Preliminary Data Sheet PS9306L,PS9306L2 R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 0.6 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER DESCRIPTION The PS9306L and PS9306L2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. The PS9306L and PS9306L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9306L2 has 8 mm creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP. The PS9306L and PS9306L2 are designed specifically for high common mode transient immunity (CMR) and high switching speed. It is suitable for driving IGBTs and MOS FETs. The PS9306L is lead bending type (Gull-wing) for surface mounting. The PS9306L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. FEATURES Long creepage distance (8 mm MIN.: PS9306L2) Half size of 8-pin DIP Peak output current (0.6 A MAX., 0.4 A MIN.) High speed switching (tPLH, tPHL = 0.4 μs MAX.) High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.) Embossed tape product : PS9306L-E3, PS9306L2-E3: 2 000 pcs/reel Pb-Free product Safety standards • UL approved: No. E72422 • CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) • SEMKO approved: No. 1115598 • DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option) PIN CONNECTION (Top View) 6 5 4 SHIELD <R> • • • • • • • • 1 2 1. Anode 2. NC 3. Cathode 4. VEE 5. VO 6. VCC 3 APPLICATIONS • IGBT, Power MOS FET Gate Driver • Industrial inverter • IH (Induction Heating) The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 1 of 19 PS9306L,PS9306L2 Chapter Title PACKAGE DIMENSIONS (UNIT: mm) Lead Bending Type (Gull-wing) For Surface Mount PS9306L 4.58±0.3 6.8±0.25 (0.82) 9.7±0.3 0.25±0.15 0.2±0.15 3.5±0.2 3.7±0.25 7.62 1.27 0.4±0.1 0.8±0.25 0.25 M Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) PS9306L2 4.58±0.3 6.8±0.25 (0.82) 11.5±0.3 1.27 0.4±0.1 R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 0.25±0.15 0.2±0.15 3.5±0.2 3.7±0.25 7.62 0.75±0.25 0.25 M Page 2 of 19 PS9306L,PS9306L2 Chapter Title PHOTOCOUPLER CONSTRUCTION Parameter Air Distance (MIN.) Outer Creepage Distance (MIN.) Isolation Distance (MIN.) <R> PS9306L 7 mm 7 mm 0.4 mm PS9306L2 8 mm 8 mm 0.4 mm MARKING EXAMPLE R 9306 N131 Company Initial Type Number Assembly Lot No. 1 pin Mark N 1 31 Week Assembled Year Assembled (Last 1 Digit) Rank Code R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 3 of 19 PS9306L,PS9306L2 <R> Chapter Title ORDERING INFORMATION Part Number Order Number PS9306L PS9306L-E3 PS9306L-AX PS9306L-E3-AX PS9306L2 PS9306L2-E3 PS9306L2-AX PS9306L2-E3-AX PS9306L-V PS9306L-V-E3 PS9306L-V-AX PS9306L-V-E3-AX PS9306L2-V PS9306L2-V-AX PS9306L2-V-E3 PS9306L2-V-E3-AX Note: Solder Plating Specification Pb-Free (Ni/Pd/Au) Packing Style 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel Safety Standard Approval Application Part *1 Number PS9306L Standard products (UL, CSA, SEMKO approved) PS9306L2 DIN EN60747-5-2 (VDE0884 Part2) approved (Option) PS9306L PS9306L2 *1. For the application of the Safety Standard, following part number should be used. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 4 of 19 PS9306L,PS9306L2 Chapter Title ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Forward Current Diode Peak Transient Forward Current (Pulse Width < 1 μs) Reverse Voltage Power Dissipation *1 Detector High Level Peak *2 Output Current Low Level Peak *2 Output Current Supply Voltage Output Voltage Power Dissipation *3 Isolation Voltage *4 Operating Frequency *5 Operating Ambient Temperature Storage Temperature Symbol IF IF (TRAN) Ratings 25 1.0 Unit mA A VR PD IOH (PEAK) 5 45 0.6 V mW A IOL (PEAK) 0.6 A (VCC−VEE) VO PC BV f TA Tstg 0 to 35 0 to VCC 250 5 000 50 −40 to +110 −55 to +125 V V mW Vr.m.s. kHz °C °C Notes: *1. *2. *3. *4. Reduced to 1.2 mW/°C at TA = 85°C or more. Maximum pulse width = 10 μs, Maximum duty cycle = 0.2% Reduced to 4.5 mW/°C at TA = 65°C or more. