RENESAS PS9305L-E3

Preliminary Data Sheet
PS9305L,PS9305L2
R08DS0013EJ0200
Rev.2.00
Sep 07, 2011
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN SDIP PHOTOCOUPLER
<R>
DESCRIPTION
The PS9305L and PS9305L2 are optically coupled isolators containing a GaAlAs LED on the input side and a photo
diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9305L and PS9305L2 are designed specifically for high common mode transient immunity (CMR), high output
current and high switching speed.
The PS9305L and PS9305L2 are suitable for driving IGBTs and MOS FETs.
FEATURES
• Long creepage distance (8 mm MIN.)
PIN CONNECTION
(Top View)
• Large peak output current (2.5 A MAX., 2.0 A MIN.)
• High speed switching (tPLH, tPHL = 0.25 μs MAX.)
8
7
6
5
1
2
3
4
• UVLO (Under Voltage Lock Out) protection with hysteresis
• High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.)
• Embossed tape product: PS9305L-E3, PS9305L2-E3: 2 000 pcs/reel
SHIELD
<R>
• Pb-Free product
• Safety standards
• UL approved: No. E72422
1. Anode
2. Cathode
3. Cathode
4. NC
5. VEE
6. VEE
7. VO
8. VCC
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
<R>
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating)
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 1 of 19
PS9305L,PS9305L2
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) for Surface Mount
PS9305L
5.85±0.25
5
1
4
6.8±0.25
8
9.7±0.3
0.4±0.1
0.25 M
0.2±0.15
3.7±0.25
3.5±0.2
(0.82)
0.25±0.15
(7.62)
0.84±0.25
1.27
Lead Bending Type (Gull-wing) for Long Clearance Distance (Surface Mount)
PS9305L2
5.85±0.25
5
1
4
6.8±0.25
8
0.4±0.1
0.25 M
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
0.2±0.15
0.25±0.15
11.5±0.3
(7.62)
(0.82)
3.7±0.25
3.5±0.2
<R>
Chapter Title
0.75±0.25
1.27
Page 2 of 19
PS9305L,PS9305L2
<R>
Chapter Title
PHOTOCOUPLER CONSTRUCTION
Parameter
PS9305L
PS9305L2
Air Distance (MIN.)
7 mm
8 mm
Outer Creepage Distance (MIN.)
8 mm
8 mm
0.4 mm
0.4 mm
Isolation Distance (MIN.)
FUNCTIONAL DIAGRAM
1
8
(Tr. 1)
2
7
3
6
(Tr. 2)
5
SHIELD
<R>
Input
LED
Tr. 1
Tr. 2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
MARKING EXAMPLE
No. 1 pin
Mark
R
9305
N131
Company Initial
Type Number
Assembly Lot
N 1 31
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 3 of 19
PS9305L,PS9305L2
<R>
Chapter Title
ORDERING INFORMATION
Part Number
Order Number
PS9305L
Packing Style
Solder Plating
Specification
Pb-Free
PS9305L-AX
Safety Standard
Approval
20 pcs (Tape 20 pcs cut)
(Ni/Pd/Au)
PS9305L-E3
PS9305L-E3-AX
PS9305L2
PS9305L2-AX
20 pcs (Tape 20 pcs cut)
PS9305L2-E3
PS9305L2-E3-AX
Embossed Tape 2 000 pcs/reel
PS9305L-V
PS9305L-V-AX
Embossed Tape 2 000 pcs/reel
Standard
products
Application
1
Part Number*
PS9305L
(UL, CSA, SEMKO
approved)
PS9305L2
20 pcs (Tape 20 pcs cut)
DIN EN60747-5-2
PS9305L
(VDE0884 Part2)
approved (Option)
PS9305L-V-E3
PS9305L-V-E3-AX
Embossed Tape 2 000 pcs/reel
PS9305L2-V
PS9305L2-V-AX
20 pcs (Tape 20 pcs cut)
PS9305L2-V-E3
PS9305L2-V-E3-AX
Embossed Tape 2 000 pcs/reel
PS9305L2
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
IF
25
mA
IF (TRAN)
1.0
A
VR
5
V
PD
45
mW
IOH (PEAK)
2.5
A
IOL (PEAK)
2.5
A
(VCC - VEE)
0 to 35
V
VO
0 to VCC
V
PC
250
mW
BV
5 000
Vr.m.s.
