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DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC393 LOW POWER DUAL COMPARATORS DESCRIPTION FEATURES The µPC393 is a dual comparator which is designed to operate from a single power supply over a wide range • Common-mode input voltage range includes V– • Wide supply voltage range of voltage. Operation from split power supplies is also 2 V to 32 V (Single) possible and the power supply current drain is very low. ±1 V to ±16 V (Split) Further advantage, the input common-mode voltage in- • Low supply current cludes ground, even though operated from a single power • Open collector output supply voltage. EQUIVALENT CIRCUIT (1/2 Circuit) <R> PIN CONFIGURATION (Top View) V+ 100 µ A µ PC393C, 393G2 100 µ A 8 V+ OUT1 1 IN + Q1 Q2 Q3 OUT Q4 II 7 OUT2 I I1 2 1 Q8 – + – 2 + – I N1 3 6 I I2 V– 4 5 I N2 Q7 Q5 Q6 V– <R> ORDERING INFORAMTION Part Number Package µPC393C 8-pin plastic DIP (7.62 mm (300)) µPC393G2 8-pin plastic SOP (5.72 mm (225)) µPC393G2(5) 8-pin plastic SOP (5.72 mm (225)) The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G11766EJ5V0DS00 (5th edition) Date Published December 2007 N Printed in Japan The mark <R> shows major revised points. 1989 µPC393 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Voltage between V+ and V– Note 1 Differential Input Voltage Symbol Ratings Unit V+ –V– –0.3 to +36 V VID ±36 V Input Voltage Note 2 VI V– –0.3 to V– +36 V Output Voltage Note 3 VO V– –0.3 to V– +36 V Note 4 PT 350 mW 440 mW Indefinite sec Power Dissipation C Package G2 Package Note 5 Output Short Circuit Duration Note 6 Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to + 125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction independent of the magnitude of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will establish when any input is within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction independent of the magnitude of V+. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55 °C. 5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25 °C. 6. Short circuits from the output to V+ can cause destruction. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage (Split) – Supply Voltage (V = GND) 2 Symbol V V ± + MIN. MAX. Unit ±1 ±16 V +2 +32 V Data Sheet G11766EJ5V0DS00 TYP. µPC393 <R> µPC393C, µPC393G2 ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = 5 V, V– = GND) Parameter Input Offset Voltage Input Offset Current Input Bias CurrentNote 7 Voltage Gain Supply CurrentNote 8 Symbol Conditions MIN. TYP. MAX. Unit VIO VO = 1.4 V, VREF = 1.4 V, RS = 0 Ω ±2 ±5 mV IIO ±5 ±50 nA IB VO ·=· 1.4 V VO ·=· 1.4 V 25 250 nA AV RL = 15 kΩ 200 ICC RL = ∞, IO = 0 A 0.6 Common Mode lnput Voltage Range VICM Output Saturation Voltage VOL VIN (–) = 1 V, VIN (+) = 0 V, IO SINK = 4 mA Output Sink Current IO SINK VIN (–) = 1 V, VIN (+) = 0 V, VO ≤ 1.5 V Output Leakage Current IO LEAK Response Time 0 0.2 6 V/mV 1 mA + V –1.5 V 0.4 V 16 mA VIN (+) = 1 V, VIN (–) = 0 V, VO = 5 V 0.1 nA RL = 5.1 kΩ, VRL = 5 V 1.3 µs µPC393G2(5) ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = 5 V, V– = GND) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage VIO VO = 1.4 V, VREF = 1.4 V, RS = 0 Ω ±2 ±2.5 mV Input Offset Current IIO ±5 ±50 nA IB VO ·=· 1.4 V VO ·=· 1.4 V 25 60 nA AV RL = 15 kΩ 200 ICC RL = ∞, IO = 0 A 0.6 Input Bias CurrentNote 7 Voltage Gain Supply CurrentNote 8 Common Mode lnput Voltage Range VICM Output Saturation Voltage VOL VIN (–) = 1 V, VIN (+) = 0 V, IO SINK = 4 mA Output Sink Current IO SINK VIN (–) = 1 V, VIN (+) = 0 V, VO ≤ 1.5 V Output Leakage Current IO LEAK VIN (+) = 1 V, VIN (–) = 0 V, VO = 5 V 0.1 RL = 5.1 kΩ, VRL = 5 V 1.3 Response Time 0 10 V/mV 1 mA + V –1.4 V 0.2 V 16 mA 100 nA