Smart Building/Internet-of-Things Energy Harvester Boost / Flyback Converters & Battery Management System Power Management Battery Processor / MCU Non-Volatile Memory & Security Connectivity Wireless Wired • • • • • • • ZigBee S-FSK KNX M-BUS HART 6loWPAN Proprietary Sensors • • • • • • • Image Light Moisture Pressure Proximity Temperature Touch Motor Control •Seamlessly connected intelligent devices that sense, analyze and control the environment •Connected smart lighting, surveillance/security systems, HVAC systems, home appliances, energy management systems, vehicles, traffic control •Key building blocks include sensors/actuators, ultra low power MCUs/DSPs, connectivity, power management, security and software, chip integration and micro-packaging Page 2 Internet of Things Solutions ON Semiconductor offers advanced packaging and integration capabilities, ranging from chip scale packaging through multichip modules. This extensive portfolio of packaging technology helps customers solve their unique design challenges related to thermal performance, power density, and low profile. Shown below is a small sample from the company’s broad and deep package portfolio. PIM IPM DPAK 6.0 x 6.5 mm SO8-FL 5.0 x 6.0 x 1.0 mm SOT-883 1.0 x 0.6 x 0.4 mm XDFN-4 0.8 x 0.8 x 0.4 mm Advanced 3D Packaging Custom 3D packaging connects different silicon die and discrete components together in the same package to dramatically save space and improve electrical performance by decreasing signal distances. •Stacking with or without wirebonds •Modular, scalable architectures with high degree of manufacturing testability •Mature, robust technologies and structures •RoHS-compliant and ISO-certified AYRE SA3291 - Wireless DSP SiP for Hearing Aids Capacitors Top Substrate Die Interposer Solder Connections Main Substrate Solder Pads Flip Chip Connections ON Semiconductor Page 3 PACKAGING Broad Packaging Portfolio Wireless Connectivity Solutions Features •Easy to use radio link •Best RX sensitivities in class •Best TX PA efficiencies in class •Optimized for lowest power consumption Development Software Support •AXRadioLAB configurator/application generator •AXCode::Blocks IDE CONNECTIVITY Device Page 4 Frequency Band (MHz) Type Data Transmission Standard Package AX5031 RF Transmitter 4-FSK; ASK; FSK; GFSK; MSK; PSK 400-470 800-940 QFN-20 AX5042 RF Transceiver ASK; FSK; GFSK; MSK; PSK 400-470 800-940 QFN-28 AX5043 RF Transceiver 4-FSK; AFSK; ASK; FM; FSK; GFSK; GMSK; MSK; PSK 27-1050 QFN-28 AX5051 RF Transceiver FSK; MSK; PSK; ASK 400-470 800-940 QFN-28 AX5243 RF Transceiver 4-FSK; AFSK; ASK; FM; FSK; GFSK; GMSK; MSK; PSK 27-1050 QFN-20 Internet of Things Solutions Wireless Connectivity Solutions Features •Easy to use radio link •Best RX sensitivities in class •Best TX PA efficiencies in class •Optimized modules and development kits Development Software Support CONNECTIVITY •AXRadioLAB configurator/application generator •AXCode::Blocks IDE Device Data Transmission Standard Frequency Band (MHz) Carrier Frequency (MHz) Package Type Description AX8052F131 RF Microcontroller Ultra-low Power RF Microcontroller 4-FSK; ASK; FSK; GFSK; MSK; PSK 400-470 800-940 — QFN-40 AX8052F151 RF Microcontroller Ultra-low Power RF Microcontroller FSK; MSK; PSK; ASK 400-470 800-940 — QFN-40 AX8052F143 RF Microcontroller Ultra-low Power RF Microcontroller 4-FSK; AFSK; ASK; FM; FSK; GFSK; GMSK; MSK; PSK 27-1050 — QFN-40 Sigfox™ Sigfox SoC for Up-Link and Down-Link RF 868.3 868.13 TX; 869.53 RX QFN-40 Sigfox Sigfox SoC for Up-Link and Down-Link RF 868.3 868.13 TX; 869.53 RX QFN-40 DVK-BASE-2-GEVK Evaluation Kit DVK-2 Base Evaluation Kit — — — Kit ADD5043-169-2-GEVK Evaluation Kit Add-on kit for DVK-2 Evaluation Kit — 169 — Kit ADD5043-433-2-GEVK Evaluation Kit Add-on kit for DVK-2 Evaluation Kit — 433 — Kit ADD5043-868-2-GEVK Evaluation Kit Add-on kit for DVK-2 Evaluation Kit — 868 — Kit AX-SIGFOX AX-SIGFOX-API ON Semiconductor Page 5 2.4 GHz IEEE 802.15.4-2006 Wireless Transceiver Low power, fully integrated system-on-chip for secure wireless connectivity INTERRUPT AND WAKEUP CONTROL ARM CORTEX −M3 Instruction NCS36510 Data BUS MATRIX I−code SWDIO D−code DMA 320 kB FLASH A CONNECTIVITY 320 kB FLASH B •Integrates ARM® Cortex-M3 32-bit µP, 640kB FLASH, 48 kB RAM, hardware accelerated MAC •AES 256 / 128 encryption engine •Peripherals: DMA, UART (x2), SPI (x2), I2C (x2), PWM, RTC, WDT, 18 GPIO, 10-bit ADC, programmable timers (x3), temperature sensor, supply voltage sensor •Programmable transmit power (up to ~8 dBm) •Receiver sensitivity less than –99 dBm •Antennae diversity •Supports external LNA & PA •<0.5 µA Timed Coma Mode Current •6.9 mW Transmit Mode Power Consumption •6.6 mW Receive Mode Power Consumption •VDD includes low voltage mode with operation down to 1.0 V Software Ecosystem System Bus 16 kB SRAM A RFPWR TX RX 32KO UART 2 MAC SPI 1 DEMODULATOR SPI 2 2 I C1 RF ANALOG CONTROL I2 C 2 CLOCK CTRL 32 kHz 32 MHz DIO[17:0] SUPPLY MONITOR RTC SAR ADC RESET CTRL V3V V1VO FVDDHI C R O S S B A R PWM WATCH DOG RESETN FVDDHO TEST GPIO 32KI V1VI RESETN UART 1 32MO 32MI DIO[11] VDDIO POWER SEQ RADIO DIO[12] PAD CONTROL TIMERS MODULATOR SWD_RESET TEST MODES FLASH CONTROL VPA SWO DIO[13] AHB to APB BRIDGE 16 kB SRAM B 16 kB SRAM C NCS36510 Features SERIAL WIRE DEBUG SWDCLK PMU DVDDA DVDD AVDDn FVDDL RVDDn MUX A[3:0] TEMP SENSOR 128 AES RANDOM NUMBER GENERATOR NCS36510 Block Diagram •2.4 GHz IEEE 802.15.4-2006 certified MAC/PHY •ZigBee® PRO support included (ZHA, ZSE 1.x, ZLL, etc.) •ZigBee IP support included (SE 2.0) •802.15.4-2006 compatible applications •Partner program for design services & support Page 6 Internet of Things Solutions PLC Modems/Power Line Driver Communication Coupling Application PHY MAC NCN49599 NCS5651 NCS5651 MCU NCN49597/AMIS49587 MCU(s) with Third Party SW Stack (G3-PLC, PRIME...) CONNECTIVITY OFDM S-FSK AC G3-PLC™ Reference Board Device Smart Grid Modem Smart Metering Modem Power Amplifier Function Features Package(s) PLC S-FSK Modem; A - D Band • ARM Cortex M0 • Baud rate: 4800 Bauds • S-FSK modulation • Hardware embedded MAC + PHY • Embedded 1.2 A, 2-stage power amplifier NCN49597 PLC S-FSK Modem; A - D Band • ARM Cortex M0 • Baud rate: 4800 Bauds • S-FSK modulation • Hardware embedded MAC + PHY QFN-52 AMIS49587 PLC S-FSK Modem; A & B Band • ARM7TDMi, 24 MHz core • Baud rate: 2400 Bauds • S-FSK modulation • Hardware embedded MAC + PHY QFN-52 NCS5651 Power Line Driver; Class AB • Low distortion power line driver with optimized interface for PLC modems • Capability to drive 2.0 A peak into reactive loads • Current shutdown minimizes power consumption during power down state • Rail-to-Rail Drop of Only ±1 V with Iout = 1.5 A NCN49599 ON Semiconductor QFN-56 with current limitation and thermal protection QFN-20 EP Page 7 KNX Transceivers KNX is a standardized (EN 50090, ISO/IEC 14543), OSI-based network communications protocol for intelligent buildings. KNX is the successor to, and convergence of, three previous standards: KNX Open Standards the European Home Systems Protocol (EHS), BatiBUS, and the European Installation Bus (EIB or Instabus). Applications •EN 50090: European Standard •ISO/IEC 14543-3: International Standard •GB/Z 20965: Chinese Standard •ANSI/ASHRAE 135: US Standard •Connects appliances and sensors, especially for climate and light control – wired or wireless – to the 9600 Baud KNX twisted pair (TP) bus inside a building CONNECTIVITY Data TP bus provides data communication and power supply RF Power TP Seamless KNX radio connectivity between application and target Application RF AX8052F143 Twisted Pair Multi/Ready 4 Efficiency Increase High Sensitivity 4 10/20 mA Bus Current Consumption Ultra Low Receive and Standby Current 4 5 to 40 mA Bus Current Consumption 4 KNX Bus Current Limitation PHY + MAC PHY + MAC Layer (TPUART Compatible) NCN5120 4 NCN5121 NCN5110 NCN5130 4 4 4 4 4 4 4 4 4 4 4 3.3 V Fixed DC/DC 4 4 4 4 Adjustable DC/DC 4 4 4 4 20 V LDO 4 4 4 4 PHY Layer (Analog