µPD166104 - Renesas Electronics

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Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
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April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
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Notice
1.
2.
3.
4.
5.
6.
7.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
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expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”:
8.
9.
10.
11.
12.
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
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You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
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DATA SHEET
MOS INTEGRATED CIRCUIT
μPD166104
DUAL N-CANNEL LOW SIDE INTELLIGENT POWER DEVICE
The μPD166104 is a high voltage, dual output, and N-cannel low side intelligent power device with built-in overheat
protection and overcurrent limitation circuits. It protects itself by shutting down or limiting current when it detects
overheat or overcurrent. Output MOS shut down is restarted automatically by cooling of the chip temperature.
FEATURES
•
•
•
•
•
High voltage dual output low side driver
Built-in overcurrent limitation circuits and overheat protection circuits
- Shuts down by overheat detection
- Restarts automatically after cooling
Built-in dynamic clamping circuit (100 V Min.)
Low on-state resistance
Small 20-pin SOP package
ORDERING INFORMATION
Part Number
Lead plating
Packing
Package
Remark
μPD166104GS-E1-AZ
μPD166104GS-E2-AZ
Sn-Bi
Tape 2500 p/reel
20-pin plastic SOP (7.62 mm (300))
Lead-free product
Sn-Bi
Tape 2500 p/reel
20-pin plastic SOP (7.62 mm (300))
Lead-free product
QUALITY GRADE
Part Number
Quality Grade
μPD166104GS-E1-AZ
μPD166104GS-E2-AZ
Special
Special
Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
APPLICATION
• Injector driver
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. S18753EJ1V0DS00 (1st edition)
Date Published June 2007 NS
Printed in Japan
2007
μPD166104
BLOCK DIAGRAM
VCC1
Dynamic
Clamping Circuit
OUT1
IN1
Input
Circuit
Current
Limitation
Overheat
Protection
Output MOS
(N-ch)
GND1
Ch 1
VCC2
OUT2
IN2
Ch 2
GND2
PIN CONFIGURATION
• 20-pin plastic SOP (7.62 mm (300))
Top View
1
2
3
4
5
6
7
8
9
10
OUT1
IN1
N.C.
VCC1
OUT1
OUT2
IN2
N.C.
VCC2
OUT2
20
19
18
17
16
15
14
13
12
11
OUT1
GND1
GND1
GND1
OUT1
OUT2
GND2
GND2
GND2
OUT2
Pin Name
Pin No.
2
Pin Name
Pin No.
Pin Name
Pin No.
Pin Name
Pin No.
Pin Name
1
OUT1
6
OUT2
11
OUT2
16
OUT1
2
IN1
7
IN2
12
GND2
17
GND1
3
N.C.
8
N.C.
13
GND2
18
GND1
4
VCC1
9
VCC2
14
GND2
19
GND1
5
OUT1
10
OUT2
15
OUT2
20
OUT1
Data Sheet S18753EJ1V0DS
μPD166104
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Input voltage
VIN
−1.5 to +7
V
Power supply voltage
VCC1
−0.5 to +18
V
VCC2
1s
35
V
Output voltage
VOUT
Except the clamping voltage at the flyback time
100
V
Output current
IO (DC)
VIN = 5 V, DC
SELF LIMITED
A/ch
2.5
W
150
°C
−55 to +150
°C
Power dissipation
PD
Channel temperature
Tch
Storage temperature
Tstg
Ta = 25 °C, both channels are ON
Note
Note When mounted on 50 mm x 50 mm x 1.5 mm epoxy PCB FR4 substrate with 600 mm x 70 μm copper foil.
2
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameters. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
The ratings and conditions indicated for DC characteristics and AC characteristics represent the
quality assurance range during normal operation.