f
50
kHz
Operating Ambient Temperature
TA
−40 to +110
°C
Storage Temperature
Tstg
−55 to +125
°C
Diode
Forward Current
Peak Transient Forward Current (Pulse Width < 1 μs)
Reverse Voltage
Power Dissipation
Detector
*1
High Level Peak Output Current
Low Level Peak Output Current
*2
*2
Supply Voltage
Output Voltage
Power Dissipation
Isolation Voltage
*3
*4
Operating Frequency
*5
*1 Reduced to 0.88 mW/°C at TA = 85°C or more.
*2 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*3 Reduced to 7.36 mW/°C at TA = 85°C or more.
*4 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
*5 IOH (PEAK) ≤ 2.0 A (≤ 0.3 μs), IOL (PEAK) ≤ 2.0 A (≤ 0.3 μs)
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
(VCC - VEE)
15
Forward Current (ON)
IF (ON)
7
Forward Voltage (OFF)
VF (OFF)
TA
Supply Voltage
Operating Ambient Temperature
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
TYP.
MAX.
Unit
30
V
16
mA
−2
0.8
V
−40
110
°C
10
Page 4 of 19
PS9305L,PS9305L2
Chapter Title
ELECTRICAL CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Diode
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA, TA = 25°C
Reverse Current
IR
VR = 3 V, TA = 25°C
Terminal Capacitance
Ct
f = 1 MHz, VF = 0 V, TA = 25°C
Detector High Level Output Current
IOH
VO = (VCC − 4 V)
*2
VO = (VCC − 15 V)
Low Level Output Current
IOL
VO = (VEE + 15 V)
1.2
0.5
*3
VO = (VEE + 2.5 V)
MIN.
*2
*3
*4
TYP.
*1
1.56
MAX.
Unit
1.8
V
10
μA
30
pF
2.0
A
2.0
A
2.0
0.5
2.0
High Level Output Voltage
VOH
IO = −100 mA
Low Level Output Voltage
VOL
IO = 100 mA
0.1
0.5
V
High Level Supply Current
ICCH
VO = open, IF = 10 mA
1.4
3.0
mA
Low Level Supply Current
ICCL
VO = open, VF = 0 to +0.8 V
1.3
3.0
mA
10.8
12.3
13.4
V
9.5
11.0
12.5
0.4
1.3
UVLO Threshold
VUVLO+
VO > 5 V, IF = 10 mA
VUVLO−
UVLO Hysteresis
Coupled Threshold Input Current
UVLOHYS VO > 5 V, IF = 10 mA
IFLH
IO = 0 mA, VO > 5 V
VFHL
IO = 0 mA, VO < 5 V
VCC − 3.0 VCC − 1.5
2.0
V
V
5.0
mA
(L → H)
Threshold Input Voltage
0.8
V
(H → L)
*1 Typical values at TA = 25°C.
*2 Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%.
*3 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*4 VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle =
20%).
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 5 of 19
PS9305L,PS9305L2
<R>
Chapter Title
SWITCHING CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Propagation Delay Time (L → H)
Propagation Delay Time (H → L)
Symbol
tPLH
tPHL
Pulse Width Distortion (PWD)
|tPHL−tPLH|
Propagation Delay Time (Difference
tPHL−tPLH
Conditions
MIN.
Rg = 10 Ω, Cg = 10 nF, f = 10 kHz,
*2
Duty Cycle = 50% , IF = 10 mA
TYP.
*1
MAX.