Only) Analog Monitor Output Page 8 4 4 4 4 Internet of Things Solutions Wired M-BUS Transceiver Features CVDD μC VS VIO VDD TXI TX RX RXI PFb RIS RIS NCN5150 BUSL2 VB BUSL1 SC GND RIDD CSC CONNECTIVITY •Satisfies physical requirements for M-BUS, described in EN 13757-2 and EN 1434-3 •UART communication speeds up to 38400 baud •Integrated 3.3 V VDD LDO regulator (extended peak current of 15 mA) •Supports powering slave device from the bus or from external power supply •SOIC-16 and QFN-20 packages RBUS1 TVS1 MBUS RBUS2 STC RIDD CSTC General Application Diagram ON Semiconductor Page 9 Modems AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units •Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type 112 per FF-816) and PROFIBUS PA standards •Enables Fieldbus to completely power field devices using the integrated power supply block •Data rate: 31.25 kbps voltage mode •Low current consumption 500 μA typ •LQFP-44 and NQFP-44 packages CONNECTIVITY Process Sensor Microprocessor with RAM and ROM Industrial HART Protocol Modems Link Controller Fieldbus Segment Fieldbus MAU VDDA 1.8 V − 3.5 V •Single-chip, half-duplex 1200 bps FSK modem •Bell 202 shift frequencies of 1200 Hz and 2200 Hz •Transmit-signal wave shaping •Receive band-pass filter VDD VDDA RxAFI RxAF RxAP RESET VPOR HART IN RxAN KICK RxD HART Modems Device NCN5193 NCN5192 A5191HRT Page 10 TxD Input Frequency DAC 460.8 kHz, 920 kHz,or 1.8 MHz Integrated 16-bit Sigma-Delta 460.8 kHz, 920 kHz,or 1.8 MHz 460.8 kHz VDDA CD Integrated 16-bit Sigma-Delta External Temp Range (°C) Package μC RTS AREF NCN5193 CDREF CS DATA –40 to +85 QFN-32 CLK1 DAC CLK2 JUMP –40 to +85 QFN-32 –40 to +85 QFN-32, LQFP-32, PLCC-28 VDDA DACREF XOUT 3.6864 MHz HART & 4 – 20 mA OUT TxA SCLK TEST2 TEST1 XIN CBIAS VSS MODE Internet of Things Solutions CAN Transceivers for Long Networks, >500 m CAN BUS 1 VBAT 5 V−reg CD 100 nF EN2 Rx0 Tx0 Text Rint Features •ISO 11898-2 compliant •Up to 1 Mb/s communication speed •Delivers low transmit data rate in networks exceeding 1 km •Functional in 12 V and 24 V systems 10 Vref 8 13 CANH1 12 2 7 4 14 AMIS–42770 19 3 9 5 18 6 15 16 17 CANL1 RLT 60 CANH2 CANL2 RLT 60 CONNECTIVITY VCC EN1 CAN BUS 2 GND CAN Transceivers Device ON Semiconductor Type Description Package AMIS42770 Dual High-Speed CAN Repeater SOIC-20 AMIS42670 Single High-Speed CAN Transceiver for Long Networks SOIC-8 AMIS42671 Single High-Speed CAN Transceiver for Long Networks SOIC-8 AMIS42673 Single High-Speed CAN Transceiver for Long Networks SOIC-8 AMIS42675 Single High-Speed CAN Transceiver for Long Networks SOIC-8 Page 11 Motion Detector Passive Infrared Controller (PIR) — NCS36000 •Passive infrared controller circuit for the lighting and occupancy sensing market •Amplifies and conditions signal from PIR sensor CONNECTIVITY Features Benefits •3.0 – 5.75 V operation •Integrated low noise 2-stage amplifiers •Internal voltage reference to drive sensor •Internal oscillator with external RC •Single or dual pulse detection •Digital filter to minimize false alarms •Direct drive of LED and relay •Lower BOM cost than comparable discrete solutions •Extremely flexible solution •Customer can customize digital filtering •Customer can customize analog processing •Designed for wide range of occupancy sensors VSS VDD VREF LDO & Voltage References OP1_P OP1_N OP1_O OP2_N OP2_O Amplifier Circuit OSC System Oscillator Page 12 2 MODE Window 2 Comparator Digital Control Circuit xLED_EN LED OUT NCS36000 Old Solution NCS36000 Solution Internet of Things Solutions Power-Over-Ethernet (PoE ) Controllers Features – NCP1083 NCP1083, consisting of fully compliant PoE functionality and DC-DC controller, may be used to drive LED lamps. Additionally, lamps may be controlled remotely through PoE. •Emits white color of ~2700°K •LED lamp overall maximum power output 33 W •Peak efficiency ~89% •LED lamp powered by PSE directly over NCP1083 load switch circuitry; DC-DC controller can provide 3.3 V, 5 V or 15 V power supply •LED drivers operate in buck operation mode, switching frequency about 1.05 MHz, PWM dimming frequency 16 kHz •DC-DC controller working frequency up to 500 kHz, flyback topology used •Under-voltage startup level set to 38 V, or programmble down to 8.5 V; current limit 970 mA •Auxiliary input voltage range from 9.0 V to 57 V •Integrated DC-DC converter controller implements highly efficient power conversion at low output voltages in conjunction with auxiliary voltage input CONNECTIVITY IEEE 802.3at + Auxiliary, 40 W •Delivers 25.5 W for PoE+ IEEE 802.3at and up to 40 W in proprietary applications •Supports IEEE two event classification •Best-in-class cable ESD and thermal characteristics VAUX(+) 1SMA58A MBRS1100 Data Pairs VOUT VPORTP CLASS VDDL INRUSH NCP1083 ILIM1 MBRS1100 nCLASS_AT UVLO GATE AUX Spare Pins VPORTIN RTN COMP TL431 VAUX(–) Device Description Topology Control Mode VCC Min (V) VCC Max (V) NCP1080 PoE-PD Controller and DC-DC Converter Flyback Current 0 NCP1081 PoE-PD Controller and DC-DC Converter Flyback Current 0 NCP1082 PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current NCP1083 PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current NCP1090 PoE-PD Interface Controller — NCP1091 PoE-PD Interface Controller with Programmable UVLO — NCP1092 PoE-PD Interface Controller with Vaux Support NCP1093 PoE-PD Interface Controller NCP1094 PoE-PD Interface Controller with Vaux Support ON Semiconductor Pd Typ (W) Ron Typ (Ω) Package 57 15 0.6 TSSOP-20 57 40 0.6 TSSOP-20 0 57 15 0.6 TSSOP-20 0 57 40 0.6 TSSOP-20 — 0 57 15 0.5 SOIC-8, TSSOP-8 — 0 57 15 0.5 SOIC-8, TSSOP-8 — — 0 57 15 0.5 SOIC-8, TSSOP-8 — — 0 57 25 0.5 DFN-10 — — 0 57 25 0.5 DFN-10 Page 13 Smart Card Interfaces VDDP 10 uF VDD 100 nF 100 uF VDDP VDD Microcontroller R1 VDD R2 Features CONTROL DATAPORT CONNECTIVITY •ISO & EMV compliance •ESD protection on card pins up to +8kV (Human Body Model) INT NCN8024R CRD_PRES PORADJ CRD_PRES CMDVCC 5V/3V CRD_VCC CRD_RST CLKDIV1 CLKIN CRD_CLK CRD_AUX1 CRD_AUX2 CRD_IO RSTIN CRD_GND CLKDIV2 I/Ouc SMART CARD 100 nF 220 GND nF GND 1 2 3 4 DET DET Vcc RST CLK C4 GND Vpp I/O C8 5 GND 6 7 8 GNDP AUX1uc AUX2uc GND GND Ports Control Interface Card Type VDD mC Interface (V) Power Supply NCN6001 1 SPI A, B, C 2.7 – 5.5 NCN8024R 1 Parallel A, B 1/3 Parallel NCN8026 1 NCN4555 1 Device Smart Card NCN8025/A (SAM/SIM) (SAM/SIM) SAM Sequencer Card Detect Clock Divider Standards Package(s) Inductive DC-DC Yes Yes Yes ISO7816; EMV4.3 TSSOP-20, TLLGA-20 2.7 – 5.5 LDO Yes Yes Yes ISO7816; EMV4.3 SOIC-28W A, B, C 2.7 – 5.5 LDO Yes Yes Yes ISO7816; EMV4.3; UICC QFN-16, QFN-24 Parallel A, B, C 1.6 – 5.5 LDO Yes Yes Yes ISO7816; EMV4.3; UICC; SIM QFN-24 Parallel B, C 1.8 – 5.5 LDO No No No UICC; SIM QFN-16 NCN8024R Demo Board Page 14 Internet of Things Solutions MatrixCam™ Video Development Kit The MatrixCam Video Development Kit (VDK) enables fast time-to-market for IoT developers and innovators by providing vision and connectivity based on an open source platform solution. Features •1080p @ 30 fps video-on-demand, streaming over Ethernet & Wi-Fi® •Configurable resolution for HDR and linear video and still images •Live streaming and recording on local storage and over the cloud on wake-up from standby •Bluetooth® Low Energy (BLE) and PIR wake-up from standby •Android™ and iOS® app for device control and watching the stream remotely •AR023Z: 2 MP, 1/2.7-inch, 3 mm pixel, HDR CMOS Image Sensor with superior low light performance ON Semiconductor Description ON Semiconductor AR023Z 2 MP/1080p CMOS image sensor with superior low light performance Gainspan Wi-Fi Module GS2011M module streams data over Wi-Fi Bluetooth Module Noridc BLE nRF51822 TI DM368 ARM9 core, high performance digital media system on chip PIR Motion Sensor Triggers camera functions on motion detection Microphone Omnidirectional microphones LEDs For power, video streaming USB Port Provides power to board, firmware upgrades Battery 4200 mAH Lithium-ion battery Storage Micro SD card slot