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-3 shorted together, 4-6 shorted together. *5. IOH (PEAK) ≤ 0.4 A (≤ 2.0 μs), IOL (PEAK) ≤ 0.4 A (≤ 2.0 μs) RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Forward Current (ON) Forward Voltage (OFF) Operating Ambient Temperature R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Symbol (VCC−VEE) IF (ON) VF (OFF) TA MIN. 10 8 −2 −40 TYP. MAX. 30 12 0.8 110 Unit V mA V °C Page 5 of 19 PS9306L,PS9306L2 Chapter Title ELECTRICAL CHARACTERISTICS (TA = −40 to +110°C, VCC = 10 to 30 V, IF (ON) = 8 to 12 mA, VF (OFF) = −2 to 0.8 V, VEE = GND, unless otherwise specified) Diode Detector <R> <R> Coupled Notes: *1. *2. *3. *4. Parameter Forward Voltage Reverse Current Input Capacitance High Level Output Current Symbol VF IR CIN IOH Low Level Output Current IOL High Level Output Voltage Low Level Output Voltage High Level Supply Current Low Level Supply Current VOH VOL ICCH ICCL Threshold Input Current (L → H) IFLH Conditions MIN. TYP.*1 MAX. IF = 10 mA, TA = 25°C 1.2 1.56 1.8 VR = 3 V, TA = 25°C 10 f = 1 MHz, VF = 0 V, TA = 25°C 30 VO = (VCC − 4 V) *2 0.2 *3 VO = (VCC − 10 V) 0.4 0.5 VO = (VEE + 2.5 V) *2 0.2 0.4 *3 VO = (VEE + 10 V) 0.4 0.5 IO = −100 mA *4 VCC − 4.0 VCC − 1.8 IO = 100 mA 0.4 1.0 IF = 10 mA, IO = 0 mA 0.7 3.0 IF = 0 mA, IO = 0 mA 1.2 3.0 IO = 0 mA, VO > 5 V 7.0 Threshold Input Voltage (H → L) Isolation Capacitance VFHL IO = 0 mA, VO < 5 V CI-O VF = 0 V, f = 1 MHz, TA = 25°C 0.8 Unit V μA pF A A V V mA mA mA V 0.7 pF Typical values at TA = 25°C, VCC − VEE = 30 V. Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%. Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%. VOH is measured with the DC load current in this testing. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 6 of 19 PS9306L,PS9306L2 Chapter Title SWITCHING CHARACTERISTICS (TA = −40 to +110°C, VCC = 10 to 30 V, IF (ON) = 8 to 12 mA, VF (OFF) = −2 to 0.8 V, VEE = GND, unless otherwise specified) Parameter Symbol Propagation Delay Time (L → H) tPLH Propagation Delay Time (H → L) tPHL Pulse Width Distortion (PWD) |tPHL−tPLH| tPHL−tPLH Propagation Delay Time (Difference Between Any Two Products) Rise Time tr Fall Time tf |CMH| Common Mode Transient Immunity at High Level Output Common Mode Transient Immunity at Low Level Output |CML| Conditions Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty Cycle = 50%*2, MIN. 0.05 0.05 IF = 10 mA, VCC = 30 V −0.3 TYP.*1 0.18 0.18 MAX. 0.4 0.4 0.25 0.3 50 50 Unit μs μs μs μs TA = 25°C, IF = 10 mA, VCC = 30 V, VCM = 1.5 kV, VO (MIN.) = 26 V 25 ns ns kV/μs TA = 25°C, IF = 0 mA, VCC = 30 V, VCM = 1.5 kV, VO (MAX.) = 1 V 25 kV/μs Notes: *1. Typical values at TA = 25°C, VCC − VEE = 30 V. *2. This load condition is equivalent to the IGBT load at 1 200 V/25 A. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 7 of 19 PS9306L,PS9306L2 Chapter Title TEST CIRCUIT Fig. 2 IOL Test Circuit Fig. 1 IOH Test Circuit VCC = 10 to 30 V 1 6 VCC = 10 to 30 V 1 6 2 5 3 4 0.1 μ F 0.1 μ F 4V 5 2 IOL IOH 3 IF = 8 to 12 mA SHIELD 2.5 V 4 SHIELD Fig. 3 VOH Test Circuit Fig. 4 VOL Test Circuit VCC = 10 to 30 V 1 6 VCC = 10 to 30 V 1 6 2 5 0.1 μ F 5 2 3 IF = 8 to 12 mA <R> SHIELD 4 0.1 μ F VOH 100 mA 3 SHIELD Fig. 5 IFLH Test Circuit VOL 100 mA 4 Fig. 6 ICCH/ICCL Test Circuit VCC = 10 to 30 V 1 VCC = 10 to 30 V 1 6 6 0.1 μ F 5 2 IF 3 SHIELD 4 0.1 μ F VO > 5 V 5 2 3 SHIELD 4 ICCL: IF = 0 mA ICCH: IF = 10 mA R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 8 of 19 PS9306L,PS9306L2 Chapter Title <R> Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms VCC = 10 to 30 V IF = 10 mA 1 6 IF 0.1 μ F 10 kHz 50% DUTY CYCLE 5 2 3 <R> 47 Ω 3 nF tf 90% 50% 10% VOUT 4 SHIELD tr VO tPLH tPHL Fig. 8 CMR Test Circuit and Wave Forms IF A VCC = 30 V 1 6 0.1 μ F B 2 5 3 4 SHIELD + − 1 500 V 90% VCM VO 10% tr VO (Switch A: IF = 10 mA) VO (Switch B: IF = 0 mA) tf VOH 26 V 1V VOL VCM = 1.5 kV Remarks 1. Common Mode Transient Immunity at High Level Output is the maximum value of dVCM/dt at which the output remains High Level (e.g. VO > 26 V). 2. Common Mode Transient Immunity at Low Level Output is the maximum value of dVCM/dt at which the output remains Low Level (e.g. VO < 1.0 V). R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 9 of 19 PS9306L,PS9306L2 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 300 Detector Power Dissipation PC (mW) Diode Power Dissipation PD (mW) 50 45 40 35 30 25 20 15 10 5 0 0 50 75 100 125 100 50 0 25 50 75 100 125 FORWARD CURRENT vs. FORWARD VOLTAGE THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE 7 Threshold Input Current IFLH (mA) Forward Current IF (mA) 150 Ambient Temperature TA (°C) TA = +110°C +100°C +85°C +50°C +25°C 0°C –40°C 1 0.1 1.2 1.4 1.6 1.8 2.0 2.2 VCC = 30 V, VO > 5 V, IO = 0 mA 6 5 4 3 2 1 0 –50 2.4 –25 0 25 50 75 100 125 Forward Voltage VF (V) Ambient Temperature TA (°C) OUTPUT VOLTAGE vs. FORWARD CURRENT HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE 35 0 High Level Output Voltage – Supply Voltage VOH – VCC (V) VCC = 30 V 30 25 20 15 10 5 0 200 Ambient Temperature TA (°C) 10 0.01 1.0 250 0 25 100 Output Voltage VO (V) <R> Chapter Title 2 4 6 7 Forward Current IF (mA) VCC = 30 V, IF = 10 mA, IO = –100 mA –0.5 –1 –1.5 –2 –2.5 –3 –3.5 –4 –50 –25 0 25 50 75 100 125 Ambient Temperature TA (°C) Remark The graphs indicate nominal characteristics. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 10 of 19 PS9306L,PS9306L2 Chapter Title 1 VCC = 30 V, 0.9 IF = 10 mA, 0.8 (VCC – VOH) = 4 V Low Level Output Current IOL (A) 1 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 –50 –25 0 25 50 75 100 VCC = 30 V, IF = 0 mA, VOL = 2.5 V 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 –50 125 0 25 50 75 100 Ambient Temperature TA (°C) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE SUPPLY CURRENT vs. AMBIENT TEMPERATURE VCC = 30 V, IF = 0 mA, IO = 100 mA 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 –50 –25 0 25 50 75 100 3 2.5 2 1.5 ICCL (IF = 0 mA) 1 ICCH (IF = 10 mA) 0.5 0 –50 125 125 VCC = 30 V, VO = OPEN Ambient Temperature TA (°C) –25 0 25 50 75 100 125 Ambient Temperature TA (°C) LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT 0 4 Low Level Output Voltage VOL (V) High Level Output Voltage – Supply Voltage VOH – VCC (V) –25 Ambient Temperature TA (°C) 1 Low Level Output Voltage VOL (V) LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) High Level Output Current IOH (A) HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE –1 –2 –3 –4 VCC = 30 V, IF = 10 mA –5 0 0.1 0.2 0.3 0.4 0.5 VCC = 30 V, IF = 0 mA 3 2 1 0 0.6 High Level Output Current IOH (A) 0 0.1 0.2 0.3 0.4 0.5 0.6 Low Level Output Current IOL (A) Remark The graphs indicate nominal characteristics. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 11 of 19 PS9306L,PS9306L2 Chapter Title PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE VO = OPEN 2.5 2 1.5 ICCL (IF = 0 mA) 1 ICCH (IF = 10 mA) 0.5 25 30 250 tPHL 200 150 tPLH 100 PWD 50 0 –50 –25 0 25 50 75 100 PROPAGATION DELAY TIME vs. SUPPLY VOLTAGE 300 250 200 150 tPLH tPHL 50 10 20 400 350 IF = 10 mA, Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% 250 200 tPHL 150 tPLH 100 50 15 20 25 Forward Current IF (mA) Supply Voltage VCC (V) PROPAGATION DELAY TIME vs. LOAD CAPACITANCE PROPAGATION DELAY TIME vs. LOAD RESISTANCE VCC = 30 V, IF = 10 mA, Rg = 47 Ω, f = 10 kHz, Duty cycle = 50% 350 300 250 200 tPHL 150 tPLH 100 50 0 50 100 Load Capacitance Cg (nF) 125 300 0 10 25 400 0 300 PROPAGATION DELAY TIME vs. FORWARD CURRENT 350 0 VCC = 30 V, IF = 10 mA, Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% 350 Ambient Temperature TA (°C) VCC = 30 V, Rg = 47 Ω, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% 100 400 Supply Voltage VCC (V) 400 0 Propagation Delay Time tPHL, tPLH (ns) 20 15 Propagation Delay Time tPHL, tPLH (ns) Propagation Delay Time tPHL, tPLH (ns) 0 10 Propagation Delay Time tPHL, tPLH (ns) High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) 3 Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) SUPPLY CURRENT vs. SUPPLY VOLTAGE 400 350 30 VCC = 30 V, IF = 10 mA, Cg = 3 nF, f = 10 kHz, Duty cycle = 50% 300 250 200 tPHL 150 tPLH 100 50 0 0 50 100 Load Resistance Rg (Ω) Remark The graphs indicate nominal characteristics. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 12 of 19 PS9306L,PS9306L2 TAPING SPECIFICATIONS (UNIT: mm) 7.5±0.1 1.5 +0.1 –0 4.5 MAX. 10.2±0.1 4.0±0.1 16.0±0.3 2.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 1.5 +0.1 –0 0.35 8.0±0.1 5.08±0.1 4.05±0.1 Tape Direction PS9306L-E3 Outline and Dimensions (Reel) 2.0±0.5 13.0±0.2 R 1.0 100±1.0 2.0±0.5 330±2.0 <R> Chapter Title 21.0±0.8 17.5±1.0 21.5±1.0 Packing: 2 000 pcs/reel R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 15.9 to 19.4 Outer edge of flange Page 13 of 19 PS9306L,PS9306L2 Chapter Title 11.5±0.1 1.5 +0.1 –0 4.5 MAX. 12.0±0.1 4.0±0.1 24.0±0.3 2.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.0 +0.1 –0 8.0±0.1 0.35 4.05±0.1 5.08±0.1 Tape Direction PS9306L2-E3 Outline and Dimensions (Reel) R 1.0 100±1.0 2.0±0.5 13.0±0.2 330±2.0 2.0±0.5 21.0±0.8 25.5±1.0 29.5±1.0 Packing: 2 000 pcs/reel R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 23.9 to 27.4 Outer edge of flange Page 14 of 19 PS9306L,PS9306L2 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) C D B <R> Chapter Title A Part Number Lead Bending A B C D PS9306L lead bending type (Gull-wing) for surface mount 9.2 1.27 0.8 2.2 PS9306L2 lead bending type (Gull-wing) for long creepage distance (surface mount) 10.2 1.27 0.8 2.2 R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 15 of 19 PS9306L,PS9306L2 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature • Time of peak reflow temperature • Time of temperature higher than 220°C • Time to preheat temperature from 120 to 180°C • Number of reflows • Flux 260°C or below (package surface temperature) 10 seconds or less 60 seconds or less 120±30 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (°C) <R> Chapter Title (heating) to 10 s 260°C MAX. 220°C to 60 s 180°C 120°C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature • Time • Preheating conditions • Number of times • Flux 260°C or below (molten solder temperature) 10 seconds or less 120°C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron • Peak Temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 16 of 19 PS9306L,PS9306L2 <R> Chapter Title USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics. (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly evaluate operation.) (3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. Note: *1. NC: Non-Connection (No Connection). 