Unit
0.07
0.25
μs
0.10
0.25
μs
0.03
0.1
μs
0.1
μs
−0.1
Between Any Two Products)
Rise Time
tr
50
ns
Fall Time
tf
50
ns
UVLO (Turn On Delay)
tUVLO ON
VO > 5 V, IF = 10 mA
0.8
μs
UVLO (Turn Off Delay)
tUVLO OFF VO < 5 V, IF = 10 mA
0.6
μs
Common Mode Transient Immunity at
|CMH|
Common Mode Transient Immunity at
Low Level Output
TA = 25°C, IF = 10 mA, VCC = 30 V,
25
kV/μs
25
kV/μs
VO (MIN.) = 26 V, VCM = 1.5 kV
High Level Output
|CML|
TA = 25°C, IF = 0 mA, VCC = 30 V,
VO (MAX.) = 1 V, VCM = 1.5 kV
*1 Typical values at TA = 25°C.
*2 This load condition is equivalent to the IGBT load at 1 200 V/75 A.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 6 of 19
PS9305L,PS9305L2
Chapter Title
TEST CIRCUIT
Fig. 1 IOH Test Circuit
1
8
2
7 0.1 μF
Fig. 2 IOL Test Circuit
1
8
2
7 0.1 μF
3
6
4
5
IOL
4V
3
6
IF =
7 to 16 mA 4
5
VCC = 15 to 30 V
IOH
VCC =
15 to 30 V
SHIELD
SHIELD
Fig. 3 VOH Test Circuit
IF =
7 to 16 mA
2.5 V
1
8
2
7 0.1 μF
3
6
4
5
Fig. 4 VOL Test Circuit
VOH
100 mA
VCC =
15 to 30 V
1
8
2
7
3
6
4
5
0.1 μF
VOL
VCC = 15 to 30 V
100 mA
SHIELD
SHIELD
Fig. 5 IFLH Test Circuit
1
8
2
7
0.1 μF
3
6
VO > 5 V
4
5
IF
SHIELD
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Fig. 6 UVLO Test Circuit
VCC =
15 to 30 V
IF = 10 mA 1
8
2
7
0.1 μF
3
6
VO > 5 V
4
5
VCC
SHIELD
Page 7 of 19
PS9305L,PS9305L2
Chapter Title
<R>
Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms
IF = 10 mA
1
8
500 Ω 2
7
3
6
10 Ω
4
5
10 nF
10 kHz
50% DUTY
CYCLE
0.1 μF
IF
VO
tr
VCC = 15 to 30 V
90%
50%
10%
VOUT
tPLH
SHIELD
tf
tPHL
Fig. 8 CMR Test Circuit and Wave Forms
<R>
IF A
B
1
8
2
7
3
6
4
5
VCM
VCM
δV
=
Δt
δt
0.1 μF
VO
VCC = 30 V
0V
SHIELD
VO
(Switch A: IF = 10 mA)
VCM = 1.5 kV
VO
(Switch B: IF = 0 mA)
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Δt
VOH
26 V
1V
VOL
Page 8 of 19
PS9305L,PS9305L2
Chapter Title
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DIODE POWER DISSIPATION
vs. AMBIENT TEMPERATURE
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
300
Detector Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
60
50
40
30
20
10
0
20
40
60
100
80
20
40
60
80
5.0
TA = +100°C
+85°C
+50°C
+25°C
0°C
−40°C
0.01
1.0
100
120
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
Threshold Input Current IFLH (mA)
Forward Current IF (mA)
50
FORWARD CURRENT vs.
