Dual-Edge & Flex-Mode Modulation Vcore

Dual-Edge & Flex-Mode Modulation Vcore Controllers
for VR11.0 to VR12.6+ Designs
Multi-phase buck controllers from ON Semiconductor combine differential voltage and current
sensing, and adaptive voltage positioning to power the latest generation of microprocessors.
Dual-edge and flex mode PWM, combined with inductor current sensing, reduces system
cost by providing the fastest initial response to a transient, thereby requiring fewer bulk
and ceramic output capacitors to satisfy transient load-line requirements. An integrated,
high performance operational error amplifier enables easy compensation of the system. The
proprietary Dynamic Reference Injection method makes the error amplifier compensation
virtually independent of the system response to VID changes, eliminating tradeoffs between
overshoot and dynamic VID performance.
Features
•Meet VR11.0, 11.1, 12.0, 12.5, 12.6, 12.6+ specifications
•Pin programmable phase count configuration
•Current mode dual edge modulation for fast initial response to transient loading
•Phase-to-phase dynamic current balancing
•Dual high performance operational error amplifier
•Temperature compensated inductor current sensing
•Power saving phase shedding
•VIN feed forward ramp slope
•Programmable switching frequency range
•Startup into pre-charged loads while avoiding false OVP
•Over voltage, under voltage, and over current protection (OVP & UVP & OCP)
Device
NCP81101
NCP81105
NCP81108
NCP81109
NCP81110
NCP81118
NCP81102
NCP81103
NCP81106
NCP81116
NCP81119
NCP6121
NCP6151
NCP6153
NCP6133
NCP4206
NCP4208
NCP81022
NCP81128
VR Spec
VR12.6+
VR12.6
VR12.6
VR12.6
VR12.6
VR12.6
VR12.5
VR12.5
VR12.5
VR12.5
VR12.5
VR12
VR12
VR11.1
VR11.1
VR11.1
VR11.1
SV12
SV12
Controller Architecture
RPM
Dual Edge
Dual Edge
RPM
RPM
Dual Edge
Dual Edge
Dual Edge
Dual Edge
Dual Edge
Dual Edge
Flex Mode + Dual Edge
Flex Mode + Dual Edge
Dual Edge
Flex Mode
Dual Edge
Dual Edge
Dual Edge
Dual Edge
CPU Phases
1
2/3
2/3
1
1
2/3
2/3/4
2/3
2/3
2/3
2/3/4
2/3
3/4
2/3/4
2/3/4
1/2/3/4/5/6
1/2/3/4/5/6/7/8
4
2
GPU Phases
—
—
—
—
—
—
—
—
—
—
—
1
1
—
—
—
—
1
2
Integrated
Drivers
1x5V
—
2
1 + FETs
1 + FETs
2x5V
—
2x5V
2 x 12 V
2 x 12 V
—
—
—
—
—
—
—
—
2x5V
Interface
SVID
SVID
SVID
SVID
SVID
SVID
SVID
SVID
SVID
SVID
SVID
SVID
SVID
PVID
PVID
PVID
PVID
SVI2
SVI2
SM-Bus
—
—
—
—
—
—
—
—
—
Y
—
—
—
—
—
Y
Y
—
—
Package
QFN-28
QFN-36
QFN-36
QFN-48
QFN-48
QFN-36
QFN-32
QFN-36
QFN-40
QFN-36
QFN-32
QFN-56
QFN-56
QFN-40
LFCSP-40
QFN-48
QFN-48
QFN-52
QFN-52
Please contact ON Semiconductor for product datasheets.
Page 2
Computing Solutions
Desktop Solutions
Server Solutions
NCP81102 1/2/3/4-phase controller
•Dual edge modulation for fast transient response
•Constant on-time for light load efficiency
•Supports all MLCC output capacitor solutions
•VR12.5 compliant
NCP4206 1/2/3/4/5/6-phase controller
•Highly efficient, multiphase, synchronous buck switching
regulator controller
•Supports PSI, to reduce the number of operating phases at
light loads
•SMBus interface enables digital programming of key system
parameters to optimize system performance and provide
feedback
•NCP4206 has built in shunt regulator, enabling it to be
powered from +12 V system supply through series resistor
+12V
NTMFS4C10N
NCP81161
12 V Driver
NTMFS4C06N
+12V
+12V
NTMFS4C10N
NCP81102
NCP81161
12 V Driver
4-Phase
Controller
NCP81161
12 V Driver
NTMFS4C06N
+12V
CPU
+12V
NCP81161
12 V Driver
NTMFS4C10N
NCP81161
12 V Driver
NTMFS4C06N
Dual FET*
+12V
+12V
NCP4206
NTMFS4C10N
NCP81161
12 V Driver
Dual FET*
NCP81161
12 V Driver
6-Phase
Controller
NTMFS4C06N
CPU
Dual FET*
+12V
* Dual FET =
NTMFD4C85N or
NTMFD4H84NF
(Both Pending 2H14)
NCP81161
12 V Driver
Dual FET*
+12V
NCP81161
12 V Driver
Dual FET*
+12V
NCP81161
12 V Driver
Dual FET*
Notebook Solutions
Integrated Ultrabook/Notebook Solution
NCP81103/8 1/2/3-phase controller with drivers
•High performance notebook solutions
•Dual edge modulation for fast transient response
•Features 2 integrated 5 V drivers
•VR12.5 (NCP81103) & VR12.6 (NCP81108) compliant
NCP81110 1-phase converter
•Integrated solution with drivers and 14 A TDC MOSFETs
•Smallest solution footprint for compact design
•Higher efficiency for longer battery life
•VR12.6 compliant
VIN
NTMFS4C10N
NCP81110
NTMFS4C06N
VIN
NCP81103
NTMFS4C10N
3-Phase
Controller
NTMFS4C06N
CPU
1-Phase
Controller
+ FETs
CPU
VIN
NTMFS4C10N
NCP81151
5 V Driver
ON Semiconductor
NTMFS4C06N
Page 3
VR12.5/6 Multiphase Controllers for Embedded Applications
VCC
PVCC
VRPM
SDIO
Alert
SCLK
BST
HG
SW
VRHOT
TTSENSE
VCORE
LG
Features
BST
•Dual-edge pulse width modulation
•Fastest initial response to dynamic load
events
•True differential voltage sensing
•Differential inductor DCR current sensing
•Input voltage feed forward
•Adaptive voltage positioning
•Pin-programmable controller configuration
•Integrated OVP, UVP, OCP
•Operating temperature range:
-40°C to +125°C
NCP81143
3PH
HG
VCORE
SW
SCLK
SDA
Alert
LG
NCP81145
BST
PWM2
HG
VCORE
SW
LG
VR_RDY
DIFFOUT
FB
COMP
INTSEL
ILIM
ROSC
IMAX
CSCOMP
CSSUM
IOUT
CSREF
PGND
Device
GND
CSP1
CSP2
CSP3
Description
Driver / MOSFETs
Package
NCP81140
4-Phase Controller
—
QFN-32
NCP81141
1-Phase VR12.6 Controller
Integrated 5 V Driver
QFN-28
NCP81142
4-Phase VR12.5 Controller
—
QFN-32
NCP81143
3-Phase VR12.5 Controller
2x Integrated 5 V Drivers
QFN-36
NCP81145
5 V Driver
—
DFN-8
NCP81146
12 V Driver
—
DFN-8
NCP81147
1-Phase Buck 0.8 V / 3.3 V
—
QFN-16
NCP81148
Dual Buck with LDOs
—
QFN-28
NCP81149*
1-Phase VR12.6 Controller
Integrated MOSFETs
—
* Pending 2Q15.
