 0.44 mm. 614-PP-NNN-XX-XXX144 interstitial pGa carrier sockets with disposable plastic body and low profile, ultra-thin contacts with Ø 0.84 mm that requires Ø min 0.9 mm pcB holes. 162 P156P173.indd 162 due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 PIN GRId ARRAy SOCKETS INTERSTITIAL / FOOTpRINTS / TOp vIEw WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] 14x14 …-183-14-091… 14x14 …-304-14-051… 14x14 …-365-14-000… 17x17 …-321-17-101… 17x17 …-364-17-091… 17x17 …-365-17-091… 17x17 …-545-17-000… 18x18 …-280-18-101… 18x18 …-293-18-101… 18x18 …-305-18-101… 18x18 …-325-18-111… 18x18 …-361-18-101… 18x18 …-369-18-091… 18x18 …-391-18-101… 18x18 …-431-18-091… 19x19 …-296-19-131… 19x19 …-320-19-131… 19x19 …-321-19-121… 19x19 …-370-19-121… 19x19 …-372-19-111… 19x19 …-401-19-111… due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 163 pGA / bGA / pLCC SOCKETS 16x16 …-299-16-091… 163 23.08.12 10:15 PIN GRId ARRAy SOCKETS INTERSTITIAL / FOOTpRINTS / TOp vIEw WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] 19x19 …-403-19-111… 19x19 …-419-19-111… 19x19 …-420-19-111… 19x19 …-428-19-101… 20x20 …-411-20-111… 20x20 …-447-20-121… 20x20 …-539-20-101… 20x20 …-557-20-091… 21x21 …-475-21-121… 21x21 …-528-21-121… 21x21 …-529-21-121… 21x21 …-565-21-111… 22x22 …-503-22-131… 22x22 …-559-22-131… 19x19 …-429-19-101… 19x19 …-463-19-101… 24x24 …-599-54-131… 164 P156P173.indd 164 due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 MICRO PIN GRId ARRAy SOCKETS 1.27 mm GRId / SOLdER TAIL / SuRFACE mOuNT / INTERCONNECT pIN WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] Micro pin grid array sockets (µpGa) with contacts placed on 1.27 mm grid, solder tail, surface mount and interconnect pin. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE / pIN CONTACT CLIp (6 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Glass-epoxy laminate fr4 ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) 0.30 to 0.35 mm 0.2 n typ. insertion 0.15 n typ. withdrawal (polished steel gauge Ø 0.3 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 500 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdESLEEvECLIp 77 (serie 518) flash gold flash gold PP PL ATING COdE TERmINATIONCONNECTING pIN 10 (serie 558) 0.25 µm gold 0.25 µm gold DImENSIONS calculate with n1 = number of contacts in one line and n2 = characteristic size of the window other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on page 168. for example a 26x26 pin configuration with window and 478 contacts as shown on page 168 becomes 518-77-478M26-131105. Options: please consult for availability -µpGa interconnect headers for sMd mount. a = (n1x1.27)+1.27 B = (n1-1)x1.27 c = (n2x1.27)-0.40 pGA / bGA / pLCC SOCKETS 518-77-NNNMXX-XXX105 µpGa sockets 1.27 mm grid with through hole solder tails length 2.79 mm. 518-77-NNNMXX-XXX106 µpGa sockets 1.27 mm grid, surface mount. contact diameter of soldering end 0.31 mm allowing pcB pads with 0.4 mm diameter. 558-10-NNNMXX-XXX101 µpGa 1.27 mm grid, interconnect sockets with through hole solder tail and connecting pin Ø 0.31 mm. due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 165 165 23.08.12 10:15 BALL GRId ARRAy SOCKETS 1.27 mm GRId / SuRFACE mOuNT / SOCKET ANd AdApTER WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] Ball grid array sockets and adapters, surface mount. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE / pIN CONTACT CLIp (4 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Glass-epoxy laminate fr4 ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) 0.36 to 0.46 mm 0.3 n typ. insertion 0.15 n typ. withdrawal (polished steel gauge Ø 0.43 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 500 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdESLEEvECLIp 87 (serie 514) 83 (serie 514) tin tin flash gold 0.75 µm gold PP PL ATING COdETERmINATIONCONNECTING pIN 10 (serie 550) 80 (serie 550) 0.25 µm gold tin 0.25 µm gold tin other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on page 168. for example a 20x20 pin configuration with 256 contacts as shown on page 168 becomes 514-83-256M20-001148. DImENSIONS calculate with n1 = number of contacts in one line for sockets a = (n1x1.27)+1.27 B = (n1-1)x1.27 for adapters a = (n1x1.27)+3.27 B = (n1-1)x1.27 514-PP-NNNMXX-XXX148 BGa sockets 1.27 mm grid with self-aligning surface mount floating contacts. same foot print as the BGa device, to mate with the corresponding adapter. 550-10-NNNMXX-XXX166 BGa adapter 1.27 mm grid pluggable into the corresponding socket. connecting pin Ø 0.42 mm. BGa device is sMd soldered on the solder pads. BGa socket and adapter systems are the reliable solution to make BGas pluggable: � -t he BGa socket series 514 � is soldered to the pcB in place of the BGa device and using the same footprint -the BGa device � is soldered to the adapter series 550 � -the BGa + adapter sub-assembly is plugged into the socket � 166 P156P173.indd 166 � due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 BALL GRId ARRAy SOCKETS 1.27 mm GRId / INTERCONNECT pIN / SOLdER TAIL / SuRFACE mOuNT WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] Ball grid array interconnect pin, through hole solder tail and surface mount. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y CONTACT MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Glass-epoxy laminate fr4 ul 94V-o Brass cuZn36pb3 (c36000) Min. 100 cycles 1a Max. 10 mΩ Min. 500 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdETERmINATIONCONNECTING pIN 10 0.25 µm gold 0.25 µm gold other plating on request (see page 178 for plating specs). replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated on page 168. for example a 20x20 pin configuration with 256 contacts as shown on page 168 becomes 550-10-256M20-001152. DImENSIONS calculate with n1 = number of contacts in one line a = (n1x1.27)+3.27 B = (n1-1)x1.27 pGA / bGA / pLCC SOCKETS 550-10-NNNMXX-XXX152 BGa interconnect sockets 1.27 mm grid, through hole solder tails and connecting pin Ø 0.40 mm. 558-10-NNNMXX-XXX104 BGa interconnect sockets 1.27 mm grid, with surface mount terminations and connecting pin Ø 0.41 mm. due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 167 167 23.08.12 10:15 BALL/PIN GRId ARRAy SOCKETS 1.27 mm GRId / FOOTpRINTS / TOp vIEw WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] 16x16 …-192M16-001… 16x16 …-255M16-001… 19x19 …-357M19-001… 19x19 …-360M19-001… 20x20 …-400M20-000… 26x26 …-352M26-001… 26x26 …-356M26-001… 29x29 …-480M29-001… 29x29 …-504M29-001… 31x31 …-432M31-001… 31x31 …-520M31-001… 168 P156P173.indd 168 16x16 …-256M16-000… 20x20 …-256M20-001… 17x17 …-120M17-001… 17x17 …-233M17-001… 20x20 …-272M20-001… 20x20 …-292M20-001… 23x23 …-304M23-001… 23x23 …-385M23-001… 26x26 …-388M26-001… 26x26 …-420M26-001… 26x26 …-456M26-001… 30x30 …-500M30-001… 30x30 …-576M30-001… 33x33 …-560M33-001… 35x35 …-600M35-001… 31x31 …-956M31-001… 24x24 …-575M24-001… 26x26 …-478M26-131… 35x35 …-652M35-001… due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 BALL GRId ARRAy SOCKETS 1 mm GRId / SuRFACE mOuNT SOCKET, AdApTER / INTERCONNECT pIN WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] Ball grid array sockets and adapter surface mount. TECHNICAL SpECIFICATIONS (FOR GENERAL SpECS, SEE pAGE 155) INSULATOR FLAMMABILIT Y SLEEvE / pIN CONTACT CLIp (3 FINGER) ACCEpTEd pIN Ø FORCES MECHANICAL LIFE RATEd CuRRENT CONTACT RESISTANCE DIELECTRIC STRENGTH Glass-epoxy laminate fr4 ul 94V-o Brass cuZn36pb3 (c36000) Beryllium copper (c17200) 0.20 to 0.30 mm 0.4 n typ. insertion 0.2 n typ. withdrawal (polished steel gauge Ø 0.25 mm) Min. 100 cycles 1a Max. 10 mΩ Min. 500 Vrms ORdERING INFORmATION ROHS COMPLIANT PARTS PP PL ATING COdESLEEvECLIp 11 (serie 514) 0.25 µm gold 0.25 µm gold PP PL ATING COdETERmINATIONCONNECTING pIN 10 (serie 558) 0.25 µm gold 0.25 µm gold other plating on request (see page 178 for plating specs). please consult for complete part number and available footprints. Options: please consult for availability -through hole adapter. DImENSIONS calculate with n1 = number of contacts in one line a = n1+2.81 B = n1-1 pGA / bGA / pLCC SOCKETS 514-11-NNNpXX-XXX159 BGa sockets 1 mm grid, surface mount. same foot print as the BGa device to mate with the corresponding adapter. 558-10-NNNpXX-XXX102 BGa adapter 1 mm grid, pluggable into the corresponding socket. connecting pin Ø 0.25 mm. BGa device is sMd soldered on the solder pads. 558-10-NNNpXX-XXX103 BGa interconnect sockets 1 mm grid with surface mount terminations and connecting pin Ø 0.25 mm. due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 169 169 23.08.12 10:15 BALL/PIN GRId ARRAy SOCKETS PART NumbER IdENTIFICATION WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] TypE OF SOCKET Standard PGA, Interstitial PGA and µPGA PAGE solder pin 2.54 mm grid sMd 2.54 mm grid sMd interstitial solder pin interstitial solder pin 1.27 mm grid sMd 1.27 mm grid press-fit 2.54 mm, pcB 2.1-3.2 mm press-fit 2.54 mm, pcB 1.5-2.0 mm press-fit interstitial interconnect, solder pin, 2.54 mm grid interconnect, solder pin, interstitial interconnect, solder pin, 1.27 mm grid carrier 2.54 mm grid carrier interstitial 156 156 161 161 165 165 157 157 161 158 162 165 158 162 socket sMd, 1.27 mm grid socket sMd, 1 mm grid adapter, 1.27 mm grid interconnect, solder pin, 1.27 mm grid adapter, 1 mm grid interconnect sMd, 1 mm grid interconnect sMd, 1.27 mm grid 166 169 166 167 169 169 167 510-...01 514-...34 514-...54 517-...11 518-...05 518-...06 546-...35 546-...36 546-...47 550-...01 550-...35 558-...01 614-...12 614-...44 BGA 514-...48 514-...59 550-...66 550-...52 558-...02 558-...03 558-...04 XXX – PP – NNN X XX – XXX 1 XX PLATING COdE ROHS COmpLIANT pARTS TOTAL NumbER OF pINS SIzE OF bOdy SIzE OF wINdOw ANd FOOTpRINT COdESLEEvECLIp 77 83 87 flash gold tin tin flash gold 0.75 µm gold flash gold TERmINATIONCONNECTING pIN 10 0.25 µm gold 80tin 170 P156P173.indd 170 0.25 µm gold tin Grid: ˜ ˜– 2.54 mm or interstitial M 1.27 mm grid P 1 mm grid see pages 159, 160, 163, 164 and 168 for most popular footprints. due to technical progress, all information provided is subject to change without prior notice. 23.08.12 10:15 BALL/PIN GRId ARRAy SOCKETS WWW.PRECIDIP.COMTEL +41 32 421 04 [email protected] CuSTOm GRId dESIGN if the desired footprint does not exist in this catalogue, please photocopy this page, complete it and send it to your local preci-dip distributor. your address ORdERING INFORmATION Type of socket (see opposite page) Plating code PP (see opposite page) Grid Standard 2.54 mm Interstitial 1.27 mm 1 mm Size of body TOp vIEw pGA / bGA / pLCC SOCKETS x Semiconductor device used Quantity ExAmpLE fill in the position of pins Mark of the window due to technical progress, all information provided is subject to change without prior notice. P156P173.indd 171 171 23.08.12 10:15