FORWARD VOLTAGE
0.1
1.2
1.4
1.6
1.8
2.0
2.2
VCC = 30 V,
VEE = GND,
VO > 5 V
4.0
3.0
2.0
1.0
0
−40
2.4
−20
0
20
40
60
80
100
Forward Voltage VF (V)
Ambient Temperature TA (°C)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT
0
VCC = 30 V,
VEE = GND
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
Output Voltage VO (V)
100
Ambient Temperature TA (°C)
1.0
25
20
15
10
5
0
150
Ambient Temperature TA (°C)
10
30
200
0
120
100
35
250
1
2
3
4
5
Forward Current IF (mA)
VCC = 30 V,
VEE = GND,
IF = 10 mA
−40°C
−2
−4
TA = +110°C
−6
−8
0
+25°C
0.5
1.0
1.5
2.0
2.5
High Level Output Current IOH (A)
Remark The graphs indicate nominal characteristics.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 9 of 19
PS9305L,PS9305L2
Chapter Title
VCC = 30 V,
VEE = GND,
IF = 0 mA
2
−40°C
0.5
1
1.5
2
2.5
VCC = 30 V, VEE = GND,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
6
8
10
12
14
16
18
Forward Current IF (mA)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
250
VEE = GND, IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
15
20
25
30
250
VCC = 30 V, VEE = GND,
IF = 10 mA, Rg = 10 Ω,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
10
30
20
40
50
Supply Voltage VCC (V)
Load Capacitance Cg (nF)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
250
VCC = 30 V, VEE = GND,
IF = 10 mA, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
0
250
Low Level Output Current IOL (A)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
+25°C
4
0
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
TA = +110°C
6
10
20
30
40
50
Load Resistance Rg (Ω)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Low Level Output Voltage VOL (V)
8
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
250
VCC = 30 V, VEE = GND,
IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
−40
−20
0
20
40
60
80
100
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 10 of 19
PS9305L,PS9305L2
Chapter Title
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
1.5
ICCH (IF = 10 mA)
ICCL (IF = 0 mA)
1.0
0.5
−40
20
0
20
60
80
VEE = GND,
VO = OPEN
1.5
ICCH (IF = 10 mA)
ICCL (IF = 0 mA)
1.0
0.5
15
100
25
30
Supply Voltage VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = –100 mA
−0.5
−1.0
−1.5
−2.0
−2.5
−3.0
−40 −20
0
20
40
60
80
0.30
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = 100 mA
0.25
0.20
0.15
0.10
0.05
0.00
−40 −20
100
2.0
1.5
1.0
0.5
0.0
−40 −20
0
20
40
60
80
100
Ambient Temperature TA (°C)
3.0
Low Level Output Current IOL (A)
VCC = 30 V, VEE = GND,
IF = 10 mA, VCC–VO = 4 V
2.5
20
40
60
80
100
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
3.0
0
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
High Level Output Current IOH (A)
20
Ambient Temperature TA (°C)
0.0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
40
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
2.0
VCC = 30 V,
VEE = GND,
VO = OPEN
Low Level Output Voltage VOL (V)
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
2.0
VCC = 30 V, VEE = GND,
IF = 10 mA, VO = 2.5 V
2.5
2.0
1.5
1.0
0.5
0.0
−40 −20
0
20
40
60
80
100
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 11 of 19
PS9305L,PS9305L2
Chapter Title
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
Output Voltage VO (V)
12
10
8
UVLOHYS
6
4
2
0
0
VUVLO+
(12.3 V)
VUVLO−
(11.0 V)
5
10
15
20
Supply Voltage VCC – VEE (V)
Remark The graph indicates nominal characteristics.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 12 of 19