SENSING Major Components Page 15 Mainstream CMOS Image Sensors CFA Operating Temp (°C) ERS Color -30 to +70 ERS Color -30 to +70 3.8 ERS Color -40 to +105 5.6 ERS Color -40 to +105 60 fps 5.6 ERS Color -30 to +70 60 fps 6.0 ERS Color -40 to +105 1/3” 60 fps 6.0 GS Color, Mono, RCCC -40 to +105 WVGA 1/3” 60 fps 6.0 GS Color, Mono -30 to +70 0.5 1/5” 66 fps 3.8 ERS Color, RCCC -40 to +105 Sensor 1.2 1/4” 1.2 45 fps, 720p60 3.0 ERS Color -30 to +85 AR0140AT Sensor 1.0 1/4” 60 fps 3.0 ERS Color -40 to +105 AR0141CS Sensor 1.0 1/4” 1.2 45 fps, 720p60 3.0 ERS Color, Mono, RGB-IR -30 to +85 AR0130CS Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 ERS Color, Mono -30 to +70 AR0132AT Sensor 1.2 1/3” 1.2 45 fps, 720p 60 fps 3.8 ERS Color, Mono, RCCC -40 to +105 AR0134CS Sensor 1.2 1/3” 1.2 54 fps, 720p60 3.8 GS Color, Mono -30 to +70 MT9M021/31 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 GS Mono -30 to +70 MT9M024/34 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 ERS Color, Mono -30 to +70 MT9M114 SOC 1.3 1/6” 1.3 30 fps, VGA 75 fps 1.9 ERS Color -30 to +70 MT9M001 Sensor 1.3 1/2” 30 fps 5.2 ERS Mono 0 to +70 MT9D131 SOC 1.9 1/3.2” 1.9 15 fps, SVGA 30 fps 2.8 ERS Color -30 to +70 AR023Z Sensor 2.1 1/2.7” 1080p 60 fps 3.0 ERS, GRR RGB Bayer -30 to +85 AR0237 Sensor 2.1 1/2.7” 1080p60 3.0 ERS Color -30 to +85 AR0261 Sensor 2.1 1/6” 1080p60 1.4 ERS Color -30 to +70 AS0260 SOC 2.1 1/6” 30 fps 1.4 ERS Color -30 to +70 AR0231AT Sensor 2.3 — 40 fps 3.0 — RGB — AR0331 Sensor 3.1 1/3” 1080p60 2.2 ERS, GRR Color -30 to +85 AR0333 Sensor 3.1 1/3” 1080p30 2.2 ERS Color -30 to +85 AR0330 Sensor 3.5 1/3” 1080p60 2.2 ERS, GRR Color -30 to +70 AR0543 Sensor 5.0 1/4” 5 15 fps, 1080P 30fps 1.4 ERS Color -30 to +70 MT9P006 Sensor 5.0 1/2.5” 5 15 fps, 720p60 2.2 ERS, GRR Color -30 to +70 MT9P031 Sensor 5.0 1/2.5” 5 15 fps, 720p60 2.2 ERS, GRR Color, Mono -30 to +70 AR0833 Sensor 8.0 1/3.2” 8 30 fps, 1080P 30fps 1.4 ERS, GRR Color -30 to +70 AR0835 Sensor 8.0 1/3.2” 8 42 fps, 1080P 60fps 1.4 ERS, GRR Color -30 to +70 MT9J003 Sensor 10 1/2.3” 10 15 fps, 1080p60 1.7 ERS, GRR Color, Mono -30 to +70 AR1011HS Sensor 10 1” 60 fps 3.4 ERS Color -30 to +70 AR1335 Sensor 13 1/3.2” 13 30 FPS, 1080p 60 fps 1.1 ERS Color -30 to +70 MT9F002 Sensor 14 1/2.3” 14 13 fps 1.4 ERS, GRR Color -30 to +70 AR1820HS Sensor 18 1/2.3” 18 24 fps, 1080p 120 fps 1.3 ERS, GRR Color -30 to +70 Sensor/ SOC Resolution (MP) Optical Format Frame Rate MT9V115 SOC VGA 1/13” 30 fps 1.8 MT9V124 SOC VGA 1/13” 30 fps 1.8 ASX350AT SOC VGA 1/5” 60 fps digital, 30 fps analog ASX340AT SOC VGA 1/4” 60 fps digital, 30 fps analog ASX340CS SOC VGA 1/4” MT9V128 SOC VGA 1/3” MT9V024 Sensor WVGA MT9V034 Sensor ARX550AT Sensor AR0140CS Device Pixel Size (mm) Shutter Type1 SENSING 1. ERS = Electronic Rolling Shutter, GRR = Global Reset Release, GS = Global Shutter Page 16 Internet of Things Solutions Co-Processors for Mainstream CMOS Image Sensors Available Features Device Resoution (MP) Frame Rate (fps) Video Output Format Package AP0100AT 1 45 720p/60 fts, NTSC/PAL YUV VFBGA-100 AP0100CS 1 45 1.2 MP/45 fps; 720p/60 fps NTSC/PAL; YUV VFBGA-100 AP0101AT 1 45 1.2 MP/45 fts; 720p/60 fps SMPTE 296M; YUV VFBGA-81 AP0101CS 1 45 1.2 MP/45 fps; 720p/60 fps SMPTE 296M; YUV VFBGA-81 AP0102AT 1 — 1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps RGB; YUV VFBGA-100 AP0200AT 2 30 1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps H.264; MJPEG VFBGA-100 AP0201AT 2 30 1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps H.264; MJPEG VFBGA-100 AP0202AT 2 30 1.2 MP/45 fps; 720p/60 fps; 1080p/30 fps RGB565; RGB888; YUV VFBGA-100 AP1302 13 30 13 MP/30 fps; 1080p/120 fps JPEG; RAW; RGB565; RGB888; YUV VFBGA-120 ON Semiconductor Page 17 SENSING •HDR with ALTM •Dewarp, up to 165 degrees •Spatial Transform Engine Software Add-on •Overlays •GPIOs, up to 5 •Color Pipe • Noise reduction • Demosaic • Auto exposure • Gamma correction • Auto white balance • Flicker detection • Defect correction High Performance CMOS Image Sensors VITA image sensors combine flexibility in configuration and resolution with high speed and high sensitivity, addressing a wide range of customer requirements in a cost-effective family of rolling/global shutter CMOS image sensors. A flexible read-out architecture makes them well suited for machine vision, intelligent transportation systems and surveillance, and other applications that demand high functionality, while delivering excellent image quality. Features •1.3 to 25 Megapixels •Pipelined and triggered global shutter with dual readout •Rolling shutter with CDS •Quadratic speed increase with ROI windowing •Multiple regions of interest VITA 5000 VITA 25K Device SENSING VITA 1300 VITA 2000 VITA 5000 VITA 12K VITA 16K VITA 25K Resolution (MPix) Pixel Count (H x V) Pixel (mm) Diagonal (mm) Lens CFA1 FPS Max Evaluation Kit 1.3 2.3 5.3 12.6 16.8 26.2 1280 x 1024 1920 x 1200 2592 x 2048 4096 x 3072 4096 x 4096 5120 x 5120 4.8 4.8 4.8 4.5 4.5 4.5 7.9 10.9 15.9 23.0 26.1 32.6 1/2” 2/3” 1” 4/3” APS-H APS-H C/M C/M C/M C/M C/M C/M 150 90 75 160 125 80 3 3 3 3 3 3 1. CFA Options – Bayer Color (C), Monochrome (M). KAC image sensors provide both global shutter and low noise rolling shutter modes, combined with programmable bit depth (8 to 14 bit) with a flexible readout architecture that supports interspersed video streams. These features enable the use of multiple regions of interest that can simultaneously monitor both wide areas and local regions, making these devices ideal for machine vision, surveillance, ITS, and analytical microscopy. Features •Global shutter, low noise rolling shutter •Programmable bit depth •Interspersed video streams •Multiple regions of interest •High frame rates •High NIR sensitivity KAC-12040 KAC-06040 Resolution (MPix) Pixel Count (H x V) Pixel (mm) Diagonal (mm) Lens CFA1 FPS Max Evaluation Kit KAC-06040 6 2832 x 2128 4.7 16.7 1” C/M 160 3 KAC-12040 12 4000 x 3000 4.7 23.5 4/3” C/M 70 3 Device 1. CFA Options – Bayer Color (C), Monochrome (M). Page 18 Internet of Things Solutions High Speed CMOS Image Sensors LUPA devices offer resolution as high as 2048 x 2048 and frame rates up to 500 fps. These features, combined with a power consumption as low as 150 mW with absolutely no blooming or lag, create a perfect foundation for highly reliable, high sensitivity image sensors. Features •Frame rates up to 500 fps at several megapixel resolutions •Unprecedented sensitivity •Pipelined global shutter •Low power dissipation •High resolution •No blooming or image lag •Mono and color variants LUPA 4000 Device Resolution (MPix) Pixel Count (H x V) Pixel (mm) Diagonal (mm) Lens CFA1 FPS Max Evaluation Kit LUPA 300 0.3 640 x 480 9.9 7.9 1/2” C/M 250 3 LUPA 1300-2 1.3 1280 x 1024 14 22.9 1” C/M 500 3 LUPA 3000 3 1696 x 1710 8 19.3 1” C/M 485 3 LUPA 4000 4 2048 x 2048 12 34.8 35 mm C/M 15 3 1. CFA Options – Bayer Color (C), Monochrome (M). ON Semiconductor Page 19 SENSING LUPA 3000 PYTHON CMOS Image Sensors With resolutions from VGA to 25 megapixels, the PYTHON family of image sensors addresses the needs of general purpose industrial imaging applications such as machine vision inspection and motion monitoring, security, surveillance, and intelligent transportation systems (ITS). Combining flexibility in configuration and resolution with high speed and high sensitivity, these devices capture fast moving scenes without distortion by combining low read noise and high sensitivity with frame rates up to 815 fps. Features •CDS global shutter technology with low noise performance •True HW scalable family concept •High configurability and fast adaptability •Quadratic speed increase with ROI windowing •Multiple regions of interest •High dynamic range •Color, Monochrome, and Enhanced NIR configurations •Standard and protective tape configurations Device PYTHON 300 Resolution (MPix) Pixel Count (H x V) Pixel (mm) Diagonal (mm) Lens CFA1 FPS Max Evaluation Kit 0.3 640 x 480 4.8 3.8 1/4” C/M/NIR 815 3 SENSING