µs Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage. 8. This current flows irrespective of the existence of use. Data Sheet G11766EJ5V0DS00 3 µPC393 APPLICATION CIRCUIT EXAMPLE V+ VIN 2, 6 RL – 8 OUT 1, 7 3, 5 4 + VREF VREF: V– to V+ –1.5 (V) COMPARATOR with HYSTERESIS CIRCUIT V+ VRL RL – VIN OUT + R2 R1 VREF • Threshold voltage · VREF + VTH (High) = · R1 (VRL – VREF) RL + R2 + R1 · VREF – VTH (Low) = · R1 (VREF – VOL) R1 + R2 (VRL > VREF > VOL) 4 Data Sheet G11766EJ5V0DS00 µPC393 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.) <R> POWER DISSIPATION SUPPLY CURRENT 1.0 393G2 ICC - Supply Current - mA PT - Total Dissipation - mW 500 400 393C 300 200 100 0 RL = ∞ IO = 0A TA = 0 °C 0.8 TA = 25 °C 0.6 TA = 70 °C 0.4 20 40 60 80 0 100 TA - Operating Ambient Temperature - °C 10 IB - Input Bias Current - nA VIO - Input Offset Voltage - mV 1 0 –1 TA = 0 °C 40 30 TA = 25 °C 20 TA = 70 °C –2 –3 –40 –20 0 20 40 40 50 V+ = +5 V V– = GND each 5 samples data 2 30 INPUT BIAS CURRENT INPUT OFFSET VOLTAGE 3 20 V+ - Supply Voltage - V (V– = GND) 60 80 10 TA - Operating Ambient Temperature - °C 0 10 + 20 30 40 – V - Supply Voltage - V (V = GND) OUTPUT SATURATION VOLTAGE VOL - Output Saturation Voltage - V 10 1 0.1 TA = 70 °C 0.01 TA = 25 °C TA = 0 °C 0.001 0.01 0.1 1 10 100 IO SINK - Output Sink Current - mA Data Sheet G11766EJ5V0DS00 5 µPC393 RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES I RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES II 20 mV +5 V 3 2 VIN 5.1 kΩ – 100 mV VO + 1 100 20 mV 50 0 5 mV –50 –100 5 mV 3 VIN – + 2 VO 20 mV 1 100 5 mV Input Overdrive 50 0 20 mV 100 mV –50 –100 0 0.5 1.0 1.5 2.0 t - Time - µ s 6 +5 V 4 0 100 mV Input Overdrive VIN - Input Voltage - mV VIN - Input Voltage - mV 0 5 0 0.5 1.0 t - Time - µ s Data Sheet G11766EJ5V0DS00 1.5 5.1 kΩ 4 100 mV Input Overdrive VO - Output Voltage - V VO - Output Voltage - V 5.0 mV Input Overdrive 5 2.0 µPC393 <R> PACKAGE DRAWINGS (Unit: mm) 8-PIN PLASTIC DIP (7.62mm(300)) 8 5 1 4 A K J L P I C H G B M R F D N M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS A B 10.16 MAX. 1.27 MAX. C 2.54 (T.P.) D 0.50±0.10 F 1.4 MIN. G H 3.2±0.3 0.51 MIN. I J 4.31 MAX. 5.08 MAX. K 7.62 (T.P.) L 6.4 M 0.25 +0.10 −0.05 N 0.25 P 0.9 MIN. R 0∼15° P8C-100-300B,C-2 Data Sheet G11766EJ5V0DS00 7 µPC393 8-PIN PLASTIC SOP (5.72 mm (225)) 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.59±0.21 G 1.49 H 6.5±0.3 I 4.4±0.15 J 1.1±0.2 K 0.17 +0.08 −0.07 L 0.6±0.2 M 0.12 N 0.10 P 3° +7° −3° S8GM-50-225B-6 8 Data Sheet G11766EJ5V0DS00 µPC393 <R> RECOMMENDED SOLDERING CONDITIONS The µPC393 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of surface mount device µPC393G2, µPC393G2(5): 8-pin plastic SOP (5.72 mm (225)) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 235 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 3 time. IR35-00-3 Vapor Phase Soldering Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 3 time. VP15-00-3 Wave Soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 350 °C or below, Heat time: 3 seconds or less (Per each side of the device). P350 Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Type of through-hold device µPC393C : 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering (only to leads) Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (per each lead.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Data Sheet G11766EJ5V0DS00 9 µPC393 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html NEC SEMICONDUCTOR DEVICE RELIABILITY/ IEI-1212 QUALITY CONTROL SYSTEM - STANDARD LINEAR IC 10 Data Sheet G11766EJ5V0DS00 µPC393 • The information in this document is current as of December, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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