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Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET MOS INTEGRATED CIRCUIT μPD166104 DUAL N-CANNEL LOW SIDE INTELLIGENT POWER DEVICE The μPD166104 is a high voltage, dual output, and N-cannel low side intelligent power device with built-in overheat protection and overcurrent limitation circuits. It protects itself by shutting down or limiting current when it detects overheat or overcurrent. Output MOS shut down is restarted automatically by cooling of the chip temperature. FEATURES • • • • • High voltage dual output low side driver Built-in overcurrent limitation circuits and overheat protection circuits - Shuts down by overheat detection - Restarts automatically after cooling Built-in dynamic clamping circuit (100 V Min.) Low on-state resistance Small 20-pin SOP package ORDERING INFORMATION Part Number Lead plating Packing Package Remark μPD166104GS-E1-AZ μPD166104GS-E2-AZ Sn-Bi Tape 2500 p/reel 20-pin plastic SOP (7.62 mm (300)) Lead-free product Sn-Bi Tape 2500 p/reel 20-pin plastic SOP (7.62 mm (300)) Lead-free product QUALITY GRADE Part Number Quality Grade μPD166104GS-E1-AZ μPD166104GS-E2-AZ Special Special Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. APPLICATION • Injector driver The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. S18753EJ1V0DS00 (1st edition) Date Published June 2007 NS Printed in Japan 2007 μPD166104 BLOCK DIAGRAM VCC1 Dynamic Clamping Circuit OUT1 IN1 Input Circuit Current Limitation Overheat Protection Output MOS (N-ch) GND1 Ch 1 VCC2 OUT2 IN2 Ch 2 GND2 PIN CONFIGURATION • 20-pin plastic SOP (7.62 mm (300)) Top View 1 2 3 4 5 6 7 8 9 10 OUT1 IN1 N.C. VCC1 OUT1 OUT2 IN2 N.C. VCC2 OUT2 20 19 18 17 16 15 14 13 12 11 OUT1 GND1 GND1 GND1 OUT1 OUT2 GND2 GND2 GND2 OUT2 Pin Name Pin No. 2 Pin Name Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name 1 OUT1 6 OUT2 11 OUT2 16 OUT1 2 IN1 7 IN2 12 GND2 17 GND1 3 N.C. 8 N.C. 13 GND2 18 GND1 4 VCC1 9 VCC2 14 GND2 19 GND1 5 OUT1 10 OUT2 15 OUT2 20 OUT1 Data Sheet S18753EJ1V0DS μPD166104 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Input voltage VIN −1.5 to +7 V Power supply voltage VCC1 −0.5 to +18 V VCC2 1s 35 V Output voltage VOUT Except the clamping voltage at the flyback time 100 V Output current IO (DC) VIN = 5 V, DC SELF LIMITED A/ch 2.5 W 150 °C −55 to +150 °C Power dissipation PD Channel temperature Tch Storage temperature Tstg Ta = 25 °C, both channels are ON Note Note When mounted on 50 mm x 50 mm x 1.5 mm epoxy PCB FR4 substrate with 600 mm x 70 μm copper foil. 2 Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameters. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. The ratings and conditions indicated for DC characteristics and AC characteristics represent the quality assurance range during normal operation. Data Sheet S18753EJ1V0DS 3 μPD166104 ELECTRICAL SPECIFICATIONS (VCC = 5 to 18 V, Tch = –40 to 150 °C, unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit High level input voltage VIH Rin = 1 kΩ, VDS = 0.3 V, IO = 1.4 A Low level input voltage VIL Rin = 1 kΩ, VDS = 20 V, IO = 1 mA 1.5 V High level input current IIH VIN = 5.5 V, VDS = 0 V 300 μA Low level input current IIL VIN = 0 V, VDS = 20 V +10 μA Power supply current ICC1 VCC = 16 V, ON condition 10.0 mA/ch ICC2 VCC = 16 V, OFF condition 10.0 mA/ch RDS(on)1 Io = 1.4 A, Tch = 25 °C, VIN = VIH, VCC = 16 V 64 91 mΩ RDS(on)2 Io = 1.4 A, Tch = 150 °C, VIN = VIH, Vcc = 16 V 107 146 mΩ 35 μs 35 μs 30 μs 15 μs 350 μA 130 V Output ON state resistance Turn on time ton Rise time