PYTHON 500 0.5 800 x 600 4.8 4.8 1/3.6” C/M/NIR 545 3 PYTHON 1300 1.3 1280 x 1024 4.8 7.9 1/2” C/M/NIR 210 3 PYTHON 2000 2.3 1920 x 1200 4.8 10.9 2/3” C/M/NIR 225 3 PYTHON 5000 5.3 2592 x 2048 4.8 15.9 1” C/M/NIR 100 3 PYTHON 10K 11.1 3840 x 2896 4.5 21.6 4/3 C/M/NIR 175 3 PYTHON 12K 12.5 4096 x 3072 4.5 23.0 4/3 C/M/NIR 160 3 PYTHON 16K 16.8 4096 x 4096 4.5 26.1 APS-H C/M/NIR 120 3 PYTHON 25K 26.2 5120 x 5120 4.5 32.6 APS-H C/M/NIR 80 3 1. CFA Options – Bayer Color (C), Monochrome (M), Enhanced NIR (NIR). Page 20 Internet of Things Solutions Full Frame CCD Image Sensors From the intricacies of microscopy to the far reaches of astrophotography, Full Frame CCD image sensors deliver high performance results. With high quantum efficiency across the entire visible spectrum, these sensors are ideal for demanding imaging applications that can accommodate a mechanical shutter or strobe illumination, such as electronic still photography, medical X-ray, and inspection. Features •High resolution •Support for large sensor formats •Simple, two-phase clocking •Very low dark current for long exposures •Vertical and horizontal binning Full Frame CCD Image Sensors Pixel Count Pixel (mm) Diagonal (mm) Lens CFA1 FPS Max Evaluation Kit KAF-0261 VGA 512 x 512 20.0 14.5 1” M 15.0 3 KAF-0402 WVGA 768 x 512 9.0 8.3 1/2" M 20.0 3 KAF-1001 1.0 1024 x 1024 24.0 34.8 APS-H M 3.0 3 KAF-1603 1.6 1536 x 1024 9.0 16.6 1” M 2.2 3 KAF-3200 3.3 2184 x 1510 6.8 18.0 4/3” M 2.5 3 KAF-4320 4.3 2084 x 2084 24.0 70.7 645 M 2.0 3 KAF-6303 6.3 3088 x 2056 9.0 33.4 APS-H M 0.6 3 KAF-8300 8.3 3326 x 2504 5.4 22.5 4/3” C/M 2.9 3 KAF-09000 9.3 3056 x 3056 12.0 51.9 645 1.3x M 0.4 KAF-16200 16.2 4500 x 3600 6.0 34.6 APS-H C/M 1.5 KAF-16801 16.8 4096 x 4096 9.0 52.1 645 1.3x M 0.4 KAF-16803 16.8 4096 x 4096 9.0 52.1 645 1.3x M 0.2 KAF-40000 40.0 7304 x 5478 6.0 54.8 645 1.3x C 1.3 KAF-50100 50.1 8176 x 6132 6.0 61.3 645 1.1x C/M 1.0 SENSING Resolution (MPix) Device 3 1. CFA Options – Bayer Color (C), Monochrome (M). ON Semiconductor Page 21 Interline Transfer CCD Image Sensors With an integrated electronic shutter, Interline Transfer CCD image sensors provide real time imaging in applications where a mechanical shutter or strobe illumination is either not required or desired. With progressive scan readouts, they are particularly well suited for machine vision, microscopy, fluoroscopy, and other applications that demand the highest imaging performance. Most 5.5 mm and 7.4 mm devices share common pin-out and electrical connections, allowing a single camera design to support a full family of products. Features •Progressive scan with electronic shutter and anti-blooming support •High resolution •High sensitivity •Low image lag and smear 5.5 mm Interline Transfer CCD Image Sensors Resolution (MPix) Pixel Count KAI-0330 VGA 648 x 484 9 KAI-0340 VGA 640 x 480 7.4 KAI-0373 WVGA 768 x 484 11.6 x 13.6 11.1 2/3” M 30 0.9 1280 x 720 5.5 8.1 1/2” C/M/S 138 3 KAI-1003 1 1024 x 1024 12.8 18.5 4/3” M 30 3 KAI-1010 1 1008 x 1018 9 12.9 1” M 30 1 1000 x 1000 7.4 10.5 2/3” C/M 50 3 Device SENSING KAI-011502 KAI-1020 KAI-01050 Pixel (mm) Diagonal (mm) Lens CFA1 FPS Max Evaluation Kit 7.3 1/2” C/M 120 3 5.9 1/3” C/M 210 3 1 1024 x 1024 5.5 8 1/2” C/M 120 3 KAI-2001 1.9 1600 x 1200 7.4 14.8 1” C/M 30 3 KAI-2020 1.9 1600 x 1200 7.4 14.8 1” C/M 30 3 KAI-020502 1.9 1600 x 1200 5.5 11.1 2/3” C/M 68 3 KAI-02170 2 2.1 1920 x 1080 7.4 16.3 1” C/M/S 60 3 KAI-021502 2.1 1920 x 1080 5.5 12.1 2/3” C/M/S 64 3 KAI-04070 2 4.2 2048 x 2048 7.4 21.4 4/3” C/M/S 28 3 KAI-040502 4.1 2336 x 1752 5.5 16.1 1” C/M/S 32 3 2 KAI-08051 8.1 3296 x 2472 5.5 22.7 4/3” C/M/S 16 3 KAI-08670 8.6 3600 x 2400 7.4 32.0 APS-H C/M/S 12 3 KAI-11002 10.7 4008 x 2672 9 43.4 35 mm C/M 5 3 KAI-16000 15.8 4872 x 3248 7.4 43.3 35 mm C/M 3 KAI-160502 16 4896 x 3264 5.5 32.4 APS-H C/M/S 8 3 2 15.7 4864 x 3232 7.4 43.2 35 mm C/M/S 8 3 KAI-290502 28.8 6576 x 4384 5.5 43.5 35 mm C/M/S 4 3 KAI-47051 46.8 8856 x 5280 5.5 56.7 645 1.1x C/M/S 7 3 2 KAI-16070 1. CFA Options – Bayer Color (C), Monochrome (M), and Sparse CFA (S). 2. Pin and Electrically Compatible. Page 22 Internet of Things Solutions Interline Transfer EMCCD Image Sensors Combining the high sensitivity of an electron-multiplied output register with the pixel uniformity and resolution scalability available from Interline Transfer CCDs, KAE devices enable the capture of scenes with widely varying lighting conditions – from sunlight to starlight – in a single image and from a single camera. This flexibility makes them ideal for light starved applications such as surveillance, scientific imaging, medical imaging, and intelligent transportation systems. US export controls currently apply to all shipments of KAE devices designated for destinations outside of the US and Canada, requiring ON Semiconductor to obtain an export license from the US Department of Commerce before image sensors or evaluation kits can be exported. Features •86 dB dynamic range with 1 electron read noise •Progressive scan readout •High sensitivity, low noise architecture •Excellent smear performance KAE-02150 Resolution (MPix) Pixel Count Pixel (mm) Diagonal (mm) Lens CFA FPS Max Evaluation Kit 2.1 1920 x 1080 5.5 12.1 2/3” C/M 30 3 Linear CCD Image Sensors Linear CCD image sensors combine high resolution with high dynamic range, making them ideal for use in applications such as flatbed scanners, high-speed document scanners and copiers, machine vision cameras, and satellite imaging. Features •High dynamic range •Pinned photodiodes for low lag and low dark current •Channel independent electronic exposure control •Single output per color, including multi-readout register architectures •High data rates Device KLI-2104 Linear CCD Image Sensors Pixel Count Pixel (mm) Diagonal (mm) CFA1 4196 x 1, 2098 x 3 7.0, 14.0 29.4 Luma+C Evaluation Kit KLI-2113 2098 x 3 14 29.4 C/M 3 KLI-4104 8160 x 1, 4080 x 3 5.0, 10.0 40.8 Luma+C/M 3 KLI-8023 8002 x 3 9 72 C/M 3 1. CFA Options – Bayer Color (C), Monochrome (M). ON Semiconductor Page 23 SENSING Device KAE-02150 Image Sensor Image Sensor Evaluation Support ON Semiconductor provides supporting hardware and software to qualified engineering teams to accelerate product development. These kits contain everything necessary to build a working prototype with test functionality. SENSING Page 24 Internet of Things Solutions Ambient Light & Proximity Sensors Features •Design flexibility/customization (i.e., EEPROM if desired for trimming) •0.0125 lux detection with customizable filtering (i.e., Photopic Light Response) •Dark current and temperature compensation •Lowest power consumption per resolution bit •I2C Interface (including High Speed Mode) and no effect on bus during power down hν 1k VDD 16-Bit ADC Voltage Supply 0.1 μF SCL I2C Bus SD LV0104CS LED Drivers MCU CPU LEDs SCL When the Sunlight is Strong, Extending the Dynamic Range by Lowering Gain VCC SW 0.1 μF Control Logic SDA SDA Ambient Light 1 μF Sensor VSS SCL VCC Approximates Human Eye Response 1k Amp OUT Gain Cont. I/O CPU ADC Current-Voltage Conversion Simple 2-Wire I2C Interface LA0151CS GND GND Device Special Features IO Typ @ E V = 100 Lux (mA) Output Interface Vin Range (V) TA Range (°C) Package LA0151CS 2-Stage Gain Switching 8 (high gain) Analog, linear current 2.2 - 5.5 -30 to +85 ODCSP-4 LV0104CS Integrated Sleep Mode — I2C, 16-bit ADC 2.3 - 3.6 -30 to +85 ODCSP-4 LV0111CF Standby Function 21 Analog, logarithmic current 2.3 - 5.5 -30 to +85 ODCSP-4J NOA1212 Dark Current Compensation 51 (high gain) Analog, linear current 2.0 - 5.5 -40 to +85 CUDFN-6 NOA1213 Dark Current Compensation — Analog 2.0 - 5.5 -40 to +85 CUDFN-6 NOA1305 Dark Current Compensation — I2C, 16-bit ADC 2.4 - 3.6 -40 to +85 CUDFN-6 NOA3302 Proximity Sensor — I2C, 16-bit ADC 2.3 - 3.6 -40 to +80 CWDFN-8 ON Semiconductor Page 25 SENSING Voltage Supply Vin = 3.3 V Capacitive Touch Sensors Design-Friendly, Low-Cost Operation, High Reliability •Adhesive free •Reduce manufacturing