Data Sheet S18753EJ1V0DS
3
μPD166104
ELECTRICAL SPECIFICATIONS (VCC = 5 to 18 V, Tch = –40 to 150 °C, unless otherwise specified)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
High level input voltage
VIH
Rin = 1 kΩ, VDS = 0.3 V, IO = 1.4 A
Low level input voltage
VIL
Rin = 1 kΩ, VDS = 20 V, IO = 1 mA
1.5
V
High level input current
IIH
VIN = 5.5 V, VDS = 0 V
300
μA
Low level input current
IIL
VIN = 0 V, VDS = 20 V
+10
μA
Power supply current
ICC1
VCC = 16 V, ON condition
10.0
mA/ch
ICC2
VCC = 16 V, OFF condition
10.0
mA/ch
RDS(on)1
Io = 1.4 A, Tch = 25 °C, VIN = VIH, VCC = 16 V
64
91
mΩ
RDS(on)2
Io = 1.4 A, Tch = 150 °C, VIN = VIH, Vcc = 16 V
107
146
mΩ
35
μs
35
μs
30
μs
15
μs
350
μA
130
V
Output ON state resistance
Turn on time
ton
Rise time
tr
Turn off time
toff
3.0
V
–10
VIN = 0→5 V, Rin = 1 kΩ, RL = 8 Ω, VCC = 12 V,
3.5
Tch = 0 to 150 °C
VIN = 5→0 V, Rin = 1 kΩ, RL = 8 Ω, VCC = 12 V,
Tch = 0 to 150 °C
Fall time
tf
Output leak current
IDSS
VIN = 0 V, VDS = 18 V
Clamp voltage
VOUT
IO = 10 mA, Tch = 25 °C, VIN = 0 V
Temperature characteristics of
ΔVZ
IO = 1.4 A, VIN = VIL, L = 1mH
100
130
mV/°C
clamp voltage
Overheat detection temperature
THI
150
°C
Current limitation
ILIM
1.7
A
Switching mesurement circuit
Switching measurement waveform
12 V
μPD166104
1 kΩ
IN
VIN
8Ω
VCC
50%
50%
IN
Wave Form
OUT
ton
toff
GND
tr
OUT
Wave Form
90%
10%
4
Data Sheet S18753EJ1V0DS
tf
90%
10%
μPD166104
• Input circuit (On/Off control)
Output MOS turns on when the high-level input voltage (3.0 V or more) is applied to IN terminal.
Output MOS turns off when the low-level input voltage (1.5 V or less) is applied to IN terminal.
“H”
5V
VIN
“H”
“L”
“L”
“L”
OFF
OFF
OFF
GND
VOUT
(Resistance load)
“H”
VOUT
ON
GND
ON
“L”
OFF
ON
• Dynamic clamp circuit
This circuit is for protection of output and other circuits from the overvoltage by back electromotive force when
inductive load turns off. The clamp diode is connected between drain and gate of output. Output voltage is clamped by
this circuit when the voltage of the OUT terminal exceeded the output clamping voltage.
VIN
5V
“H”
“L”
“L”
GND
Vz
OFF
OFF
VOUT
(Inductive load)
VOUT
ON
GND
• Current limitation circuit
This circuit prevents destruction from the overcurrent when the short-circuit occurs. When the overcurrent flows to
the OUT terminal such as short-circuit condition, the output current is limited.
Power supply voltage to OUT terminal should be 18 V or less when the short-circuit occurs.
• Overheat protection circuit
This circuit prevents destruction from overheat. The channel temperature of the output is monitored and the output
is shut down when overheat is detected. Output restarts automatically after the channel cooled down.
“H”
VIN
“L”
“L”
5V
GND
VCC
VOUT
THI
Tch
Data Sheet S18753EJ1V0DS
5
μPD166104
TYPICAL CHARACTERISTICS
HIGH LEVEL INPUT VOLTAGE vs.
SUPPLY VOLTAGE
HIGH LEVEL INPUT VOLTAGE vs.
AMBIENT TEMPERATURE
3.5
VIH - High Level Input Voltage - V
VIH - High Level Input Voltage - V
3.5
3.0
2.5
2.0
1.5
3.0
2.5
2.0
1.5
1.0
1.0
–50
0
5
10
15
20
0
50
100
150
200
Ta - Ambient Temperature - °C
VCC - Supply Voltage -
LOW LEVEL INPUT VOLTAGE vs.
SUPPLY VOLTAGE
LOW LEVEL INPUT VOLTAGE vs.
AMBIENT TEMPERATURE
3.5
VIL - Low Level Input Voltage - V
VIL - Low Level Input Voltage - V
3.5
3.0
2.5
2.0
1.5
3.0
2.5
2.0
1.5
1.0
1.0
0
5
10
15
–50
20
HIGH LEVEL INPUT CURRENT vs.
SUPPLY VOLTAGE
100
150
200
HIGH LEVEL INPUT CURRENT vs.
AMBIENT TEMPERATURE
300
IIH - High Level Input Current - μA
300
IIH - High Level Input Current - μA
50
Ta - Ambient Temperature - °C
VCC - Supply Voltage -
250
200
150
100
50
0
250
200
150
100
50
0
0
5
10
15
20
–50
VCC - Supply Voltage -
6
0
0
50
100
150
Ta - Ambient Temperature - °C
Data Sheet S18753EJ1V0DS
200
μPD166104
OPERATING CURRENT vs.
OUTPUT LEAKAGE CURRENT vs.
AMBIENT TENPERATURE
AMBIENT TEMPERATURE
120
4.0
IDSS - Output Leakage Current - μA
ICC - Operating Current - mA
3.5
ICC1
3.0
2.5
ICC2
2.0
1.5
1.0
0.5
100
80
60
40
20
0.0
0
–50
0
50
100
150
200
–50
0
150
TURN ON TIME vs.
TURN OFF TIME vs.