Page 4
Computing Solutions
System Power
System power management devices provide additional rails in computing applications, beyond Vcore and graphics. They are available
with single or dual channel operation, and also in multi-phase configurations.
1 F
VIN = 2.5 V − 13.2 V
3x22 F
VBST = 4.5 V − 15 V
1500 F
VCC = 4.5 V − 13.2 V
2x0.22 F
1500 F
0.1 F
C3
0.014 F
R3
74.2
FB
LG
GND
VOS
R9
R10
NTD4806
LX
ROCSET
R1
4.12k
C2
0.007 F
VOUT
1.65 V
1 H
2x1800 F
4.7nF
1.02k
R4
3.878k
R2
17.08k
UG
1.02k
C1
0.0015 F
COMP/EN
2.2
BOOT
NTD4809
VCC
PGOOD
GND
NCP1589A Application Diagram
Device
NCP1579
Description
Synchronous Buck Controller, Low Voltage
Topology
Step-Down
VCC Min
(V)
4.5
VCC Max
(V)
13.2
fSW Typ
(kHz)
275
Package
SOIC-8
NCP1587
Synchronous Buck Controller, Low Voltage
Step-Down
4.5
13.2
250 - 300
SOIC-8
NCP1587A
Synchronous Buck Controller, Low Voltage
Step-Down
4.5
13.2
180 - 220
SOIC-8
NCP1589A
Synchronous Buck Controller, Low Voltage
Step-Down
4.5
13.2
—
DFN-10
NCP1589D
Snychronous Buck Controller
Step-Down
4.5
13.2
—
DFN-10
NCP1589L
Synchronous Buck Controller, Low Voltage, with Light Load Efficiency and Transient Enhancement
Step-Down
4.5
13.2
—
DFN-10
NCP5212
Single Synchronous Step Down Controller
Step-Down
4.5
27
300
QFN-16
NCP5212T
Single Synchronous Step Down Controller
Step-Down
4.5
27
300
QFN-16
NCP5217
Synchronous Buck Controller, Single
Step-Down
4.5
27
300
QFN-14
NCP5222
Synchronous Buck Controller, 2-Channel, 2-Phase
Step-Down
4.5
27
300
QFN-28
NCP5230
Low Voltage Synchronous Buck Controller
Step-Down
4.5
13.2
—
QFN-16
NCP5269
System Agent Controller with 2-bit VID
Step-Down
3.3
28
300 - 600
QFN-20
NCP3231
25 A Synchronous Buck Converter with Intergrated MOSFETs
Step-Down
4.5
18
500
TQFN-40
NCP3232N
15 A Synchronous Buck Converter with Intergrated MOSFETs
Step-Down
4.5
21
500
TQFN-40
NCP3133A
3 A Synchronous Buck Converter with Intergrated MOSFETs
Step-Down
2.9
5.5
1100
QFN-16
NCP3135
5 A Synchronous Buck Converter with Intergrated MOSFETs
Step-Down
2.9
5.5
1100
QFN-16
ON Semiconductor
Page 5
Thermal Management and System Monitoring
8 GPIOs
Extensive Portfolio
SMBus Interface
RESET I/O
Local Sensors provide temperature information at
the device location
Remote Sensors provide temperature information
of a transistor located at a different position on the
board; also includes local sensor capability
4 PWM O/Ps
System
Voltages
+12 V
+5 V
+3.3 V
8 Tach Inputs
+2.5 V
+1.8 V
Fan Controllers integrate the temperature sensor
with a fan controller/monitor
System Monitors integrate combinations of
remote and/or local temperature sensing, voltage
monitoring, fan control & monitoring, reset control,
and GPIO functions
Fan Drive and Control
• 4 PWM Fan Drive Outputs
• 8 Tach Inputs
Fan2Max
+1.5 V
+1.25 V
+0.9 V
TDM1
Temperature
• Measures 4 Temp Zones
TDM2
VBatt
TDM3
1 Local
3 Remote
THERM I/O
Bi-directional
THERM Pins
Chassis Intrusion
ALERT O/P
Supply
Range
(V)
3 - 5.5
3 - 5.5
2.8 - 5.75
3 - 3.6
3 - 3.6
3 - 3.6
3 - 3.6
3 - 3.6
2.8 - 3.6
1.4 - 2.75
3 - 5.5
3 - 5.5
3 - 5.5
3 - 3.6
3 - 3.6
Temperature
Range
(°C )
-40 to +120
-40 to +125
-40 to +125
-40 to +120
-40 to +120
-40 to +120
-40 to +120
-40 to +120
-40 to +125
-40 to +125
-55 to +125
-40 to +125
-40 to +125
-40 to +125
-40 to +125
Local
Accuracy
(°C)
±3
±2.25
±2
±1.5
±1.5
±1.5
±1
±1
±1
±1.75
±1
±3
±3
±1
±1
Interface
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
I2C/SMBUS
Number
of
Addresses
3
2
8
3
3
1
8
8
2
2
9
2
2
2
9
NCT75
3 - 5.5
-55 to +125
±1
I2C/SMBUS
8
NCT275
3 - 5.5
-55 to +125
±1
I2C/SMBUS
4
NCT203
1.4 - 2.75
-40 to +125
±1.75
I2C/SMBUS
1
Device
ADM1026
System ADT7462
Monitors NCT80
ADT7476
ADT7473
ADT7475
Fan
Controllers ADM1033
ADM1034
NCT72
NCT218
NCT210
Remote ADM1032
Sensors
ADT7461
ADT7481
ADT7483
Local
Sensors
Page 6
SRC
(Ω)
—
2k
—
—
3k
—
1k
1k
1.5 k
150
—
—
3k
—
—
Remote
Accuracy
±3
±2.25
—
±1.5
±1.5
±1.5
±1
±1
±1
±1
±3
±1
±1
±1
±1
Remote
Channels
2
3
—
2
2
2
1
2
1
1
2
1
1
2