cost and improve reliability by eliminating existing adhesive process •Long sensor trace •Provide flexible PCB design •Wide range operational temperature •No extra components •High noise immunity •Available in high-temperature environment •Reduce BOM •Improve stability and reliability SENSING Door Phone Light Switch Control Panel Page 26 Internet of Things Solutions Capacitive Touch Sensors LC717A00 & LC717A10 Overview LC717A00 and LC717A10 are high performance, cost-effective capacitance-to-digital converters, with 8- or 16-channel capacitance-sensor inputs, for use with touch switch applications, replacing older mechanical switches. Use of patented sensing technology and automatic calibration enables faster, more precise response than existing self-capacitive sensing products. LC717A00 & LC717A10 Features By eliminating the need for adhesives between the overlay material and sensor, the devices deliver better sensitivity and touch performance, and enable operation using a gloved hand or in a wet environment. The differential sensor implementation is less susceptible to electro-magnetic interference (EMI), making the devices better suited to demanding applications. SENSING •Detection method: Differential mutual detection •Detection resolution: 0.1 femtofarad •Measurement interval: •LC717A00: (8 channel) minimum 3.0 ms, 18 ms typical •LC717A10: (16 channel) minimum 6.0 ms, 30 ms typical •External components for measurement: None •Supply voltage 2.6 to 5.5 V •Current consumption: •LC717A00: 320 mA with VDD = 2.8 V, 740 mA with VDD = 5.5 V •LC717A10: 570 mA with VDD = 2.8 V, 1300 mA with VDD = 5.5 V •Package: •LC717A00AR and LC717A10AR = VCT-28 •LC717A00AJ and LC717A10AJ = SSOP-30 •Interface: I2C or SPI, pin selectable: •Input control of gain and threshold levels •Output switch position and 8 bit digital data per switch Cin0 Cin1 Cin2 Pout0 Cref Pout1 Cin0 Pout2 Cin1 Pout3 Cin2 Cin3 Cin4 A/D CONVERTER AMP MUX Pout4 Pout5 Pout6 Cin5 Pout7 Cin6 Cdrv Cin7 SDA/SI VDD Cin4 VSS Cin5 Cin6 Cin7 Cin8 A/D CONVERTER AMP MUX Cin9 Cin10 Cin11 Cdrv CONTROL LOGIC Cin12 INTOUT Cin13 CONTROL LOGIC nCS SCL/SCK Cin3 ERROR Cin14 INTOUT Cin15 nRST nCS nRST SA/SO POR OSCILLATOR LC717A00 Block Diagram ON Semiconductor POR GAIN I2C/SPI VDD VSS Cref CrefAdd OSCILLATOR SCL/SCK I2C/SPI MUX SDA/SI SA0/SO SA1 LC717A10 Block Diagram Page 27 Temperature Sensors VDD 3.0 V To 5.5 V CBYPASS ADDRESS (SET AS DESIRED) 5 A2 6 A1 1 7 A0 OS/ALERT NCT375 3 4 SDA 2 SCL SERIAL INTERFACE NOTE: SDA, SCL AND OS/ALERT PINS REQUIRE PULL-UP RESISTORS TO VDD GND Typical Application Diagram Sensor Type Data Transmission Standard ICC Max (mA) NCT375 Local SMBus 0.575 NCT203 Local I2C 44 µA NCT475 Local SMBus 0.575 3 NCT75 Local SMBus 0.575 NCT218 Remote I2C — NCT210 Local & Remote SMBus 0.37 NCT214 Local & Remote SMBus NCT72 Local & Remote I2C Device SENSING Page 28 VCC Max (V) Temperature Error (°C) VCC Min (V) T Min (°C) T Max (°C) 3 5.5 -55 125 ±1 Micro8™ 1.6 2.75 -40 125 ±1.75 WDFN-8, WLCSP-8 5.5 -55 125 ±1 WLCSP-6 3 5.5 -55 125 ±1 DFN-8, Micro8, SOIC-8 1.6 2.75 — — — WDFN-8, WLCSP-8 3 5.5 -65 125 ±3 QSOP-16 0.35 3 3.6 -40 125 ±1 WDFN-10 0.35 2.8 3.6 -40 125 ±1 DFN-8, WDFN-8 Package Internet of Things Solutions JFETs for Infrared (IR) Sensing JFET 1 D 2 Thermal Energy S R 3 G VGDO Min (V) IDSS Min (mA) IDSS Max (mA) |yfs| Typ (mS) Ciss Typ (pF) Crss Typ (pF) Package TF412S 30 1.2 3 5 4 1.1 SOT-883 TF414 40 0.05 0.13 0.11 0.7 0.3 SOT-883 2SK545 40 0.055 0.095 0.13 1.7 0.7 CP (SOT-23) 2SK3666 30 0.6 3 6.5 4 1.1 CP (SOT-23) Device ON Semiconductor SENSING Infrared Sensor for White Goods, Security, and Lighting Page 29 Battery-Free Wireless Sensors Introducing the World’s First Battery-Free, µC-Free Sensor Tag Breakthrough Sensor Technology Implemented on RFID Smart Passive Sensors Single chip; µC free; adaptable RF front end No batteries; energy harvesting Temperature, Pressure, Moisture, Proximity Features SENSING •Battery-free and wireless Ideal for locations with limited access •underground, within walls, intrusive to body, within boxes, toxic or dangerous locations •Ultra-thin Ideal for space-constrained applications •Within doorways, within RFID tags, peel and stick, bandages •Low cost to scale Effective where multiple sensors are required •Disposable products, multiple data points, increasing needs over time Device Page 30 Benefits Sensing Functions Sensor Reading Sensitivity Surface Placement SPS1M001 Moisture + Proximity Low Sensitivity Metal SPS1M002 Moisture + Proximity Low Sensitivity Non-Metal SPS1M003 Moisture + Proximity High Sensitivity Non-Metal SPS1T001 Temperature + Proximity 0 to +50°C (±0.3°C) or -40 to +85°C (±1°C) Non-Metal Internet of Things Solutions Full Bridge Rectifier for Wireless Charging Features – NMLU1210 •Full Bridge Rectification block - up of 3.2 A of operation •Low RDS(ON) minimizes conduction losses •Low profile UDFN-8 package (4 x 4 x 0.55 mm) MOSFET SCHOTTKY Device VLL (V) ID (A) RDS(ON) Max @ VGS = 10 V (W) VR (V) VF (A) IF (A) Package(s) NMLU1210 20 3.2 0.017 20 0.45 3.2 UDFN-8 Vout C1 C2 A1 A2 D1 AC Input S1 G1 L1_2 D2 DC Output G2 S2 GND2 GND1 GND1 AC-DC Drivers + Controller + V/I Sensing Transmitter ON Semiconductor GND2 NMLU1210 AC-DC DC-DC Step Down and Control POWER MANAGEMENT L1_1 Vout Receiver Page 31 LC709203F High Accuracy Fuel Gauge LSI Fuel Gauge for 1 Cell Li+ with Low Power and with No Sense Register Conventional Display Features •Accuracy of remaining capacity ±2.8% (0 ~ +50°C) •Active mode current of 15 μA •Hibernate mode current of 2 μA •Standby mode current (RAM retention) of 0.1 µA •No need for sense register for current detection With LC709203F Standby Time 120 h Call Time 75 min Correct Operating Time Detailed Display of Remaining Capacity 100 80 80 70 70 60 60 50 50 40 40 30 30 POWER MANAGEMENT Load: 50 mA Battery: DB-L50 Typ 1900 mAh 20 Room Temp Battery: DB-L50 Typ 1900 mAh 10 10 0 100 500 mA 750 mA 1000 mA 1250 mA 1500 mA Ideal 90 Disp (%) Disp (%) 100 0°C Room Temp 50°C Ideal 90 20 77% 90 80 70 60 50 40 30 20 10 0 0 100 90 80 70 60 50 40 30 Real (%) Real (%) Ideal vs. Display (by Temperature) Ideal vs. Display (by Load) 20 10 0 Discharge Characteristics Page 32 Internet of Things Solutions LDO Regulators Iout (mA) Dropout Typ @ 3.3 V (mV) Iq (mA) P SRR @ 120 Hz (dB) Vin Max (V) Vout (V) Package(s) NCP785A 10 - 12 80 450 3.3, 5.0, 12, 15 SOT-89-3 NCP508 50 180 145 70 13 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SC-70-5, WDFN-6 NCP715 50 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6 NCP716 80 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6 NCP120 150 30 80 72 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6 NCP571 150 450 40 - 12 0.8, 0.9, 1.0, 1.2 TSOP-5, DFN-6 NCP170 150 240 0.5 40 5.5 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SOT-563, uDFN-4 NCP700B 200 118 70 82 5.5 1.8, 2.8, 3.0, 3.3 WDFN-6, TSOP-5 NCP702 200 140 10 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5 NCP752 200 130 12 68 6 1.8, 2.8, 3.0, 3.3 SOT-23-5, XDFN-6 NCP160 250 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4 NCP703 300 180 12 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5 NCP130 300 60 80 75 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6 Device 450 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4 NCP3335A 500 250 190 75 18 Adj., 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 5.0 Micro8, DFN-10 NCP3334 500 250 190 75 18 Adj. SOIC-8 NCP705 500 250 12 70 6 0.8, 1.8, 2.8, 3.0, 3.3 SOT-223-6, WDFN-6 NCP5500 500 230 300 75 18 Adj., 1.5, 5.0 DPAK-5, SOIC-8 NCP133 500 140 80 72 6 Adj, 0.9, 1.0, 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.8 XDFN-6 NCP59748 1.5 60 - 70 6 Adj. DFN-10, QFN-20 NCP59744 3 100 - 70 6 Adj. QFN-20 POWER MANAGEMENT NCP161 ON Semiconductor Page 33 Power Supply/Management, Voltage Regulation N L POWER SUPPLY/MANAGEMENT DC-DC Converters High Voltage AC-DC Switching Regulator Device NCP1010~15 NCP1070~77 NCP1027/28 AC-DC NCP1124/26/29 NCP1050~5 NCP3170 