Preliminary Datasheet RJK5012DPP Silicon N Channel MOS FET High Speed Power Switching REJ03G1545-0200 Rev.2.00 Jun 30, 2010 Features Low on-resistance Low leakage current High speed switching Outline RENESAS Package code: PRSS0003AB-A (Package name: TO-220FN) D 1. Gate 2. Drain 3. Source G 1 2 3 S Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Body-drain diode reverse drain peak current Avalanche current Avalanche energy Channel dissipation Channel to case thermal impedance Channel temperature Storage temperature Notes: 1. 2. 3. 4. Symbol VDSS VGSS Note4 ID Note1 ID (pulse) IDR Note1 IDR (pulse) Note3 IAP Note3 EAR Pch Note2 ch-c Tch Tstg Ratings 500 30 12 24 12 24 4 0.88 30 4.17 150 –55 to +150 Unit V V A A A A A mJ W C/W C C PW 10 s, duty cycle 1% Value at Tc = 25C STch = 25C, Tch 150C Limited by maximum safe operation area REJ03G1545-0200 Rev.2.00 Jun 30, 2010 Page 1 of 6 RJK5012DPP Preliminary Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Zero gate voltage drain current Gate to source leak current Gate to source cutoff voltage Static drain to source on state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate to source charge Gate to drain charge Body-drain diode forward voltage Body-drain diode reverse recovery time Symbol V(BR)DSS IDSS IGSS VGS(off) RDS(on) Min 500 — — 3.0 — Typ — — — — 0.515 Max — 1 0.1 4.5 0.620 Unit V A A V Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd VDF — — — — — — — — — — — 1100 120 15 30 23 77 16 29 5.5 13 0.89 — — — — — — — — — — 1.50 pF pF pF ns ns ns ns nC nC nC V trr — 280 — ns Test conditions ID = 10 mA, VGS = 0 VDS = 500 V, VGS = 0 VGS = 30 V, VDS = 0 VDS = 10 V, ID = 1 mA ID = 6 A, VGS = 10 V Note5 VDS = 25 V VGS = 0 f = 1 MHz ID = 6 A VGS = 10 V RL = 41.6 Rg = 10 VDD = 400 V VGS = 10 V ID = 12 A IF = 12 A, VGS = 0 Note5 IF = 12 A, VGS = 0 diF/dt = 100 A/s Notes: 5. Pulse test REJ03G1545-0200 Rev.2.00 Jun 30, 2010 Page 2 of 6 RJK5012DPP Preliminary Main Characteristics Maximum Safe Operation Area Power vs. Temperature Derating 60 40 20 0 50 100 150 10 10 10 1 μs μs Operation in this area is limited by RDS(on) 0.01 1 1000 100 10 Case Temperature Tc (°C) Drain to Source Voltage VDS (V) Typical Output Characteristics Typical Transfer Characteristics 100 6V 7V 16 10 V 5.6 V 12 5.4 V 8 5.2 V VGS = 5 V 4 VDS = 10 V Pulse Test 50 5.8 V Drain Current ID (A) Pulse Test 20 10 5 2 1 Tc = 75°C 0.5 25°C −25°C 0.2 0.1 0 4 8 12 16 0 20 2 4 6 8 10 Drain to Source Voltage VDS (V) Gate to Source Voltage VGS (V) Static Drain to Source on State Resistance vs. Drain Current Static Drain to Source on State Resistance vs. Temperature 1 VGS = 10 V 0.5 0.2 0.1 0.05 0.02 Pulse Test 0.01 1 3 10 30 100 300 Drain Current ID (A) REJ03G1545-0200 Rev.2.00 Jun 30, 2010 1000 Static Drain to Source on State Resistance RDS(on) (Ω) Drain to Source on State Resistance RDS(on) (Ω) 0 0.1 0.001 0.1 200 20 Drain Current ID (A) Ta = 25°C s Drain Current ID (A) 100 m =1 PW shot) (1 Channel Dissipation Pch (W) 80 2.0 VGS = 10 V 1.6 1.2 ID = 12 A 3A 0.8 6A 0.4 Pulse Test 0 −25 0 25 50 75 100 125 150 Case Temperature Tc (°C) Page 3 of 6 RJK5012DPP Preliminary Typical Capacitance vs. Drain to Source Voltage Body-Drain Diode Reverse Recovery Time 10000 500 3000 Capacitance C (pF) Reverse Recovery Time trr (ns) 1000 200 100 50 20 10 5 di / dt = 100 A / μs VGS = 0, Ta = 25°C 2 3 10 30 100 Reverse Drain Current 300 300 100 Coss 30 10 IDR (A) 8 16 0 24 Gate Charge 32 40 Qg (nC) IDR (A) 4 VDD = 400 V 250 V 100 V 300 VDS (V) 20 Reverse Drain Current 8 200 0 16 12 VDS 200 Reverse Drain Current vs. Source to Drain Voltage VGS (V) VDD = 100 V 250 V 400 V 600 400 VGS 100 Drain to Source Voltage Gate to Source Voltage VDS (V) Drain to Source Voltage ID = 12 A Crss 1 0 1000 Dynamic Input Characteristics 800 Ciss 1000 3 1 1 VGS = 0 f = 1 MHz Pulse Test 16 12 10 V 8 5V 4 VGS = 0 V, −5 V 0 0.4 0.8 1.2 Source to Drain Voltage 1.6 2.0 VSD (V) Gate to Source Cutoff Voltage vs. Case Temperature Gate to Source Cutoff Voltage VGS(off) (V) 5 ID = 10 mA 4 1 mA 3 0.1 mA 2 1 VDS = 10 V 0 -25 0 25 50 75 Case Temperature REJ03G1545-0200 Rev.2.00 Jun 30, 2010 100 125 150 Tc (°C) Page 4 of 6 RJK5012DPP Preliminary Normalized Transient Thermal Impedance γs (t) Normalized Transient Thermal Impedance vs. Pulse Width 10 TC = 25°C 1 D=1 0.5 0.2 0.1 0.1 0.05 0.02 0.01 θch–c(t) = γS (t) • θch–c θch–c = 4.17°C/W, TC = 25°C PDM D = PW T PW T e uls tP 0.01 ho 1S 0.001 10 μ 100 μ 1m 10 m Pulse Width 100 m 1 10 PW (s) Switching Time Test Circuit Waveform Vout Monitor Vin Monitor 90% D.U.T. RL 10 Ω Vin 10 V VDD = 250 V Vin Vout 10% 10% 10% 90% td(on) REJ03G1545-0200 Rev.2.00 Jun 30, 2010 tr 90% td(off) tf Page 5 of 6 RJK5012DPP Preliminary Package Dimensions Package Name TO-220FN JEITA Package Code ⎯ RENESAS Code PRSS0003AB-A Previous Code T220FN MASS[Typ.] 2.0g 2.8 ± 0.2 6.5 ± 0.3 3 ± 0.3 φ3.2 ± 0.2 3.6 ± 0.3 15 ± 0.3 10 ± 0.3 14 ± 0.5 Unit: mm 1.1 ± 0.2 1.1 ± 0.2 0.75 ± 0.15 0.75 ± 0.15 4.5 ± 0.2 2.54 ± 0.25 2.6 ± 0.2 2.54 ± 0.25 Ordering Information Part No. RJK5012DPP-00-T2 Quantity 1050 pcs REJ03G1545-0200 Rev.2.00 Jun 30, 2010 Shipping Container Box (Tube) Page 6 of 6 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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