2
Fan
Channels
8
4
—
3
3
3
1
2
Voltage
TACH
Monitoring
Channels Channels
8
19
8
13
2
7
4
5
4
4
1
2
GPIOs
17
8
1
—
Package
LQFP-48
LFCSP-32
TSSOP-24
QSOP-24
QSOP-16
QSOP-16
QSOP-16
QSOP-16
DFN-8, WDFN-8
WDFN-8, WLCSP-8
QSOP-16
SOIC-8, MSOP-8
SOIC-8, MSOP-8
MSOP-10
QSOP-16
DFN-8, SOIC-8,
Micro8
CSP-6
DFN-8, SOIC-8,
Micro8
Computing Solutions
Integrated MOSFET and Drivers
Features
•Integrated high- and low-side MOSFETs
•Integrated bootstrap diode
•Matched of driver and MOSFETs optimize switching performance
•Higher switching frequency enables use of smaller inductor and output capacitors
•Low-side MOSFET diode emulation mode provides asynchronous operation
•65% lower BOM; 45% smaller footprint and simplified layout versus discrete solutions
VIN
3-Phase
3-Phase
Driver
DrMOS
IA Rail
IA Rail
Driver
DrMOS
VIN
Driver
DrMOS
GT Rail
2-Phase
2-Phase
GT Rail
Driver
DrMOS
Discrete
versus
Device
PWM Input
NCP5369
NCP81081
NCP5338
NCP5368*
5 V Tri-state
3.3 V Tri-state
5 V Tri-state
5 V Tri-state
VIN Max (V) Freq Max (MHz)
25
25
20
15
Integrated
IOUT Continuous Max (A)
Package
40
40
40
35
QFN-40
QFN-40
QFN-40
QFN-40
1
1
1
2
* Pending 2Q15.
Drivers for Discrete MOSFET Implementations
Drivers specifically designed to work with controller solutions, and optimized for 5 V or 12 V gate applications.
Device
Drivers
NCP5901
NCP5901B
NCP81161
NCP81151
NCP81253
NCP81061*
NCP81152
Single
Single
Single
Single
Single
Dual
Dual
VCC Typ (V) Integrated Bootstrap Diode
12
12
12
5
5
12
5
N
Y
Y
Y
Y
Y
Y
Zero Crossover Detection
Package
Y
Y
Y
Y
N
Y
Y
DFN-8
DFN-8
DFN-8
DFN-8
DFN-8
QFN-16
QFN-16
* Pending 2Q15.
ON Semiconductor
Page 7
MOSFETs Provide Optimized Efficiency
D1
Asymmetric Dual
(2, 3, 4, 9)
(1) G1
•Co-packaged Power Stage to minimize board space
•Low Side MOSFET with Integrated Schottky
•Parasitic Inductances Minimized
•Optimized Devices to Reduce Power Losses
S1/D2 (10)
(8) G2
S2 (5, 6, 7)
Device
Package
Config
NTMFD4C85N
PowerPhase
Asym
Dual
NTMFD4C86N
PowerPhase
Asym
Dual
NTMFD4901NF
SO-8FL
Asym
Dual
NTMFD4C87N
PowerPhase
Asym
Dual
NTMFD4C20N
SO-8FL
Asym
Dual
NTMFD4902NF
SO-8FL
Asym
Dual
NTLLD4901NF
m8-FL/
WDFN-8
Asym
Dual
Page 8
Polarity
N
N
N
N
N
N + Int Sch
N
N
N
N
N
N + Int Sch
N
N + Int Sch
VDS
(V)
30
30
30
30
30
30
30
30
30
30
30
30
30
30
Maximum Rating
RDS(ON) (mΩ)
VGS
VGS =
VGS =
(V)
10 V
4.5 V
20
3.0
4.3
20
0.8
1.2
20
5.4
8.1
20
2.1
3.0
20
6.5
10.0
20
2.4
3.5
20
5.0
7.7
20
3.1
4.3
20
7.0
10.8
20
3.4
5.2
20
6.5
10.0
20
4.1
6.2
20
20.0
30.0
20
15.0
22.0
Qg
(nC)
15.0
45.2
10.9
21.6
9.7
20.0
10.9
13.8
9.3
13.0
9.7
11.5
5.5
5.9
Qgd
(nC)
5.2
11.8
5.4
5.5
3.7
5.3
5.4
3.6
4.2
3.0
3.7
3.4
1.4
2.9
Ciss
(pF)
1960
6660
1252
3040
1150
2950
1252
1939
970
1950
1150
1510
605
645
Crss
(pF)
102
126
126
77
105
82
129
49
125
50
105
83
100
16
RG
(Ω)
1.0
1.0
1.0
1.0
0.8
0.8
1.0
1.0
1.0
1.0
0.8
0.8
0.8
0.8
Applications
Control Side
Synchronous Side
Control Side
Synchronous Side
Control Side
Synchronous Side
Control Side
Synchronous Side
Control Side
Synchronous Side
Control Side
Synchronous Side
Control Side
Synchronous Side
Computing Solutions
MOSFETs Provide Optimized Efficiency
SO-8FL
5 x 6 mm
µ8FL
3.3 x 3.3 mm
DPAK
SOIC-8
5 x 6 mm
ON Semiconductor
Device
Package
NTMFS4C01N
SO-8FL
Configuration Polarity
VDS
(V)
Maximum Rating
RDS(ON) (mΩ)
VGS
VGS = VGS =
(V)
10 V
4.5 V
Single
N
30
20
0.9
1.2
Qg
(nC)
Qgd
(nC)
Ciss
(pF)
Crss
(pF)
RG
(Ω)
Applications
65.0
18.0
9200
231
1.0
HPPC
NTMFS4C03N
SO-8FL
Single
N
30
20
2.1
2.8
43.7
5.3
2850
72
1.0
HPPC
NTMFS4983NF
SO-8FL
Integ Sch
N
30
20
2.1
3.1
22.6
6.9
3250
90
1.0
Synchronous Side
NTMFS4C35N
SO-8FL
Single
N
30
20
3.2
4.2
15.0
5.5
2300
46
1.0
Synchronous Side
NTMFS4985NF
SO-8FL
Integ Sch
N
30
20
3.4
5.0
14.2
4.2
2100
60
1.0
Synchronous Side
NTMFS4C05N
SO-8FL
Single
N
30
20
3.4
5.0
13.0
3.0
1950
50
1.0
Synchronous Side
NTMFS4C06N
SO-8FL
Single
N
30
20
4.0
6.0
14.5
5.5
1988
71
1.0
Synchronous Side
NTMFS4C08N
SO-8FL
Single
N
30
20
5.8
8.5
8.7
2.8
1100
38