NCP3063/4 DC-DC Function LDO Voltage Regulators Features Package •Dynamic self-supply, no need of an auxiliary winding •Current-mode fixed frequency (options of 65 kHz, 100 kHz, 130 kHz) •700 V, 5.8 W FET current-mode fixed frequency (65 kHz, 100 kHz) •650 V, 9/6/2 W rugged FET current-mode fixed frequency (65 kHz, 100 kHz) •Oscillator frequency (options of 44 kHz, 100 kHz, 136 kHz) dithering with High Voltage Gated Oscillator Monolithic controlled slew rate driver for reduced EMI Switching Regulator •Startup circuit eliminates the need for transformer auxiliary bias winding •Output voltage adjustable to 0.8 V 3 A Switching Regulator •500 kHz or 1 MHz switching frequency 1.5 A Switching Regulator or utilize as controller •Capable of 40 V input for up to 5 A •Up to 250 kHz switching frequency Self-Supply High Voltage Monolithic Switching Regulator for Low Power Offline Power Supplies High Voltage Monolithic Switching Regulator for Medium Power Offline Power Supplies LM2594/5/6 0.5 A/1.0 A/3 A Switching Regulators NCP3020/11 PWM Controller NCP1034 PWM Controller •Capable of 40 V input •Fixed 150 kHz switching frequency •4.7-28 V input voltage range • EN/PG/SYNC features • Fixed 300/400/600 kHz switching frequency •Capable of up to 100 V input •Adjustable switching frequency (50-500 kHz) PDIP-7, SOT-223 PDIP-7 SOT-223 SOIC-8 SOIC-8 TO-220, DPAK, SOIC-8, PDIP-8 SOIC-8, TSSOP-14 SOIC-16 POWER MANAGEMENT Page 34 Internet of Things Solutions Power MOSFETs for Circuit Breakers and Metering Power Supplies Features ≤AC 240 V AC 380 V to 480 V BFL4004 BFL4026 BFL4001 2SK3745LS 2SK4177 2SK3746 2SK3747 2SK3748 NDFPD1N150C NDFP03N150C NDTL03N150C NDUL03N150C NDUL09N150C WPH4003 DC Output 1 DC Output 2 Feedback Circuit Low Saturation Voltage BJT for Over Current Sensing Circuit 2SC6144SG: 50 V/10 A TO-220F-3FS 2SC5707: 50 V/8 A TP, TP-FA VDDS (V) ID (A) 800 900 900 1500 1500 1500 1500 1500 1500 1500 1500 1500 1500 1700 6.5 5 6.5 2 2 2 2 4 0.1 2.5 2.5 2.5 9 3 RDS(ON) (Ω) @ 10 V Typ Max Ciss (pF) Qg (nC) G-S Protection Diode Package 1.9 2.8 2.1 10 10 10 10 5 100 8 8 8 2.2 8.2 2.5 3.6 2.7 13 13 13 13 7 150 10.5 10.5 10.5 3 10.5 710 650 850 380 380 380 380 790 80 650 650 650 2400 850 36 33 44 37.5 — — — 80 4.2 34 34 34 130 48 — — — Built in Built in Built in Built in Built in — — — — — — TO-220F TO-220F TO-220F TO-220F TO-263 (D2PAK) TO-3P TO-3PF TO-3PF TO-220F TO-220F TO-3P TO-3PF TO-3PF TO-3PF POWER MANAGEMENT AC 590 V to 690 V Device Output 1 Output 2 Driver •High reliability •Low power dissipation •Avalanche ruggedness •High-speed switching Power Source Voltage Transformer/ Primary Side Clamper Circuit Rectifier Bridge AC Input Voltage ON Semiconductor Page 35 Motor Drive for Small Motor Control MOTOR CONTROL Stepper Motor Driver for Paper Feed – DC 3~12 V LV8716QA, LV8711T, LV8712T, LV8713T, LB1935FA, LB1940T, LV8548MC, LV8549MC DC Motor Driver for Paper Cut – DC 3~12 V LB1938FA, LV8400V, LV8417CS Hand Terminal (POS) Printer Stepper Motor Driver for Zoom/Focus – DC 5 V LV8044LP, LV8414CS, LV8411GR, LV8413GP, LV8080LP, LV8716QA Stepper Motor Driver for Panning/Tilt - DC 12 V LV8714TA, LV8711T, LV8712T, LV8713T, LV8402GP, LV8548MC Security Camera Device LV8413GP LV8080LP LV8411GR LV8414CS LV8044LP LB1935FA LB1938FA LB1940T LV8417CS LV8716QA LV8400V LV8402GP LV8711T LV8712T LV8713T LV8714TA LV8548MC LV8549MC Page 36 Type VM Max (V) VCC Max (V) IO Max (A) Step Resolution Control Type Current Sense Package(s) Stepper / 2 x Brush DC Stepper 2 x Stepper / 4 x Brush DC 2 x Stepper 6 x H-Bridge Stepper Brush DC Stepper Brush DC Stepper / 2 x Brush DC Brush DC Stepper / 2 x Brush DC Stepper / 2 x Brush DC Stepper Stepper 2 x Stepper / 4 x Brush DC Stepper / 2 x Brush DC Stepper 6 6.5 6 6 6 8 10.5 10.5 12.6 12.6 16 16 18 18 18 18 20 20 6 6.5 6 6 6 — — — 6 — 6 6 6 6 6 — — — 0.4 0.4 0.4 0.4 0.4 0.4 0.8 0.4 1 1 1.2 1.4 0.8 0.8 0.8 1.5 1 1 1/2 1/2 1/2 1/64 1/16 Full Step — 1/2 — 1/2 — 1/2 1/2 1/8 1/32 Free 1/2 Full Step Parallel Parallel Parallel Clock Clock/Prallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Parallel Clock Clock Parallel Parallel Parallel None External Resistor None External Resistor External Resistor None None None None External Resistor None None External Resistor External Resistor External Resistor External Resistor None None VCT-16 VCT-16 VCT-24 WLP-32K VQLP-40 Micro10 Micro8 TSSOP-20 WLP-9 QFN-16 SSOP-16 VCT-24 TSSOP-24 TSSOP-24 TSSOP-24 TQFP-48EP SOIC-10 SOIC-10 Internet of Things Solutions MOSFET Driver MOSFET Features MOSFET Driver High Side Driver •Low RDS(on) improves efficiency by reducing conduction loss •Low Gate Charge reduces dynamic power loss •Extensive voltage lineup MOTOR CONTROL MOSFETs and MOSFET Drivers for Motor Control High Side Driver M Low Side Driver Low Side Driver Power MOSFETs Device ATP208 ATP401 2SK4066 NDBA170N06A NDBA100N10B NDBA180N10B CPH3461 PCP1405 SFT1452 NDDP010N25AZ FW297 FW4604 ECH8690 FW389 ATP108 ATP304 BBS3002 SMP3003 BMS3004 Channel VDS (V) ID (A) RDS(on) (mW) Qg (nC) Package N N N N N N N N N N N+N P+N P+N P+N P P P P P 40 60 60 60 100 100 250 250 250 250 60 30 60 100 -40 -60 -60 -75 -75 90 100 100 170 100 180 0.35 0.6 3 10 4.5 -4.5/6 -3.5/4.7 -2/2 -70 -100 -100 -100 -68 6 3.7 4.7 3.3 6.9 2.8 6500 6500 2400 420 58 65/39 94/55 300/225 10.4 6.5 5.8 8 8.5 83 300 220 280 35 95 2.1 2.1 4.2 16 14 7.5/9.1 15/18 21/10 79.5 250 280 280 300 ATPAK ATPAK D2PAK, I2PAK D2PAK D2PAK D2PAK CPH-3 PCP-1 (SOT-89) DPAK, IPAK DPAK, IPAK SOIC-8 SOIC-8 ECH-8 SOIC-8 ATPAK ATPAK D2PAK, I2PAK D2PAK, I2PAK TO-220F-3FG Number of Drivers Vin Max (V) Drive Source/Sink Typ (mA) Package 1 1 2 2 2 2 2 2 2 625 625 625 25 25 25 25 25 25 200/400 200/400 200/400 1000/1000 1000/1000 1000/1000 800/1000 800/1000 800/1000 SOIC-8 VEC-8 SOIC-8 SOIC-8 SOIC-8 SOIC-8 VEC-8 VEC-8 VEC-8 MOSFET Drivers Device TND523SS TND524VS TND525SS TND314S TND315S TND316S TND321VD TND322VD TND323VD Description Single Input High Voltage High Side MOSFET Driver Single Input High Voltage High Side MOSFET Driver Dual Input High Voltage High and Low Side MOSFET Driver Dual Low Side Driver(Dual Inverter) Dual Low Side Driver(Dual Buffer) Dual Low Side Driver(Inverter and Buffer) Dual Low Side Driver(Dual Inverter) Dual Low Side Driver(Dual Buffer) Dual Low Side Driver(Inverter and Buffer) ON Semiconductor Page 37 USB 2.0 One High Speed Pair, V CC , Low Capacitance ESD Protection Key Requirement I/O 1 I/O 2 I/O 3 I/O 4 •Cap < 5 pF •0.35 - 3.0 pF •Multi-part solutions available •Industry leading low clamping voltage PROTECTION Device NUP2114UPX NUP2114UCM NUP4114UPX NUP4114UCL NUP4114H TVS4201MR6 ESD7L5.0 ESD8351MUT ESD8351P2T ESD9L5.0 VBUS D+ DGnd USB Host Controller Features NUP2114 = Data Lines Capacitance (pF) Package Size (mm) 1 Pair (D+/-) + Vbus 1 Pair (D+/-) + Vbus 2 Pair (D+/-) + Vbus 2 Pair (D+/-) + Vbus 2 Pair (D+/-) + Vbus 2 Pair (D+/-) + Vbus 2 1 1 1 0.8 0.8 0.5 0.5 0.5 3 0.5 0.37 0.37 0.5 SOT-553 TSOP-6 SOT-563 SC-88 TSOP-6 TSOP-6 SOT-723 X3DFN-2 SOD-923 SOD-923 1.2 x 1.6 3.0 x 2.75 1.6 x 1.6 2.0 x 2.1 3.0 x 2.75 3.0 x 2.75 1.2 x 1.2 0.6 x 0.3 1.0 x 0.6 1.0 x 0.6 VBUS D+ DGnd USB Host Controller NUP4114 VBUS D+ DGnd One High Speed Pair, V CC , Common Mode Filter + ESD Protection Key Requirement •Cap < 5 pF •Common Mode Filtering Micro USB Connector Features •0.5 - 0.8 pF •Integrated EMI suppression with ESD protection •Industry leading low clamping voltage GND ID EMI2121 D+ D- Device EMI2121 Pairs Capacitance @ 2.5 V (pF) 1 0.9 CM Attenuation DM Bandwidth @ 800 MHz (–dB) F3dB (GHz) Package –25 2.5 WQFN VBUS Size (mm) Top layer Other layer 2.2 x 2.0 x 0.75 0 -5 -10 dB -15 -20 -25 -30 USB 2.0 @ 480 Mb/s Page 38 -35 1.E+06 Suppresses Common Mode Noise Deeper than Competing Passive Solution Common Mode Differential Mode 1.E+07 1.E+08 1.E+09 Frequency Internet of Things Solutions Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit Four Pairs, Low Capacitance Surge and ESD Protection The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards. Features Typical Application