SEMTECH ELECTRONICS LTD.

S1A THRU S1M (DO-214AC)
SURFACE MOUNT RECTIFIERS
Reverse Voltage – 50 to 1000 Volts
Forward Current – 1.0 Ampere
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• Glass passivated chip junction
• For surface mount application
• Low profile package
• Built-in strain relief, ideal for automated placement
Mechanical Data
• Case: JEDEC DO-214AC, molded plastic over passivated chip
• Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
• High temperature solder: 250℃/10 seconds at terminals
• Polarity: Color band denotes cathode end
Absolute Maximum Ratings and Characteristics
Ratings at 25oC ambient temperature unless otherwise specified.
Symbols
S1A
S1B
S1D
S1G
S1J
S1K
S1M Units
Maximum recurrent peak reverse voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Maximum average forward rectified current
IF(AV)
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) TL = 110 OC
IFSM
Maximum Instantaneous forward voltage at 1.0A
VF
Maximum DC reverse current
at TA = 25℃
IR
at rated DC blocking voltage
at TA = 125℃
IR
50
Ctot
12
pF
trr
1.8
μs
Typical Junction Capacitance
at VR = 4.0 V, f = 1 MHZ
Typical Reverse Recovery Time
at IF = 0.5A, IR = 1.0A, Irr = 0.25A
Typical thermal resistance (Note 1)
Operating junction and storage temperature range
1.0
A
40
30
1.1
V
1.0
5.0
RθJA
75
85
RθJL
27
30
TJ ,TS
A
μA
O
O
-55 to +150
Notes: 1. Thermal resistance from junction to ambient from junction to lead mounted on P.C.B. with
0.2 ×0.2” (5.0 ×5.0mm2) copper pad areas
SEMTECH ELECTRONICS LTD.
®
C/W
(Subsidiary of Semtech International Holdings Limited, acompany
listed on the Hong Kong Stock Exchange, Stock Code: 724)
Dated : 25/07/2005
C
S1A THRU S1M (DO-214AC)
FIG.2- PEAK FORWARD SURGE CURRENT
FIG.1-FORWARD DERATING CURVE
AVERAGE FORWARD CURRENT, A
RESISTIVE OR
INDUCTIVE LOAD
1
0.8
0.6
S1(A.J)
0.4
S1(K.M)
0.2x0.2(5.0x5.0mm)
Thick copper pad areas
0.2
0
0
20
40
60
80
120 140
100
160
PEAK FORWARD SURGE CURRENT, A
100
1.2
TL=110 C
8.3ms Single half Sine Wave
(JEDEC Method)
S1(A.J)
10
S1(K.M)
1
1
LEAD TEMPERATURE, ( C)
100
10
NUMBER OF CYCLES AT 60Hz
FIG.3-TYPICAL FORWARD CHARACTERISTICS
FIG.4-TYPICAL REVERSE
CHARACTERISTICS
10
1
o
TJ =25 C
PULSE WIDTH=300 s
1% DUTY CYCLE
0.1
0.01
0.4 0.6
0.8
1.0
1.2
1.4
1.6
1.8
100
INSTANTANEOUS REVERSE CURRENT( A)
INSTANTANEOUS FORWARD CURRENT(A)
100
2.0
10
TJ=125 C
1
TJ=75 C
0.1
TJ=25 C
0.01
INSTANTANEOUS FORWARD VOLTAGE (V)
0.001
0
FIG.5- TYPICAL JUNCTION CAPACITANCE
1
0.01
0.1
1
REVERSE VOLTAGE, V
10
100
TRANSIENT THERMAL IMPEDANCE ( oC/W)
JUNCTION CAPACITANCE, pF
10
40
60
80
100
PERCENT OF RATED PEAK REVERSE
VOLTS,%
100
TJ=25 C
f=1.0MHz
Vsig=50mVp-p
20
FIG.6- TRANSIENT THERMAL
IMPEDANCE
1000
S1(K.M)
100
S1(A.J)
10
1
0.01
0.1
1
10
100
t, PULSE DURATION
SEMTECH ELECTRONICS LTD.
®
(Subsidiary of Semtech International Holdings Limited, acompany
listed on the Hong Kong Stock Exchange, Stock Code: 724)
Dated : 25/07/2005