1.0
Synchronous Side
NTMFS4C09N
SO-8FL
Single
N
30
20
6.0
8.8
10.9
5.4
1252
126
1.0
Control Side
Control Side
NTMFS4C10N
SO-8FL
Single
N
30
20
7.0
10.8
9.3
4.2
970
125
1.0
NTMFS4C13N
SO-8FL
Single
N
30
20
9.1
13.8
6.6
2.7
720
95
1.0
Control Side
NTTFS4C05N
µ8-FL
Single
N
30
20
3.6
5.1
13.0
3.0
1950
50
1.0
Synchronous Side
NTTFS4C06N
µ8-FL
Single
N
30
20
4.0
6.0
14.5
5.5
1988
71
1.0
Synchronous Side
NTTFS4C08N
µ8-FL
Single
N
30
20
5.8
8.5
8.7
2.8
1100
38
1.0
Synchronous Side
NTTFS4C10N
µ8-FL
Single
N
30
20
7.4
11.0
9.3
4.2
970
125
1.0
Control Side
NTTFS4C13N
µ8-FL
Single
N
30
20
9.1
13.8
6.6
2.7
720
95
1.0
Control Side
NTTFS4C25N
µ8-FL
Single
N
30
20
17.0
26.5
4.0
1.3
455
60
1.0
Control Side
NTD4904N
DPAK
Single
N
30
20
3.7
5.5
16.8
3.0
3052
23.0
1.0
Synchronous Side
NTD4965N
DPAK
Single
N
30
20
4.7
7.0
17.5
8.5
1684
330
0.8
Synchronous Side
NTD4906N
DPAK
Single
N
30
20
5.5
8.0
11.0
1.8
1932
19
1.0
Synchronous Side
NTD4969N
DPAK
Single
N
30
20
9.0
12.0
8.7
4.0
835
163
0.7
Control Side
NTD4970N
DPAK
Single
N
30
20
11.0
15.0
7.7
3.7
743
330
0.9
Control Side
NTMS4937N
SOIC-8
Single
N
30
20
6.5
8.7
17.4
3.3
2563
25
1.0
Synchronous Side
NTMS4939N
SOIC-8
Single
N
30
20
8.4
11.0
12.4
1.9
2000
16
0.7
Synchronous Side
NTMS4916N
SOIC-8
Single
N
30
20
9.0
12.0
14.0
7.0
1468
280
0.7
Control Side
NTMS4917N
SOIC-8
Single
N
30
20
11.0
15.0
10.8
3.5
1132
216
0.7
Control Side
NTMS4800N
SOIC-8
Single
N
30
20
20.0
27.0
7.7
3.2
940
125
1.5
Control Side
NTMS4840N
SOIC-8
Single
N
30
20
24.0
36.0
4.8
1.9
520
70
2.0
Control Side
NTMD4820N
SOIC-8
Dual
N
30
20
20.0
27.0
7.7
3.2
940
125
1.5
DC-DC, Load Switch
NTMD4840N
SOIC-8
Dual
N
30
20
24.0
36.0
4.8
1.9
520
70
1.0
DC-DC, Load Switch
NTMS4177P
SOIC-8
Single
P
-30
20
12.0
19.0
29.0
13.0
3100
370
2.0
Load Switch
NTMS4176P
SOIC-8
Single
P
-30
25
18.0
30.0
17.0
8.4
1720
256
2.9
Load Switch
Page 9
MOSFETs Provide Optimized Efficiency
Trench 6 High Efficiency (T6HE) for Servers and
Point-of-Load Modules
•High Efficiency DC-DC Conversion
•Integrated Schottky Lowsides
•Lowest RDS(on) in the industry
Maximum Rating
RDS(ON) (mΩ)
VGS
VGS =
VGS =
(V)
10 V
4.5 V
Device
Package
Config
Polarity
VDS
(V)
Qg
(nC)
Qgd
(nC)
Ciss
(pF)
Crss
(pF)
RG
(Ω)
Applications
NTMFS4H01N
SO-8FL
Single
N
25
20
0.7
1.0
39.0
8.5
5693
212
1.2
Synchronous Side
NTMFS4H01NF
SO-8FL
Integ Sch
N
25
20
0.7
1.0
37.8
8.0
5538
175.3
1.3
Synchronous Side
NTMFS4H013NF*
SO-8FL
Integ Sch
N
25
20
0.9
1.3
28.0
7.5
3780
150
1.0
Synchronous Side
NTMFS4H02N
SO-8FL
Single
N
25
20
1.4
2.2
18.0
4.2
2651
103
1.0
Synchronous Side
NTMFS4H02NF
SO-8FL
Integ Sch
N
25
20
1.4
2.3
18.7
4.3
2652
94
1.0
Synchronous Side
NTTFS4H05N
µ8-FL
Single
N
25
20
3.3
4.8
8.7
1.9
1205
45
1.0
Control Side
NTTFS4H07N
µ8-FL
Single
N
25
20
4.8
7.1
5.7
1.3
771
34
1.0
Control Side
* Pending 2Q15.
Switching Devices
ON Semiconductor offers a range of switching devices for high speed interface in servers, desktop computing, notebook and netbook
computers. Applications include PCI Express, DisplayPort, Gigabit Ethernet and USB 2.0.
2nd LCD
Display
LCD
Panel
TMDS
DisplayPort
Switch
Docking Station Connector
VGA Switch
HDMI/DVI
Switch
LAN Switch
Internal
Graphics
Processor
Gigabit LAN
Transceiver
USB Power/
Data Switch
Stereo Switch
Mic Switch
Page 10
External
Graphics
Processor
Audio
Amp
PCIe
Switch
Processor
North Bridge
(ICH)
South Bridge
(MCH)
Codec
Server Implementation
Device
Interface
Data Rate
NCN3612B
NCN3411
NCN2612B
NS3L500
NCN1188
NS5S1153
NLAS7242
NLAS52231
NLAS4684
PCIe 3.0, DisplayPort 1.2
PCIe 3.0
PCIe 2.0, DisplayPort 1.1
Gigabit Ethernet
USB 2.0 / MHL
USB 2.0
USB 2.0
Audio
Audio
8 Gb/s
8 Gb/s
5 Gb/s
1 Gb/s
2.25 Gb/s
480 Mb/s
480 Mb/s
36 MHz
9.5 MHz
No
Quiescent
Channels Current
12
8
12
11
2
2
2
2
2
250 μA
200 μA
250 μA
250 μA
21 μA
21 μA
1 μA
1 μA
180 nA
Computing Solutions
Advanced Load Switches
ON Semiconductor provides a comprehensive range of load switches, suitable for a variety of different power trees.