TPOPA 1000BASE-T ETHERNET TRANSCEIVER TPONA C5 ALC03 C3 TPONC BLC03 8 TPOPC C6 C+ VDD C7 CLC03 C4 TPOND 8 1 TPOPD D+ VDD C8 DLC03 Line Side : LC03-6 (optional) Transformer Side: TVS8818 Protection against metallic (transverse) strikes 1 2 TVS8818 5 Voltage (V), Current (A) 4 30 RJ-45 Connector 3 6 Flow Through Routing 7 25 8/20 μs Surge Current 15 ON Semiconductor Voltage 10 5 0 -10 8 Competitor Voltage 20 0 10 20 30 Time (μs) 40 50 60 Line-to-Line Surge Transient Voltage Suppressors Device LC03-6 TVS4201 TVS8814 TVS8818 NUP4114H SRDA3.3 SRDA05 VDC Max (V) 6.7 5.0 3.0 3.0 5.0 3.3 5.0 Line Transient Max (V) 7.0 6.0 3.2 3.2 5.0 5.0 7.0 Surge IPP, 8/20 ms (A) 100 25 35 35 12* 25 23 Typical Line-Line Capacitance (pF) 8.0 1.5 1.5 1.5 0.4 4.0 5.0 ESD Contact Rating (kV) ±30 ±30 ±30 ±30 ±13 ±8 ±8 Package SOIC-8 TSOP-6 UDFN-8 UDFN-10 TSOP-6 SOIC-8 SOIC-8 * On Pin 5. ON Semiconductor Page 39 PROTECTION TVS8818 B+ VDD RJ45 TPONB TRANSFORMER C2 8 TPOPB 1 •Compatible with Gb Ethernet and beyond •Enhanced protection for downstream electronics •Accommodates operating transients above 3.3 V •Small form-factor allows integration into connectors A+ VDD 1 Benefits C1 8 1 •Line-to-line capacitance < 3 pF •Vclamp (25 A surge) < 11 V •IEC 61000-4-2 rating > 30 kV •No latching danger •Surge rating maintained to 125°C General and LCD MCUs MCU Features •Pins: •ROM: •RAM: •ADC: 10 – 100 4 – 768 KBytes 256 – 48,640 Bytes 3 – 16 channels ROM RAM (kByte) (Byte) PROCESSING Device Type LC87FBG08A 8-bit General 8 256 LC87FBK08A 8-bit General 8 LC87FBL08A 8-bit General 8 LC87FBH08A 8-bit General 8 LC87F2R04A 8-bit General LC87BK08A* 8-bit General LC87F2416A 8-bit General LC87F2J32A 8-bit General LC87F2W48A 8-bit General LC87F2C64A 8-bit General LC87FC096A 8-bit General 96 LC87F2608A 8-bit General 8 LC87F0808A 8-bit General 8 LC87F0N04A 8-bit General 4.5 LC87F0G08A 8-bit General 8 LC87F0A08A 8-bit General 8 256 LC87F5VP6A 8-bit General 256 LC88F58B0A 16-bit General 128 LC88FC3H0A 16-bit General LC88FC3J0A 16-bit General LC88FC3K0A 16-bit General LC87F7932B 8-bit LCD LC87F7J32A •Operation Voltage: 1.8 – 5.5 (V) •Stand-by IDD: 0.02 µA •RTC (Clock) IDD: 0.45 µA (with low power model) μA I/Os PWMs UARTs ADC LVD POR Features Package 21 2 1 12/8-bit x 9ch ✔ ✔ High accuracy internal OSC (±2.0%); all operation is minimum 1.8 V SSOP-24, VCT-24 256 21 2 — 12/8-bit x 8ch ✔ ✔ High accuracy internal OSC (±3.0%); Support Mask Type SSOP-24 256 26 2 — 12/8-bit x 11ch ✔ ✔ High accuracy internal OSC (±3.0%) QFP-36 256 26 2 1 12/8-bit x 11ch ✔ ✔ High accuracy internal OSC (±3.0%) QFP-36 4 128 21 — — 12/8-bit x 8ch ✔ ✔ Small scale 8bit MCU; Remote Control Receiver Circuit SSOP-24 8 256 21 2 — 12/8-bit x 8ch ✔ ✔ Mask ROM edition of LC87FBK08A SSOP-24 16 512 26 2 1 12/8-bit x 10ch — — — QFP-36 32 1024 41 2 1 12/8-bit x 14ch ✔ ✔ — SQFP-48, QIP-48 50 1536 40 2 1 12/8-bit x 14ch ✔ — — SQFP-48 64 2048 73 4 2 12/8-bit x 16ch ✔ ✔ RTC; low power consumption QFP-80 4096 55 6 2 12/8-bit x 11ch ✔ ✔ 12-bit PWM x 6 QIP-64E 512 7 1 — 12/8-bit x 3ch ✔ ✔ High speed 12-bit PWM; Analog Comparator MFP-10SK 256 30 6 1 10/8-bit x 10ch ✔ ✔ MCPWM; High speed ADC (10-bit); Analog Comparator/Amplifier x 2 QFP-36 128 12 4 — 10/8-bit x 6ch ✔ ✔ MCPWM; High speed ADC (10-bit); Analog Comparator x 2 SSOP-16 256 18 3 — 12/8-bit x 7ch — — MCPWM, OP-AMP, Analog comparator SSOP-24 30 2 — 12/8-bit x 8ch ✔ ✔ OP-AMP, Analog comparator, Constant current output port QFP-36 10240 89 4 2 8-bit x 15ch — — Large scale memory QIP-100E 6144 54 2 2 12/8-bit x 11ch — ✔ Motor control signal generator SQFP-64 512 49152 90 4 3 12/8-bit x 8ch ✔ ✔ 2 x SMIC, SLIIC; RTC; CRC calculation circuit TQFP-100 640 49152 90 4 3 12/8-bit x 8ch ✔ ✔ 2 x SMIC, SLIIC; RTC; CRC calculation circuit TQFP-100 768 49152 90 4 3 12/8-bit x 16ch ✔ ✔ 2 x SMIC, SLIIC; RTC; CRC calculation circuit TQFP-100 32 2048 49 2 1 12/8-bit x 7ch — ✔ 32 x 4 segment driver; RTC; low power consumption SQFP-64 8-bit LCD 32 1024 51 2 1 12/8-bit x 12ch ✔ ✔ 24 x 4 segment driver; support 5 V/3 V for LCD-panel TQFP-64 LC87F76C8A 8-bit LCD 128 4096 71 2 1 12/8-bit x 12ch — — 32 x 4 segment driver QFP-80 LC87F7DC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; many segment drivers QIP-100E LC87F7NC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E LC87F7NJ2A 8-bit LCD 192 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E LC87F7NP6A 8-bit LCD 256 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E * Mask ROM Device; Contact ON Semiconductor for additional information. Page 40 Internet of Things Solutions MCUs for USB MCU Features •USB 2.0 full-speed / low speed functions •USB device function / USB host function Device Type LC87F1A32A 8-bit USB LC87F1M16A 8-bit USB LC87F1K64A 8-bit USB LC87F17C8A 8-bit USB LC87F1HC8A LC87F1JJ2A LC87F1JJ4A LC87F1JJ8A 8-bit USB 8-bit USB 8-bit USB 8-bit USB ROM RAM (kByte) (Byte) •Integrated voltage regulator •USB D+ line pull-up function I/Os PWMs UARTs ADC LVD POR Features Package 2048 39 2 1 12/8-bit x 12ch — — IR reciever SQFP-48 16 1024 38 2 1 12/8-bit x 20ch ✔ ✔ UART & SCUART; high current driver SQFP-48 64 8192 39 2 1 12-bit x 12ch ✔ ✔ USB I/F x 2; USB Host; Audio I/F SQFP-48 128 8192 39 2 1 12/8-bit x 12ch SQFP-48 16384 16384 20480 24576 39 39 39 39 2 2 2 2 1 1 1 1 8-bit x 12ch 8-bit x 12ch 8-bit x 12ch 8-bit x 12ch 4 — — — — USB 2.0 full speed host/device controller x2; audio IF 128 192 192 192 4 — — — — USB Host; Audio I/F USB Host; Audio I/F USB Host; Audio I/F USB Host; Audio I/F SQFP-48 SQFP-48 SQFP-48 SQFP-48 32 MCU Starter Kit for Software Development Trial kit includes Main Board, Sub Board, and Development Environment CD. With Main Board as a base, it is possible to connect different Sub Boards with different pin numbers. •8 bit Easy Micon Development Tool Sub Board Line Up: 16-pin, 24-pin, 36-pin, 48-pin •16 bit Xstromy16 Development Tool Sub Board Line Up: 48-pin, 64-pin, 100-pin PROCESSING LEDs Switch Connects to PC via Standard USB Cable MCU On-Chip Debugger System •Software development with 1 wire communication •Reduction of development time with Real Time Display function, Break function, and Trace function Debugger (1 Wire) Real Time Display Function Displays program running situation in real time ON Semiconductor Page 41 Mixed-Signal Custom Solutions Value Proposition • Experienced resources and assets to bring customers’ design objectives successfully to market • Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP • Flexible cost models to reduce customers’ total cost High Voltage (40 to 80 V) Low Voltage (<3.3 V) Low or High Voltage Power/ Battery Management Wired Communications Analog Signals Filtering Example: PROCESSING Sensor: • Magnetic Flux • Temperature • Light • Sound • Pressure • Acceleration • Angular Rate Amplification Analog/ Digital Conversion • RF Wireless Radio Signal Processing Actuator • Coil Driver • Class-D Amp • DAC • Display Driver Supporting Logic Memory • EEPROM • OTP • SRAM • ROM IP & Fab Processes • ≥55 nm, analog-focused CMOS/BCDMOS process technologies utilizing internal fabs and external foundry partners • Low, medium, high voltages — ≤1 V to 90 V • Low current optimization — active & standby • Low noise design — “count the electrons” • High temperature — ≤200°C (profile, for selected technologies) • Integrated low power wireless • Non-Volatile Memory (EEPROM, OTP), RAM & ROM • Embedded digital IP • Robust ESD protection • Extensive building block ‘starting points’ consisting of amplifiers, references, DACs, ADCs, linear & switching regulators, power management, etc. Page 42 Low or High Voltage • Microcontroller • DSP Sensor Interface ASIC Design Engineering • CAN, LIN • I2C-bus • USB • KNX • M-BUS Example: Mechanical or Electrical System: • Stepper Motors • Transducers • MOSFETs & BJTs • Relays • Speakers • Lamps • LCD/LED Displays Category • Approximately 200 expert mixed-signal designers with extensive SoC and SiP experience • Robust custom development process • Dedicated project managers track & report development progress • Flexible customer development engagement — from full turnkey to subcontractor production services • Design expertise in: » Sensor interface » Wireless systems » Medical imaging » Energy management » Building & home control Mixed Signal Intellectual Property (IP) Serial Interfaces USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART Microprocessors ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals Memory SRAM, DPRAM, ROM, EEPROM, OTP, FLASH Clocking Oscillators, PLLs, DLLs Communication Wireless (Proprietary & Standards), Wired (KNX, PLC and others) Encryption ECC, AES, 3-DES, DES, RSA Data Converters DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS) Wireless IP PGA, LNA, PLLs, Correlators, DSP Power Management Efficient Switching Regulators, LDOs, Charge Pumps, Thermal Protection References Precision Bandgaps, Current References, Temperature Sensors Analog and High Voltage Interfaces High-Voltage Drivers, Display and LCD Drivers, Class D Amplifiers Signal Conditioning PGA, Instrumentation Amps, Digital and Analog Filters Internet of Things Solutions Integrated Passive Devices (IPD) •Combines multiple resistors, capacitors and inductors onto a film substrate; typical applications include RF baluns, filters, and matching networks •Reduces PCB footprint and component height versus discrete implementations, while also improving performance (reduced parasitics) •Simplifies logistics, inventory managememt and pick-and-place assembly by elimination of multiple discrete passive SKUs •Based on 110 nm silicon process with high performance and tight process control Available Components •Copper inductors, minimum spacing 3 µm, minimum line width 5 µm, current handling >50 mA/µm, achieves Q-factors up to 45 Integration of multiple R, L, and C into single IPD •MIM capacitors, 0.62 nF/mm2 , typical tolerance ±5% •TiN resistors, 9 Ω/sq Sub-Micron Tolerances — Trace Spacing/Width Down to 3/5 mm Inductor Within IPD (SEM Photo) Picked & Diced Wafer Edge ON Semiconductor Page 43 COMPONENTS •Wafers manufactured on high precision equipment, designed for 110 nm transistor fabrication •Very tight performance tolerances and low variation across wafers •±4.3% tolerance 1K MIM caps •±3.9% tolerance 2K MIM caps •< 1% variance between caps on common IPD EEPROMs for Configuration and Calibration Features EasyPRO™ is a user-friendly, portable programming tool for ON Semiconductor serial EEPROMs (I2C, SPI, Microwire) •Broad density range: 1 kb to 2 Mb •Wide operating Vcc range: 1.8/1.7 V to 5.5 V •High endurance: 1 million program/erase cycles •Wide temperature range: industrial and extended •Error-code correction •Lockable ID page EEPROMs Data Transmission Standard I2C SPI COMPONENTS Microwire Device Density Organization* VCC Min (V) VCC Max (V) fCLK Max (MHz) Package(s) CAT24M01 CAT24C512 CAT24C256 CAT24C128 CAT24C64 LE2464CXA CAT24C32 CAT24C16 LE24162LBXA LE24163LBXA LE2416RLBXA CAT24C08 CAT24C04 LE24L042CS-B CAT24C02 CAT25M02 CAT25M01 CAT25512 CAT25256 CAT25128 CAT25640 CAT25320 CAT25160 CAT25080 CAT25040 CAT25020 CAT25010 CAT93C86 CAT93C86B CAT93C76 CAT93C76B CAT93C66 CAT93C56 CAT93C46 CAT93C46B CAT93C46B 1 Mb 512 kb 256 kb 128 kb 64 kb 64 kb 32 kb 16 kb 16 kb 16 kb 16 kb 8 kb 4 kb 4 kb 2 kb 2 Mb 1 Mb 512 kb 256 kb 128 kb 64 kb 32 kb 16 kb 8 kb 4 kb 2 kb 1 kb 16 kb 16 kb 8 kb 8 kb 4 kb 2 kb 1 kb 1 kb 1 kb 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 8k x 8 4k x 8 2k x 8 2k x 8 2k x 8 2k x 8 1k x 8 512 x 8 512 x 8 256 x 8 256k x 8 128k x 8 64k x 8 32k x 8 16k x 8 8k x 8 4k x 8 2k x 8 1k x 8 512 x 8 256 x 8 128 x 8 2k x 8 & 1k x 16 2k x 8 & 1k x 16 1k x 8 & 512 x 16 1k x 8 & 512 x 16 512 x 8 & 256 x 16 256 x 8 & 128 x 16 128 x 8 & 64 x 16 128 x 8 & 64 x 16 128 x 8 / 64 x 16 1.8 1.8 1.8 1.8 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 / 1.65 1.8 1.8 / 1.65 1.8 1.8 1.8 1.8 / 1.65 1.8 / 1.65 5.5 5.5 5.5 5.5 5.5 3.6 5.5 5.5 3.6 3.6 3.6 5.5 5.5 3.6 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 1 1 1 1 1 0.4 1 0.4 0.4 0.4 0.4 0.4 0.4 0.4 0.4 10 10 20 20 20 20 20 20 20 20 20 20 3 4 3 4 2 2 2 4 4 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4 WLCSP-6 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 WLCSP-6 WLCSP-5 WLCSP-6 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 WLCSP-4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5 SOIC-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8 SOIC-8, TSSOP-8, UDFN-8 SOIC-8, TSSOP-8, UDFN-8 * Organization for Microwire devices is selectable. Page 44 Internet of Things Solutions Serial NOR Flash Features •Faster data rewrite (Sector Erase/Page Program) •Lower power consumption with efficient rewrite operation •20-year data retention with no data deterioration •Consistent Sector Erase operation time (tSE) over device lifetime •Industry’s fastest WRITE performance minimizes system risk during field firmware upgrades VCC VCC VCC CS HOLD SCK CS SCK Wireless SoC Serial Flash W P GND SI SI SO SO LED Driver Density Power Supply (V) Sector Erase Time (ms) Page Program Time (ms) Read/Write Current (mA) Package LE25S20 2 Mb 1.65 - 1.95 80 3 6 Read; 15 Write SOIC-8, VSOIC-8 LE25U20A 2 Mb 2.3 - 3.6 80 4 6 Read; 15 Write SOIC-8, VSOIC-8, WDFN-8 LE25U40C 4 Mb 2.3 - 3.6 80 4 6 Read; 15 Write SOIC-8, VSON-8, VDFN-8 LE25S40 4 Mb 1.65 - 1.95 80 6 6 Read; 15 Write SOIC-8, VSOIC-8, VDFN-8, VSON-8 LE25W81 8 Mb 2.45 - 3.6 100 0.3 6 Read; 15 Write VSON-8, VDFN-8 LE25S81A 8 Mb 1.65 - 1.95 15 0.3 5 Read; 4.5 Erase SOIC-8, VSOIC-8 LE25S161 16 Mb 1.65 - 1.95 15 0.4 4.5 Read; 4.5 Erase SOIC-8, VSOIC-8, UDFN-8, WLCSP-8 Device ON Semiconductor Page 45 COMPONENTS Smart LED Block Diagram Logic Translators Dual supply voltage logic translators connect ICs and PCBs together that operate at different supply voltages. PCB #1 PCB #2 Translator Features Translator μC #1 •Industry’s first devices with independent power supplies (VL < VCC, VL = VCC, or VL > VCC) •High 100 pF capacitive drive capability •Overvoltage tolerant enable and I/O pins •Non-preferential power-up sequencing •Power-off protection μC #2 PCB-to-PCB Translation On-board translations • SPI • I2C • SMBus Translator EEPROM Autosense Bidirectional Translator (Push-Pull Output) Unidirectional Translator P One−Shot VL Autosense Bidirectional Translator (Open-Drain Output) Bidirectional Translator (with Direction Pin) VCC R1 VL VCC VCCA 1k VCCA Block Diagram N One−Shot VCCB A B I/O VL PU1 I/O VCC P One−Shot OE R2 RPullup 10 k One−Shot Block Gate Bias One−Shot Block EN I/O VL VCCB DIR PU2 RPullup 10 k A EN N B I/O VCC 1k N One−Shot COMPONENTS Attributes • High Data Rate • Low Power Consumption • High Data Rate • Low Power Consumption • High Data Rate • Low Power Consumption • Flexible PCB Design • High Data Rate • Low Power Consumption • Flexible PCB Design Trade-Offs • Fixed Input & Output Pins • Modest Output Current • Modest Bandwidth • Directional Control Pin Required •SPI •GPIO •SPI •GPIO •I2C, SMBus, PMBus •GPIO • SDIO Cards • 1-Wire Bus •GPIO • NLSX3012 (2-Bit, UDFN-8) • NLSX3014 (4-Bit, UQFN-12) • NLSX3013 (8-Bit, CSP-20) • NLSX3018 (8-Bit, UDFN-20) • NLSX4014 (4-Bit, UQFN-12) • NLSX5011 (1-Bit, UULGA-6, UDFN-6) • NLSX5012 (2-Bit, UDFN-8) • NLSX5014 (4-Bit, UDFN-12) • NLSX3373 (2-Bit, UDFN-8) • NLSX3378 (4-Bit, CSP-12) • NLSX4373 (2-Bit, UDFN-8) • NLSX4378 (4-Bit, CSP-12) • NLSV1T45 (1-Bit, ULLGA-6) • NLSV2T245 (2-Bit, UQFN-10) • NLSV2T3236 (2-Bit, UQFN-10) • NLA16T245 (16-Bit, TSSOP-48) Applications • NLSV1T34 (1-Bit, ULLGA-6) • NLSV1T240/244 (1-Bit, UDFN-6) • NLSV2T240/244 (2-Bit, UDFN-8) Sample Device • NLSV4T240/244 (4-Bit, UDFN-12) (I/O Channels, • NLSV4T3234 (4-Bit, CSP-11) Package) • NLSV8T240/244 (8-Bit, UDFN-20) Page 46 Internet of Things Solutions For more information, visit the Industrial IoT product page on the ON Semiconductor website at www.onsemi.com. Click on the Industrial IoT Segment icon - -- , then on the Industrial IoT Segment banner —— —— — ——. 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