LV8406T - ON Semiconductor

Ordering number : ENA1382B
LV8406T
Bi-CMOS IC
2ch Forward/Reverse Motor Driver
http://onsemi.com
Overview
LV8406T is a 2-channel forward/reverse motor driver IC using D-MOS FET for output stage. As MOS circuit is used,
it supports the PWM input. Its features are that the on resistance (0.75Ω typ) and current dissipation are low.
It also provides protection functions such as heat protection circuit and reduced voltage detection and is optimal for the
motors that need high-current.
Functions
• 2-channel forward/reverse motor driver.
• Low power consumption.
• Low-ON resistance 0.75Ω.
• Built-in low voltage reset and thermal shutdown circuit.
• Four mode function forward/reverse, brake, stop.
• Built-in charge pump.
Specifications
Absolute Maximum Ratings at Ta = 25°C, SGND = PGND = 0V
Parameter
Symbol
Conditions
VM1, VM2
Ratings
Unit
Power supply voltage (for load)
VM max
Power supply voltage (for control)
VCC max
Output current
IO max
Output peak current
IO peak
Input voltage
VIN max
Allowable power dissipation
Pd max
Operating temperature
Topr
-30 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
t ≤ 10ms
Mounted on a specified board*
-0.5 to 16.0
V
-0.5 to 6.0
V
1.4
A
2.5
A
-0.5 to VCC+0.5
V
3.1
W
* Specified board : 90mm × 90mm × 1.6mm, glass epoxy 2-layer board (2S0P).
Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time.
Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current,
high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Semiconductor Components Industries, LLC, 2013
June, 2013
N0211 SY/O2809 SY / D1008 MS 20081201-S00005 No.A1382-1/6
LV8406T
Allowable Operating Conditions at Ta = 25°C, SGND = PGND = 0V
Parameter
Symbol
Conditions
Ratings
Unit
Power supply voltage (VM pin)
VM
1.5 to 15.0
Power supply voltage (VCC pin)
VCC
2.8 to 5.5
V
Input signal voltage
VIN
0 to VCC
V
Input signal frequency
f max
200
V
kHz
Electrical Characteristics Ta = 25°C, VCC = 3.0V, VM = VS = 6.0V, SGND = PGND = 0V, unless otherwise specified.
Parameter
Symbol
Conditions
Ratings
Remarks
min
typ
Unit
max
Standby load current drain
IMO
EN = 0V
1
1.0
μA
Standby control current drain
ICO
EN = IN1 = IN2 = IN3 = IN4 = 0V
2
1.0
μA
Standby load current drain2
IMO2
VCC = 0V, VM = VS = 6V
1.0
μA
1.2
mA
Operating control current drain
IC1
EN = 3V, with no load
High-level input voltage
VIH
2.7 ≤ VCC ≤ 5.5V
3
0.6×VCC
0.85
VCC
V
Low-level input voltage
VIL
2.7 ≤ VCC ≤ 5.5V
0
0.2×VCC
V
High-level input current
IIH1
VIN = 3V
4
25
μA
IIL1
VIN = 0V
4
Pull-down resistance value
RDN
EN1, EN2, IN1, IN2, IN3, IN4
100
200
400
Charge pump voltage
VG
VCC + VS
8.5
9.0
9.5
V
Output ON resistance 1
RON1
Sum of top and bottom sides ON
5
0.75
1.2
Ω
5
1.0
1.5
Ω
15
(EN1, EN2, IN1, IN2, IN3, IN4)
Low-level input current
μA
-1.0
(EN1, EN2, IN1, IN2, IN3, IN4)
kΩ
resistance.
Output ON resistance 2
RON2
Sum of top and bottom sides ON
resistance. VCC = 2.8V
Low-voltage detection voltage
VCS
VCC pin voltage is monitored
6
2.15
2.30
2.45
V
Thermal shutdown temperature
Tth
Design guarantee value *
7
150
180
210
°C
Output block
Turn-on time
TPLH
8
0.2
0.4
μS
Turn-off time
TPHL
8
0.2
0.4
μS
* : Design guarantee value and no measurement is preformed.