PS9305L,PS9305L2
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
7.5±0.1
1.5 +0.1
–0
4.5 MAX.
10.2±0.1
4.0±0.1
16.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
1.5 +0.1
–0
0.35
8.0±0.1
4.05±0.1
6.35±0.1
Tape Direction
PS9305L-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
15.9 to 19.4
Outer edge of
flange
Page 13 of 19
PS9305L,PS9305L2
Chapter Title
<R>
11.5±0.1
1.5 +0.1
–0
4.5 MAX.
12.0±0.1
4.0±0.1
24.0 +0.3
–0.1
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
2.0 +0.1
–0
8.0±0.1
0.35
4.05±0.1
6.35±0.1
Tape Direction
PS9305L2-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 2 000 pcs/reel
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
23.9 to 27.4
Outer edge of
flange
Page 14 of 19
PS9305L,PS9305L2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
C
D
B
<R>
Chapter Title
A
Part Number
Lead Bending
A
B
C
D
PS9305L
lead bending type (Gull-wing)
for surface mount
9.2
1.27
0.8
2.2
PS9305L2
lead bending type (Gull-wing)
for long clearance distance (surface mount)
10.2
1.27
0.8
2.2
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 15 of 19
PS9305L,PS9305L2
Chapter Title
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content
of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 16 of 19
PS9305L,PS9305L2
Chapter Title
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
<R>
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pin 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 17 of 19
PS9305L,PS9305L2
Chapter Title
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Spec.
Unit
40/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
UIORM
Upr
1 130
1 695
Vpeak
Vpeak
Upr
2 119
Vpeak
UTR
8 000
Vpeak
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +125
°C
Operating temperature range
TA
–40 to +110
°C
Ris MIN.
Ris MIN.
10
11
10
Package temperature
Tsi
175
°C
Current (input current IF, Psi = 0)
Isi
400
mA
Power (output or total power dissipation)
Psi
700
mW
Ris MIN.
10
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
12
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Isolation resistance
VIO = 500 V dc at TA = Tsi
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
9
Ω
Page 18 of 19
PS9305L,PS9305L2
Caution
GaAs Products
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0013EJ0200 Rev.2.00
Sep 07, 2011
Page 19 of 19
Revision History
PS9305L, PS9305L2 Data Sheet
Rev.
Date
Page
Description
Summary
0.01
1.00
May 12, 2010
May 16, 2011
−
Throughout
Throughout
p.3
p.4
p.4
p.5
p.6
pp.7, 8
pp.9 to 12
p.13
p.14
pp.15, 16
p.17
First Edition issued
Preliminary Data Sheet -> Data Sheet
Safety standards approved
Modification of MARKING EXAMPLE
Addition of ORDERING INFORMATION
Modification of ABSOLUTE MAXIMUM RATINGS
Modification of ELECTRICAL CHARACTERISTICS ICCH, ICCL
Modification of SWITCHING CHARACTERISTICS |tPHL−tPLH|
Addition of TEST CIRCUIT
Addition of TYPICAL CHARACTERISTICS
Addition of TAPING SPECIFICATIONS
Addition of RECOMMENDED MOUNT PAD DIMENSIONS
Addition of NOTES ON HANDLING
Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
2.00
Sep 07, 2011
Throughout
p.1
Addition of PS9305L2
Addition of SEMKO approved
p.3
p.6
p.8
p.17
Modification of MARKING EXAMPLE
Modification of SWITCHING CHARACTERISTICS tPLH, tPHL, |tPHL−tPLH|
Modification of Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms, and
Fig. 8 CMR Test Circuit and Wave Forms
Modification of USAGE CAUTIONS 2. (2)
All trademarks and registered trademarks are the property of their respective owners.
C-1
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas
Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to
be disclosed by Renesas Electronics such as that disclosed through our website.
2.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
3.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
5.
When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and
regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to
the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations.
6.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
7.
Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas
Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the
use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics.
The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools;
personal electronic equipment; and industrial robots.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically
designed for life support.
"Specific":
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical
implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the
use of Renesas Electronics products beyond such specified ranges.
9.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and
malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or system manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2)
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A.
Tel: +1-408-588-6000, Fax: +1-408-588-6130
Renesas Electronics Canada Limited
1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada
Tel: +1-905-898-5441, Fax: +1-905-898-3220
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-585-100, Fax: +44-1628-585-900
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-65030, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China
Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898
Renesas Electronics Hong Kong Limited
Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2886-9318, Fax: +852 2886-9022/9044
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632
Tel: +65-6213-0200, Fax: +65-6278-8001
Renesas Electronics Malaysia Sdn.Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics Korea Co., Ltd.
11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5141
© 2011 Renesas Electronics Corporation. All rights reserved.
Colophon 1.1