•Copackaged MOSFET plus CMOS controllers – value-added features plus high performance
•Monolithic CMOS smart load switches – value added features, low cost
•Discrete MOSFETs – simple, high performance
VCC
EN
PG
Smart Load Switch
ecoSWITCH™ Integrated
Load Switch
NCP45xxx Integrated Load Switch Feature
Thermal,
Undervoltage
&
Short-Circuit
Protection
Bandgap
&
Biases
Control
Logic
Charge
Pump
Delay and
Slew Rate
Control
SR
Type
VIN
GND
BLEED
•Simple/clean design
•No current consumption in standby power mode
•Small PCB footprint
•Low RDS(ON) due to charge pump driving NMOS
•Adjustable soft-start time (SR)
•Adjustable integrated discharge
•Fault protection
•Power rail monitoring & sequencing
VOUT
ron
(mW)
I Max
(A)
VI Min
(V)
VI Max
(V)
IQ
(mA)
Discharge
Slew Rate
(ms)
Features
Package(s)
NCP330 26 at 3.3 V
3
1.8
5.5
100
-
2000
Reverse blocking
TDFN-4
NCP333 55 at 3.3 V
1.5
1.2
5.5
1
Auto
95
-
WLCSP-4
NCP334 47 at 3.3 V
2
1.2
5.5
1
-
71
-
WLCSP-4
NCP335 47 at 3.3 V
2
1.2
5.5
1
Auto
71
-
WLCSP-4
NCP336 23 at 3.3 V
3
1.2
5.5
1
-
810
-
WLCSP-6
NCP337 23 at 3.3 V
3
1.2
5.5
1
Auto
810
-
WLCSP-6
NCP338 27 at 1.8 V
2
1
3.6
0.6
Auto
20
-
WLCSP-6
Device
NCP339
26 at 3.3 V
3
1.2
5.5
2
-
2700
Reverse blocking
WLCSP-6
NCP432
50 at 1.8 V
1.5
1
3.6
0.6
-
20
-
WLCSP-4
NCP433
50 at 1.8 V
1.5
1
3.6
0.6
Auto
20
-
WLCSP-4
NCP434 43 at 1.8 V
2
1
3.6
0.6
-
61
-
WLCSP-4
NCP435 43 at 1.8 V
2
1
3.6
0.6
Auto
61
-
WLCSP-4
NCP436
23 at 1.8 V
3
1
3.6
1
-
27
-
WLCSP-6
NCP437
23 at 1.8 V
3
1
3.6
1
Auto
27
-
WLCSP-6
NCP45524 18.0
6
0.5
13.5
-
Adj
-
Power good
DFN-8
NCP45525 18.0
6
0.5
13.5
-
Adj
Adj
-
DFN-8
NCP45560 2.4
24
0.5
13.5
-
Adj
Adj
Power good; Fault
DFN-12
NCP45540 3.3
20
0.5
13.5
-
Adj
Adj
Power good; Fault
DFN-12
NCP45541
3.3
20
0.5
13.5
-
Adj
Adj
Power good
DFN-12
NCP45520 9.5
10.5
0.5
13.5
-
Adj
-
Power good; Fault
DFN-8
NCP45521 9.5
10.5
0.5
13.5
-
Adj
Adj
Fault
DFN-8
ON Semiconductor
Page 11
Power Rail Over-Current and Over-Voltage Protection
for SAS, SATA, mSATA, and µSATA Interfaces for HDDs/SSDs/Servers
Key Requirement
•Over-current and over-voltage protection
•< 20 µs response time
•Sustained currents > 3 A
Features
•Integrated OCP and OVP with best-in-class response time
•< 50 mΩ Rdson
•Configurable current limit
•Thermally protected
•Auto-retry and Latching on Fault options
NIS5452 Over-Voltage Response Time
VCC
Enable/
Fault
3.3 V Power Bus
Charge
Pump
Enable
3.3 V
Source
Thermal
Shutdown
Current
Limit
NIS5431
3.3 V
ILimit
3.3 V
UVLO
Voltage
Clamp
dV/dt
Control
RLIM
dV/dt
ENABLE
GND
GND
GND
eFuse Block Diagram
Device
Nominal
Voltage
(V)
Input
Voltage
(V)
Vclamp
(V)
Continuous
Current
(A)
NIS5112
NIS5232
NIS5451*
NIS5452*
NIS5431*
12
12
5
5
3.3
-0.3 to 18
-0.6 to 18
-0.6 to 14
-0.6 to 14
-0.6 to 14
15
15
5.5
5.85
3.85
5.3
4.2
4.5
4.5
4.3
5 V Power Bus
GND
Trip
Current RDS(ON) Auto(A)
(mW) Retry
Adjustable
Adjustable
Adjustable
Adjustable
Adjustable
28
44
33
33
40
Y
N
N
Y
N
5V
RLIM
NIS545x
5V
Latch Package
Y
Y
Y
Y
Y
SOIC-8
DFN-10
WDFN-10
WDFN-10
WDFN-10
5V
GND
ENABLE
* Pending 3Q15.
GND
RLIM
NIS5232
12 V
12 V
12 V Power Bus
Page 12
12 V
Computing Solutions
Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit
Four Pairs, Low Capacitance Surge and ESD Protection
The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and
lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.
Features
•Line-to-line capacitance < 3 pF
•Vclamp (25 A surge) < 11 V
•IEC 61000-4-2 rating > 30 kV
•No latching danger
•Surge rating maintained to 125°C
Typical Application
1000BASE-T
ETHERNET TRANSCEIVER
TPONA
A+
VDD
C5
ALC03
TPONB
TVS8818
TPONC
BLC03
8
C3
C6
1
TPOPC
B+
VDD
C+
RJ45
C2
TRANSFORMER
TPOPB
8
1
VDD
C7
CLC03
TPOPD
C4
TPOND
8
1
Benefits
•Compatible with Gb Ethernet and beyond
•Enhanced protection for downstream electronics
•Accommodates operating transients above 3.3 V
•Small form-factor allows integration into connectors
C1
8
1
TPOPA
D+
VDD
C8
DLC03
Line Side : LC03-6 (optional)
Transformer Side: TVS8818
Protection against metallic (transverse) strikes
1
2
TVS8818
5
Voltage (V), Current (A)
4
30
RJ-45 Connector
3
6
Flow Through
Routing
7
25
8/20 μs
Surge Current
15
ON Semiconductor
Voltage
10
5
0
-10
8
Competitor
Voltage
20
0
10
20
30
Time (μs)
40
50
60
Line-to-Line Surge
Transient Voltage Suppressors
Device
LC03-6
TVS8814**
TVS8818**
SRDA3.3
SRDA05
NUP4114H
VDC Max
(V)
6.7
3.0
3.0
3.3
5.0
5.0
Line
Transient
Max
(V)
7.0
3.2
3.2
5.0
7.0
5.0
Surge IPP,
8/20 ms
(A)
100
35
35
25
23
12*
Typical
Line-Line
Capacitance
(pF)
8.0
1.5
1.5
4.0
5.0
0.4
ESD
Contact
Rating
(kV)
±30
±30
±30
±8
±8
±13
Package
SOIC-8
UDFN-8
UDFN-10
SOIC-8
SOIC-8
TSOP-6
* On Pin 5. ** Pending 3Q15.