Remarks
1. Current consumption when output at the VM pin is off.
2. Current consumption when the VCC pin when in standby mode.
3. Current consumption at the VCC pin when EN is 3V (standby mode).
4. Pins EN1, 2, IN1, 2, 3, and 4 are all pulled down.
5. Sum of upper and lower saturation voltages of OUT pin divided by the current.
6. All power transistors are turned off if a low VCC condition is detected.
7. All output transistors are turned off if the thermal protection circuit is activated. They are turned on again as the
temperature goes down.
8. Rising time from 10 to 90% and falling time from 90 to 10% are specified.
No.A1382-2/6
LV8406T
Package Dimensions
unit : mm (typ)
3279
Pd max -- Ta
TOP VIEW
BOTTOM VIEW
6.5
20
0.5
6.4
4.4
11
10
1
0.65
0.15
0.22
Exposed Die-Pad
(1.0)
SIDE VIEW
1.2max
(0.33)
Allowable power dissipation, Pd max -- W
4,0
Specified board: 90×90×1.6mm3
glass epoxy 2-layer (2S0P)
with components mounted
on the exposed die-pad board.
3.1
3.0
2.0
1.61
1.0
0
-30 -20
0
20
40
60
80 85
100
0.08
Ambient temperature, Ta -- °C
SANYO : TSSOP20J(225mil)
Substrate Specifications
Size
: 90mm × 90mm × 1.6mm (2-layer substrate [2S0P])
Material
: Glass epoxy
Copper wiring density : L1 = 95% / L2 = 95%
L1 : Copper wiring pattern diagram
L2 : Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 90% or more of the
Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension. Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
No.A1382-3/6
LV8406T
Pin Assignment
VG 1
20 C1H
VM1 2
19 C1L
OUT1 3
18 SGND
OUT2 4
17 VS
LV8406T
PGND 5
PGND 6
16 EN1
15 IN1
OUT3 7
14 IN2
OUT4 8
13 VCC
VM2 9
12 EN2
IN4 10
11 IN3
Top view
Block Diagram
VCC
VM1
OUT1
Startup
control
block
Thermal
Protection
Circuit
OUT2
Reducedvoltage
Protection
Circuit
VM2
OUT3
EN1
EN2
Motor control
Logic
OUT4
IN1
IN2
PGND
IN3
IN4
Charge pump
VCC+VS
VS C1H
C1L
VG
* Connect a kickback absorption capacitor as near as possible to the IC. Coil kickback may cause increase in VM line
voltage, and a voltage exceeding the maximum rating may be applied momentarily to the IC, which results in
deterioration or damage of the IC
* The pin VS is a terminal that supplies a source power supply of the charge pump circuit.
The charge pump voltage, VG = VS + VCC is generated.
Apply the high voltage of VM1 or VM2.
No.A1382-4/6
LV8406T
Truth Table
EN1
IN1
IN2
OUT1
OUT2
(EN2)
(IN3)
(IN4)
(OUT3)
(OUT4)
H
H
L
L
H
L
H
L
L
H
L
H
L
L
Z
Z
-
-
Z
H
L
Z
Charge pump
Mode
Brake
Forward
ON
Reverse
Standby
OFF
All function stop
- : denotes a don't care value. Z : High-impedance
• In standby mode, consumption current serves as zero..
* All power transistors turn off and the motor stops driving when the IC is detected in low voltage or thermal protection
mode.
Pin Functions
Pin No.
Pin name
20
C1H
1
VG
17
VS
Description
Equivalent circuit
Step-up capacitor connection pin.
VS
VG
Charge pump source voltage supply pin.
C1H
19
C1L
Step-up capacitor connection pin.
VCC
C1L
Internal OSC
16
EN1
Logic enable pin.
12
EN2
(Pull-down resistor incorporated)
15
IN1
Driver output switching.
14
IN2
11
IN3
10
IN4
3
OUT1
4
OUT2
7
OUT3
8
OUT4
VCC
200kΩ
Driver output.
VM
OUT
OUT
PGND
2
VM1
9
VM2
Motor block power supply.
13
VCC
18
SGND
Logic block power supply.
Control block ground.
5
PGND
Driver block ground.
6
PGND
No.A1382-5/6
LV8406T
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PS No.A1382-6/6