AOS Semiconductor
Product Reliability Report
AOZ8000CI, rev 2
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
www.aosmd.com
Mar 27, 2007
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This AOS product reliability report summarizes the qualification result for AOZ8000CI.
Review of the electrical test results confirm that AOZ8000CI pass AOS quality and reliability
requirements for product release. The continuous qualification testing and reliability monitoring
program ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I.
II.
III.
IV.
V.
VI.
Product Description
Package and Die information
Qualification Test Requirements
Qualification Tests Result
Reliability Evaluation
Quality Assurance Information
I. Product Description:
The AOZ8000CI is a transient voltage suppressor array designed to protect high speed data lines from ESD and
lightning. The product comes in RoHS compliant, SOT-23 package and is rated over a -40°C to +85°C ambient
temperature range.
.
Absolute Maximum Ratings
Parameter
VP-VN
6V
Peak Pulse Current (Ipp), tp=8/20uS
5A
Storage Temperature (TS)
-65°C to +150°C
ESD Rating per IEC61000-4-2, contact (1)
±12kV
ESD Rating per IEC61000-4-2, air (2)
±15kV
ESD Rating per Human Body Model (2)
±15kV
Junction Temperature (Tj)
-40°C to +125°C
Notes:
(1) IEC-61000-4-2 discharge with CDischarge=150pF, RDischarge=330Ω
(2) Human Body Discharge per MIL-STD-883, Method 3015 CDischarge=100pF, RDischarge=1.5kΩ
II. Package and Die Information:
Product ID
Process
Package Type
Die
L/F material
Die attach material
Die bond wire
Mold Material
Plating Material
AOZ8000CI
UMC 0.5um 5/18V 2P3M process
SOT-23
UE003A3 (size: 716 x 616 um)
Copper A194FH
84-3J epoxy
Au, 1mil
MP8000CH4
Pure Tin
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III. Qualification Tests Requirments
•
•
2 lots of AOZ8000CI up to 168 hrs of B/I for New Product release.
2 lots of package qual testing (PCT, 250 cycles TC) for SOT-23 for package release to manufacturing.
IV. Qualification Tests Result
Test Item
Test Condition
Sample Size
Result
PreConditioning
Per JESD 22-A113
0
85 C /85%RH, 3 cyc
0
reflow@260 C
2 lots (82 /lot)
pass
Lot 1 (wafer lot# FN2MT.54, marking: AB002),
82 units, passed pre-conditioning.
Lot 2 (wafer lot# FN2MT.54, marking: AB003),
82 units, passed pre-conditioning.
HTOL
(old UE003A
process)
Per JESD 22-A108_B
Vdd=6V
Temp = 125 0C
2 lots (80 /lot)
pass
HTOL
(new UH_EPI
process)
Per JESD 22-A108_B
Vdd=6V
Temp = 125 0C
2 lots (80 /lot)
pass
Lot 1 (wafer lot# F9AN1.51, wafer# 4,
marking: AB001), 80 units, passed 168 hrs .
Lot 2 (wafer lot# FN2MT.54, wafer# 18,
marking: AB003), 80 units, passed 168 hrs .
Lot 1 (wafer lot# FNG88-2/3, marking:
AC001), 80 units, passed 500 hrs .
Lot 2 (wafer lot# FAYY3.02-3 marking:
AB008), 80 units, passed 168 hrs .
HAST
'130 +/- 2 0C, 85%RH,
33.3 psi, at VCC min
power dissapation.
2 lots (60 /lot)
pass
Lot 1 (wafer lot# FN2MT.54, marking: AB002),
60 units, passed HAST 100 hrs.
Lot 2 (wafer lot# FN2MT.54, marking: AB003),
60 units, passed HAST 100 hrs.
Temperature
Cycle
'-65 0C to +150 0C,
air to air (2cyc/hr)
2 lots (82 /lot)
pass
Lot 1 (wafer lot# FN2MT.54, marking: AB002),
82 units, passed TC 500 cycles.
Lot 2 (wafer lot# FN2MT.54, marking: AB003),
82 units, passed TC 500 cycles.
Pressure Pot
121C, 15+/-1 PSIG,
RH= 100%
2 lots (82 /lot)
pass
Lot 1 (wafer lot# FN2MT.54, marking: AB002),
82 units, passed PCT 96 hrs.
Lot 2 (wafer lot# FN2MT.54, marking: AB003),
82 units, passed PCT 96 hrs.
ESD Rating
Per IEC-61000-4-2,
contact
30 units
pass
Lot 1 (wafer lot# F9AN1.51, assembly
marking: Z96R11), 20 units passed ±12kV
Lot 2 (wafer lot# F162T, assembly marking:
B1001), 10 units passed ±12kV
ESD Rating
Per IEC-61000-4-2, air
20 units
pass
Lot 1 (wafer lot# F9AN1.51, assembly
marking: Z96R11), 20 units passed ±15kV
Latch-up
Per JESD78A
3 units
pass
Lot 1 (wafer lot# F162T, assembly marking:
B1001), 3 units passed Latch-up.
Comment
The qualification test results confirm that AOZ8000CI pass AOS quality and reliability
requirements for product release.
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V. Reliability Evaluation
A. Failure Rate Prediction
FIT rate (per billion): see note 1
MTBF = see note 1
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The presentation of FIT rate for the individual product reliability is restricted by the limited burn-in sample
size of AOZ8000CI. The calculation will be presented (using the method discussed below) on the
final qualification report when more data are available.
AOS uses industry standard techniques (JEDEC Standard JESD 85) for failure rate prediction by
applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level
on the failure rate calculation. FIT means one failure per billion hours.
The failure rate and MTBF are calculated as follows:
AF = exp{(Ea/k) x [1/T0-1/Ts]}
Looking up the χ2 /2 table (see above) for zero failure (see HTOL result above) with 60% confidence, the
value of (χ2[CL,(2f+2)] /2) is 0.92.
Failure Rate = Chi2 [CL, (2f+2)] x 109 / [2 (ss) (t) (AF)]
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MTBF = 10 / FIT
Chi² (χ2)= Chi Squared Distribution, determined by the number of failures and confidence interval
ss = Total Number of units from HTOL testing
t = Duration of HTOL testing
AF = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [AF] = exp [Ea / k (1/Tj u – 1/Tj s)]
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273
Tj u = Used junction temperature in degree (Kelvin), K = C+273
k = Boltznan’s constant, 8.617x10-5 V / K
B. Package Qualification Testing
Package qual. testing are performed (see section IV) to ensure the product meet AOS quality and reliability
standards.
VI. Quality Assurance Information
Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed
Outgoing Defect Rate: < 50 ppm
Quality Sample Plan: conform to Mil-Std -105D
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