ON Semiconductor
Page 13
USB 3.0/3.1 Type A Connector
Two Super Speed Pairs, One High Speed Pair, VBUS, Low Capacitance ESD Protection
Key Requirement
•Capacitance < 0.55 pF
Features
•Capacitance as low as 0.25 pF
•Grounds between pairs to reduce cross-talk
•Flow-through routing
•Industry leading clamping voltage
USB 3.0/3.1 Type A
Connector
USB 3.0/3.1 Type A
Connector
StdA_SSTX+
StdA_SSTX+
Vbus
Vbus
ESD8016
StdA_SSTX-
ESD8704
D-
D-
GND_DRAIN
GND_DRAIN
I/O
1
I/O
2
I/O . . . . . I/O I/O I/O
3
(N-2) (N-1) N
ESD7L5.0
Top layer
Other layer
D+
D+
StdA_SSRX+
StdA_SSRX+
GND
GND
StdA_SSRX-
StdA_SSRX-
ESD8704 — 0.30 pF, 2 Layer Routing
(ESD7L5.0 for D+, D- Lines)
=
StdA_SSTX-
ESD8016 — 0.25 pF, 1 Layer Routing
Device
Data Lines
Capacitance
(pF)
Package
Size
(mm)
ESD8006
ESD8016
ESD8704*
ESD7L
ESD8351
ESD8011
3 Pair
3 Pair
2 Pair
1 Pair
Single Line
Single Line
0.25
0.25
0.37
0.50
0.37
0.10
UDFN-8
UDFN-8
UDFN-10
SOT-723
X3DFN-2
X3DFN-2
3.3 x 1.0
2.0 x 1.0
2.5 x 1.0
1.2 x 1.2
0.62 x 0.32
0.62 x 0.32
* Pending 3Q15.
Without ESD
USB 3.1 @ 10 Gb/s
Page 14
With ESD
Computing Solutions
USB 3.1 Type C Connector
Two Super Speed Pairs, One High Speed Pair, VBUS, Low Capacitance ESD Protection
Type-C Hybrid Top Mount Connect
Top Layer
Key Requirement
•Capacitance < 0.55 pF for High Speed lines
•Bi-directional protection for optional audio lines
•Support for Vconn through CC lines
GND
TX1+
TX1Vbus
ESD8704
Features
•Capacitance of 0.37 pF or less
•Grounds between pairs to reduce cross-talk
•Flow-through routing
•Industry leading clamping voltage
CC1
D+
DSBU1
ESD7471/
ESD8472
Vbus
RX2RX2+
GND
I/O
1
I/O
2
I/O
4
I/O
5
Bottom Layer
GND
RX1+
Note: Common GND – Only Minimum of
1 GND connection required
RX1SBU2
ESD8704
=
Vbus
DD+
Data Lines
Capacitance
(pF)
Package
Size
(mm)
2 Pair (Tx, Rx)
Single Line
Single Line
2 Pair (CC, SBU)
0.37
0.24
0.20
0.30
UDFN-10
XDFN-2
X3DFN-2
UDFN-10
2.5 x 1.0
1.0 x 0.6
0.62 x 0.32
2.5 x 1.0
Device
ESD8704*
ESD7471
ESD8472
ESD7104
Top layer
Other layer
ESD7471/
ESD8472
Vbus
CC2
TX2TX2+
GND
* Pending 3Q15.
18
0
16
8kV
6kV
10
8
4kV
6
4
-1
-3
Competitors
-4
2kV
-5
2
0
0
ON Semiconductor
Competitors
-2
S21, dB
Current, A
12
ESD8704
IEC61000-4-2 Equivalent Level
14
ESD8704
2
-6
108
Voltage, V
109
Frequency, Hz
Benchmark for Positive TLP I-V Curve
Benchmark for Insertion Loss
4
6
8
10
12
14
16
8 x 109
Page 15
USB 2.0
One High Speed Pair, V CC , Low Capacitance ESD Protection
Key Requirement
•Capacitance < 1.5 pF
I/O 1 I/O 2 I/O 3 I/O 4
Features
•Capacitance of 0.5 - 0.8 pF
•4 low speed + 1 VBUS integrated – can protect up to 2 USB ports
•Industry leading low clamping voltage
Device
Data Lines
Capacitance
(pF)
NUP4114UCL
NUP4114UPX
NUP4114H
NUP3115
ESD7L5.0
ESD7451
ESD7481
2 Pair + Power
2 Pair + Power
2 Pair + Power
1 Pair + ID + Power (D+, D-, ID, VBUS)
1 Pair (D+, D-)
Single Line 0402
Single Line 0201
0.50
0.80
0.80
0.80
0.50
0.25
0.25
GND
D+
=
DVBUS
Package
Size
(mm)
SC-88
SOT-563
TSOP-6
UDFN-6
SOT-723
XDFN-2
X3DFN-2
2.0 x 2.1
1.6 x 1.6
3.0 x 2.75
1.6 x 1.6
1.2 x 1.2
1.0 x 0.6
0.62 x 0.32
NUP4114
One High Speed Pair, V CC , Common Mode Filter + ESD Protection
Micro USB
Connector
Key Requirement
•Cap < 1.5 pF
•Common Mode Filtering
GND
EMI2121
D+
Features
•0.5 - 0.8 pF
•Integrated EMI suppression with ESD protection
•Industry leading low clamping voltage
Device
EMI2121
EMI2124
Data Lines
Capacitance
@ 2.5 V (pF)
1 Pair + Power (D+, D-, VBUS)
1 Pair + ID + Power (D+, D-, ID, VBUS)
0.9
0.9
DVBUS
Top layer
Other layer
CM Attenuation DM Bandwidth
@ 800 MHz (–dB) F3dB (GHz)
Package
–25
–25
ID
2.5
2.5
WQFN
WQFN
Size
(mm)
2.2 x 2.0 x 0.75
2.2 x 2.0 x 0.75
0
-5
-10
dB
-15
-20
-25
-30
USB 2.0 @ 480 Mb/s
Page 16
-35
1.E+06
Suppresses Common Mode Noise
Deeper than Competing Passive Solution
Common
Mode
Differential
Mode
1.E+07
1.E+08
1.E+09
Frequency
Computing Solutions
Thunderbolt
Four High Speed Pairs, up to Six Additional Lines, Low Capacitance ESD
Key Requirement
•Capacitance < 0.4 pF
Thunderbolt Connetctor
Top Layer
GND
Features
•Capacitance of 0.25 pF
•Integrated solution in 2.0 x 1.2 mm package