AMBIENT TEMPERATURE
25
25
20
20
toff - Turn Off Time - μs
ton - Turn On Time - μs
100
AMBIENT TEMPERATURE
15
10
5
200
15
10
5
0
0
–50
0
50
100
150
200
–50
0
50
100
150
200
Ta - Ambient Temperature - °C
Ta - Ambient Temperature - °C
RISE TIME vs.
FALL TIME vs.
AMBIENT TEMPERATURE
AMBIENT TEMPERATURE
25
25
20
20
tf - Fall Time - μs
tr - Rise Time - μs
50
Ta - Ambient Temperature - °C
Ta - Ambient Temperature - °C
15
10
5
15
10
5
0
0
–50
0
50
100
150
200
–50
Ta - Ambient Temperature - °C
0
50
100
150
200
Ta - Ambient Temperature - °C
Data Sheet S18753EJ1V0DS
7
μPD166104
ON STATE RESISTANCE vs.
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
AMBIENT TEMPERATURE
2.5
0.12
PT - Total Power Dissipation - W
RDS(ON) - On State Resistance - Ω
0.14
0.10
0.08
0.06
0.04
0.02
2.0
2 units
1 unit
1.5
1.0
0.5
0.0
0.00
–50
0
50
100
150
0
200
50
100
150
200
Ta - Ambient Temperature - °C
Ta - Ambient Temperature - °C
TRANSIENT THERMAL RESISTANCE CHARACTERISTICS
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
1000
Transient thermal resistance Rth (°C/W)
Device on 50 mm × 50 mm × 1.5 mm epoxy PCB FR4
with 6 cm2 of 70 μm copper area
100
Rth(ch-a) = 62.5 °C/W
Rth(ch-c) = 16.5 °C/W
10
1
0.1
0.001
0.01
0.1
1
Pulse width (s)
8
Data Sheet S18753EJ1V0DS
10
100
1000
μPD166104
APPLICATION EXAMPLE
VBAT
Injector
VCC
Rin
IN1
OUT1
μPD166104
Injector
Rin
OUT2
IN2
GND
Power GND
Micro
computer
Injector
VCC
Rin
IN1
OUT1
μPD166104
Injector
Rin
OUT2
IN2
Rin: ex. 470 Ω
GND
Power GND
GND
Caution This application circuit is example and not intended for use in actual mass production design.
Data Sheet S18753EJ1V0DS
9
μPD166104
PACKAGE DRAWING
20-PIN PLASTIC SOP (7.62 mm (300))
20
11
detail of lead end
P
1
10
A
H
I
G
J
S
L
B
C
D
M
M
N
K
S
E
F
NOTE
ITEM
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
MILLIMETERS
A
12.7±0.3
B
0.78 MAX.
C
1.27 (T.P.)
D
0.42 +0.08
−0.07
E
0.1±0.1
F
1.8 MAX.
G
1.55±0.05
H
7.7±0.3
I
5.6±0.2
J
1.1
K
0.22 +0.08
−0.07
L
M
0.6±0.2
0.12
N
0.10
P
3° +7°
−3°
P20GM-50-300B, C-7
10
Data Sheet S18753EJ1V0DS
μPD166104
TAPING INFORMATION
There are two types (E1, E2) of directions of the device in the career tape.
E1: Pin 1 of the device faces toward
the open end of the tape, away
from the reel
Pin 1 indication
Tape drawout direction
E2: Pin 1 of the device faces away
from the open end of the tape,
toward the reel
Pin 1 indication
MARKING INFORMATION
This figure indicates the marking items and arrangement. However, details of the letterform, the size and the
position aren't indicated.
Country of assembly
D166104GS
Lead-free mark
Pin 1 indication
Lot number
Data Sheet S18753EJ1V0DS
11
μPD166104
RECOMMENDED SOLDERING CONDITIONS
The μPD166104 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
• μPD166104GS-E1-AZ: 20-pin plastic SOP (7.62 mm (300))
• μPD166104GS-E2-AZ: 20-pin plastic SOP (7.62 mm (300))
Soldering Method
Infrared reflow
Soldering Conditions
Symbol
Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less (220 °C IR60-107-3
or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
Note
: 7 days (10 to 72 hours pre-backing is required at 125C°
afterwards),
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked before
unpacking.
Partial heating method
Pin temperature: 350°C or below,
–
Heat time: 3 seconds or less (per each side of the device) ,
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a
relative humidity of 20 to 65% after dry-pack package is opened.
12
Data Sheet S18753EJ1V0DS
μPD166104
[MEMO]
Data Sheet S18753EJ1V0DS
13
μPD166104
[MEMO]
14
Data Sheet S18753EJ1V0DS
μPD166104
[MEMO]
Data Sheet S18753EJ1V0DS
15
μPD166104
• The information in this document is current as of June, 2007. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1