3. Make sure the rise/fall time of the forward current is 0.5 μs or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less. 5. Avoid storage at a high temperature and high humidity. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 17 of 19 PS9306L,PS9306L2 <R> Chapter Title SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Climatic test class (IEC 60068-1/DIN EN 60068-1) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.6 × UIORM., Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 × UIORM., Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) Material group (DIN EN 60664-1 VDE0110 Part 1) Storage temperature range Operating temperature range Isolation resistance, minimum value VIO = 500 V dc at TA = 25°C VIO = 500 V dc at TA MAX. at least 100°C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Symbol Spec. 40/110/21 Unit UIORM Upr 1 130 1 808 Vpeak Vpeak Upr 2 119 Vpeak UTR Vpeak Tstg TA 8 000 2 175 III a –55 to +125 –40 to +110 Ris MIN. Ris MIN. 1012 11 10 Ω Ω Tsi Isi Psi 175 400 700 °C mA mW Ris MIN. 109 Ω CTI °C °C Page 18 of 19 PS9306L,PS9306L2 Caution GaAs Products Chapter Title This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. R08DS0017EJ0100 Rev.1.00 Nov 10, 2011 Page 19 of 19 Revision History PS9306L,PS9306L2 Data Sheet Rev. Date Page Description Summary 0.01 1.00 Aug 20, 2010 Nov 10, 2011 − Throughout Throughout p.3 p.6 p.8 p.9 pp.10 to 12 pp.13, 14 p.15 p.16 p.17 p.18 First edition issued Preliminary Data Sheet → Data Sheet Safety standards approved Modification of MARKING EXAMPLE Modification of ELECTRICAL CHARACTERISTICS Addition of TEST CIRCUIT Fig. 6 Modification of TEST CIRCUIT Fig. 7, 8 Addition of TYPICAL CHARACTERISTICS Addition of TAPING SPECIFICATIONS Addition of RECOMMENDED MOUNT PAD DIMENSIONS Modification of NOTES ON HANDLING Modification of USAGE CAUTIONS Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. 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The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A. Tel: +1-408-588-6000, Fax: +1-408-588-6130 Renesas Electronics Canada Limited 1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada Tel: +1-905-898-5441, Fax: +1-905-898-3220 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-585-100, Fax: +44-1628-585-900 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Düsseldorf, Germany Tel: +49-211-65030, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. 7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898 Renesas Electronics Hong Kong Limited Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2886-9318, Fax: +852 2886-9022/9044 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632 Tel: +65-6213-0200, Fax: +65-6278-8001 Renesas Electronics Malaysia Sdn.Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics Korea Co., Ltd. 11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea Tel: +82-2-558-3737, Fax: +82-2-558-5141 © 2011 Renesas Electronics Corporation. All rights reserved. Colophon 1.1