•Grounds between pairs to reduce cross-talk
•Flow-through routing
•Industry leading clamping voltage
I/O
1
I/O
2
I/O
4
I/O
5
I/O
7
ESD8016
ML0+
ML0–
GND
ML1+
ML1–
GND
ML2+
ML2–
GND
I/O
8
ESD9X
Thunderbolt Connetctor
Bottom Layer
Common GND = Pins 2, 3
Hot Plug Detect
=
CONFIG1
ESD8016
ML3+
Device
ESD8006
ESD8016
ESD8351
ESD8011
Data Lines
Capacitance
(pF)
Package
Size
(mm)
3 Pair
3 Pair
Single Line
Single Line
0.25
0.25
0.37
0.10
UDFN-8
UDFN-8
X3DFN-2
X3DFN-2
3.3 x 1.0
2.0 x 1.0
0.62 x 0.32
0.62 x 0.32
ML3–
GND
GND
CONFIG2
Aux+
Aux–
PWR
Top layer
Bottom layer
ESD9X
Without ESD8016
Thunderbolt @ 10 Gb/s
ON Semiconductor
With ESD8016
Page 17
HDMI, Display Port
Four High Speed Pairs, Up to Six Additional Interface Lines, Low Capacitance ESD
Key Requirement
•Capacitance < 0.5 pF (HDMI 1.3/1.4)
•Capacitance < 0.4 pF (HDMI 2.0)
I/O
1
I/O
2
Features
•Capacitance of 0.3 pF ESD protection
•Flow through routing in high speed lines
•Industry leading low clamping voltage
ESD8104
I/O . . . . . I/O I/O I/O
3
(N-2) (N-1) N
Device
ESD8104
ESD8040
ESD7451
ESD7481
=
HDMI Type-A Connector
Data Lines
Capacitance
(pF)
Package
Size
(mm)
0.30
UDFN-10
2.5 x 1.0
0.30
UDFN-18
5.5 x 1.5
0.25
0.25
XDFN-2
X3DFN-2
1.0 x 0.6
0.62 x 0.32
2 Pair
4 Pair + CEC, SDL,
SDA, 5V,HPD
Single Line 0402
Single Line 0201
ESD8040
HDMI Type-A Connector
D2+
D2+
GND
GND
D2-
D2-
D1+
D1+
GND
GND
D1-
D1-
ESD8104
D0+
D0+
GND
GND
D0-
D0-
CLK+
CLK+
GND
GND
CLK-
CLK-
CEC
CEC
N/C (or HEC_DAT - HDMI1.4)
N/C (or HEC_DAT - HDMI1.4)
SCL
SCL
SDA
SDA
GND
GND
5V
5V
HPD (and HEC_DAT - HDMI1.4)
HPD (and HEC_DAT - HDMI1.4)
•MediaGuard fully integrated solution
•Includes ethernet protection (HDMI1.4)
•Backdrive current protection
NUP4114
Without ESD
Page 18
HDMI 2.0 @ 6.0 Gb/s
Top layer
Other layer
With ESD
Computing Solutions
Serial EEPROMs
Features
EasyPRO™ is a user-friendly, portable
programming tool for ON Semiconductor
serial EEPROMs (I2C, SPI, Microwire)
•Broad density range: 1 kb to 2 Mb
•Wide operating Vcc range: 1.8/1.7 V to 5.5 V
•High endurance: 1 million program/erase cycles
•Wide temperature range: industrial and extended
EEPROMs
Data
Transmission
Standard
I2C
SPI
Microwire
Device
Density
Organization*
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz)
Package(s)
CAT24M01
CAT24C512
CAT24C256
CAT24C128
CAT24C64
CAT24C32
CAT24C16
CAT24C08
CAT24C04
CAT24C02
CAT25M02
CAT25M01
CAT25512
CAT25256
CAT25128
CAT25640
CAT25320
CAT25160
CAT25080
CAT25040
CAT25020
CAT25010
CAT93C86
CAT93C86B
CAT93C76
CAT93C76B
CAT93C66
CAT93C56
CAT93C46
CAT93C46B
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
2 Mb
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
1 kb
16 kb
16 kb
8 kb
8 kb
4 kb
2 kb
1 kb
1 kb
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
256k x 8
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
128 x 8
2k x 8 / 1k x 16
2k x 8 / 1k x 16
1k x 8 / 512 x 16
1k x 8 / 512 x 16
512 x 8 / 256 x 16
256 x 8 / 128 x 16
128 x 8 / 64 x 16
128 x 8 / 64 x 16
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8 / 1.65
1.8
1.8 / 1.65
1.8
1.8
1.8
1.8 / 1.65
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
1
1
1
1
1
1
0.4
0.4
0.4
0.4
10
10
20
20
20
20
20
20
20
20
20
20
3
4
3
4
2
2
2
4
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8, WLCSP-4
SOIC-8, TSSOP-8, UDFN-8, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
* Organization for Microwire devices is selectable.
Application Specific EEPROMs
Data
Transmission
Standard
Device
Density
Organization
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz)
I2C
I2C
2
I C/SMBus
CAT24C208
CAT34C04*
CAT34TS04
8 kb
4 kb
4 kb
1024 x 8
512 x 8
512 x 8
2.5
1.7
2.2
5.5
5.5
5.5
0.4
1
1
I2C
CAT34C02
2 kb
256 x 8
1.7
5.5
0.4
I2C/SMBus
CAT34TS02
2 kb
256 x 8
3.0
3.6
0.4
Package(s)
Notes
SOIC-8
UDFN-8
TDFN-8, UDFN-8
UDFN-8, TDFN-8,
TSSOP-8
TDFN-8, UDFN-8
VESA™ dual-port serial EEPROM
Serial Presence Detect (SPD) I2C EEPROM for DDR4 DIMM
4 kb SPD EEPROM w/ Temperature Sensor for DDR4 DIMM
Serial Presence Detect (SPD) I2C EEPROM for DDR3 DIMM
2 kb SPD EEPROM w/ Temperature Sensor for DDR3 DIMM
* Pending 2Q15.
ON Semiconductor
Page 19
Clock Synthesizers for High Performance Computing
Features
•Uses 25 MHz fundamental mode parallel resonant crystal
•PCI-e Gen 1,2 & 3 jitter complaint HCSL differential outputs
•NB3N50134 features configurable spread spectrum outputs
•NB3N51044 features individual OE control signal for each output, PLL bypass
mode and an Input multiplexer
•NB3N51054 features I2C interface for OE control and configurable spread
spectrum outputs
•3.3 V supply
VDD
X1/CLK
25 MHz Clock or
Crystal
X2
Clock Buffer
Crystal Oscillator
Charge
Pump
Phase
Detector
HSCL
Output
VCO
HSCL
Output
M
GND
S0
S1
OE
CLK0
CLK0
CLK1
CLK1
IREF
NB3N5573 Simplified Logic Diagram
Number
of Inputs
Input Type
fin Typ
(MHz)
Number
of Outputs
Output
Type
fout Typ
(MHz)
Spread Spectrum
Outputs
Package
NB3N3002
1
Crystal; LVCMOS; LVTTL
25
1
HCSL
25; 100; 125; 200
No
TSSOP-16
NB3N5573
1
Crystal; LVCMOS; LVTTL
25
2
HCSL
25; 100; 125; 200
No
TSSOP-16
NB3N51032
1
Crystal; LVCMOS; LVTTL
25
2
HCSL
25; 100; 125; 200
No
TSSOP-16
NB3N51034
1
Crystal; LVCMOS; LVTTL
25
4
HCSL
100: 200
Yes
TSSOP-20
NB3N51044
2
Crystal; LVCMOS; LVTTL
25
4
HCSL
100: 125
No
TSSOP-28
NB3N51054
1
Crystal; LVCMOS; LVTTL
25
4
HCSL
100
Yes
TSSOP-24
Device
Page 20
Computing Solutions
Fanout Buffers for High Performance Computing
Features
•DC up to 400 MHz
•Accepts LVPECL, LVDS, HCSL, and single-ended inputs
•Typical input clock frequencies: 100, 133, 156.25, 166, 322.26, or 400 MHz
•Typical propagation delay: 800 ps
•HCSL differential outputs
•Integrated 50 Ω input termination resistors
•IREF pin enables setting of output drive
•Additive phase jitter 0.1 ps typical @ 100 MHz; PCI-e Gen 3 jitter complaint
•Additive phase jitter 80 fs maximum @ 156.25 MHz with NB3L208K;
D8800H compliant
Q0
Q0
VTCLK
Q1
Q1
CLK
CLK
Q19
Q19
VTCLK
Q20
VCC
IREF
GND
Q20
RREF
NB3N121K Logic Diagram
Ratio
Additive
tJitter(RMS) Typ
(ps)
tskew(o-o) Max
(ps)
tpd Typ
(ns)
tR & tF Max
(ps)
fmaxClock Typ
(MHz)
Package
NB3N106K
1:6
0.1
100
0.8
400
400
QFN-24
NB3L208K
1:8
0.046
30
1
125
350
QFN-32
NB3N108K
1:8
0.1
100
0.8
400
400
QFN-32
NB3N111K
1:10
0.1
100
0.8
400
400
QFN-32
NB4N111K
1:10
<1
100
0.8
700
400
QFN-32
NB3N121K
1:21
0.1
100
0.8
700
400
QFN-52
NB4N121K
1:21
<1
50
0.8
700
200
QFN-52
Device
ON Semiconductor
Page 21
Computing Clock for Graphics
P1P8160A Features
•Provides reference clock to the GPU & reduces EMI in the GDDR interface
•Input frequency 27 MHz; crystal or reference clock
•Output frequency 100 MHz spread spectrum clock; 27 MHz RefOUT
•Two tri-level logic pins for selecting eight frequency deviations along with SSOFF
•Modulation rate at 100 MHz: 32 kHz
•Low cycle-cycle & long term jitter
•Supply voltage: 3.3 V ±10%
•WDFN-10 package
D-Sub
D-Sub
D-Sub
D-Sub
GPU
Core
SS_clock
Non_SS_clock
27 MHz
DDR
Controller
SS_clock
PLL
100 MHz_SS_clock
P1P8160A
27 MHz
Radeon HD 6000/5000 Series
P1P8160A for AMD Graphics Card Application
Page 22
Computing Solutions
Zero Delay Buffers Compliant with DB Specifications
Features
•Differential SRC clock support
•NB3N1900K, NB3N1200K: DB1900Z and DB1200Z compliant with 19 and 12 output pairs respectively
•NB3W1200L, NB3W800L: DB1200ZL and DB800ZL compliant with 12 and 8 low power NMOS push-pull
output pairs respectively
•NB3W1900L: 19 low power NMOS push-pull output pairs
•Optimized for 100 MHz and 133 MHz to meet PCIe* Gen 2/Gen 3 and Intel QPI phase jitter specifications
•Spread spectrum compatible for low EMI
•Pseudo-external fixed-feedback for low input-to-output delay variation
•Individual OE control pin for each output
•SMBUS programmability for power down mode, PLL BW modes, PLL/Bypass mode & frequency selection
OE_[11:0]#
12
FB_OUT*
FB_OUT#*
SSC Compatible
PLL
CLK_IN
DIF_[11:0]
MUX
DIF_[11:0]#
CLK_IN#
100M_133M#
HBW_BYPASS_LBW#
SA_0
Control
Logic
SA_1
PWRGD/PWRDN#
SDA
SCL
* FB_OUT pins are for NB3N1200K only; they are NC for NB3W1200L
** IREF pin is for NB3N1200K only; it is NC for NB3W1200L
IREF**
RREF
NB3N1200K Simplified Block Diagram
Ratio
Output
tJitter(Cy-Cy) Typ
(ps)
tskew(I-o) Max
(ps)
NB3W800L*
1:8
Low power NMOS push-pull
34
±100
50
4
QFN-48
NB3N1200K
1:12
HCSL
50
±100
50
4
QFN-64
NB3W1200L
1:12
Low power NMOS push-pull
50
±100
50
4
QFN-64
NB3N1900K
1:19
HCSL
50
±100
65
4
QFN-72
NB3W1900L
1:19
HCSL
50
±100
85
4
QFN-72
Device
tskew(o-o) Max Edge Rate Max
(ps)
(V/ns)
Package
* Pending 3Q15.
ON Semiconductor
Page 23
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ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All other brand names and product names appearing in this document are trademarks of their respective holders.
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