tr Turn off time toff 3.0 V –10 VIN = 0→5 V, Rin = 1 kΩ, RL = 8 Ω, VCC = 12 V, 3.5 Tch = 0 to 150 °C VIN = 5→0 V, Rin = 1 kΩ, RL = 8 Ω, VCC = 12 V, Tch = 0 to 150 °C Fall time tf Output leak current IDSS VIN = 0 V, VDS = 18 V Clamp voltage VOUT IO = 10 mA, Tch = 25 °C, VIN = 0 V Temperature characteristics of ΔVZ IO = 1.4 A, VIN = VIL, L = 1mH 100 130 mV/°C clamp voltage Overheat detection temperature THI 150 °C Current limitation ILIM 1.7 A Switching mesurement circuit Switching measurement waveform 12 V μPD166104 1 kΩ IN VIN 8Ω VCC 50% 50% IN Wave Form OUT ton toff GND tr OUT Wave Form 90% 10% 4 Data Sheet S18753EJ1V0DS tf 90% 10% μPD166104 • Input circuit (On/Off control) Output MOS turns on when the high-level input voltage (3.0 V or more) is applied to IN terminal. Output MOS turns off when the low-level input voltage (1.5 V or less) is applied to IN terminal. “H” 5V VIN “H” “L” “L” “L” OFF OFF OFF GND VOUT (Resistance load) “H” VOUT ON GND ON “L” OFF ON • Dynamic clamp circuit This circuit is for protection of output and other circuits from the overvoltage by back electromotive force when inductive load turns off. The clamp diode is connected between drain and gate of output. Output voltage is clamped by this circuit when the voltage of the OUT terminal exceeded the output clamping voltage. VIN 5V “H” “L” “L” GND Vz OFF OFF VOUT (Inductive load) VOUT ON GND • Current limitation circuit This circuit prevents destruction from the overcurrent when the short-circuit occurs. When the overcurrent flows to the OUT terminal such as short-circuit condition, the output current is limited. Power supply voltage to OUT terminal should be 18 V or less when the short-circuit occurs. • Overheat protection circuit This circuit prevents destruction from overheat. The channel temperature of the output is monitored and the output is shut down when overheat is detected. Output restarts automatically after the channel cooled down. “H” VIN “L” “L” 5V GND VCC VOUT THI Tch Data Sheet S18753EJ1V0DS 5 μPD166104 TYPICAL CHARACTERISTICS HIGH LEVEL INPUT VOLTAGE vs. SUPPLY VOLTAGE HIGH LEVEL INPUT VOLTAGE vs. AMBIENT TEMPERATURE 3.5 VIH - High Level Input Voltage - V VIH - High Level Input Voltage - V 3.5 3.0 2.5 2.0 1.5 3.0 2.5 2.0 1.5 1.0 1.0 –50 0 5 10 15 20 0 50 100 150 200 Ta - Ambient Temperature - °C VCC - Supply Voltage - LOW LEVEL INPUT VOLTAGE vs. SUPPLY VOLTAGE LOW LEVEL INPUT VOLTAGE vs. AMBIENT TEMPERATURE 3.5 VIL - Low Level Input Voltage - V VIL - Low Level Input Voltage - V 3.5 3.0 2.5 2.0 1.5 3.0 2.5 2.0 1.5 1.0 1.0 0 5 10 15 –50 20 HIGH LEVEL INPUT CURRENT vs. SUPPLY VOLTAGE 100 150 200 HIGH LEVEL INPUT CURRENT vs. AMBIENT TEMPERATURE 300 IIH - High Level Input Current - μA 300 IIH - High Level Input Current - μA 50 Ta - Ambient Temperature - °C VCC - Supply Voltage - 250 200 150 100 50 0 250 200 150 100 50 0 0 5 10 15 20 –50 VCC - Supply Voltage - 6 0 0 50 100 150 Ta - Ambient Temperature - °C Data Sheet S18753EJ1V0DS 200 μPD166104 OPERATING CURRENT vs. OUTPUT LEAKAGE CURRENT vs. AMBIENT TENPERATURE AMBIENT TEMPERATURE 120 4.0 IDSS - Output Leakage Current - μA ICC - Operating Current - mA 3.5 ICC1 3.0 2.5 ICC2 2.0 1.5 1.0 0.5 100 80 60 40 20 0.0 0 –50 0 50 100 150 200 –50 0 150 TURN ON TIME vs. TURN OFF TIME vs. AMBIENT TEMPERATURE 25 25 20 20 toff - Turn Off Time - μs ton - Turn On Time - μs 100 AMBIENT TEMPERATURE 15 10 5 200 15 10 5 0 0 –50 0 50 100 150 200 –50 0 50 100 150 200 Ta - Ambient Temperature - °C Ta - Ambient Temperature - °C RISE TIME vs. FALL TIME vs. AMBIENT TEMPERATURE AMBIENT TEMPERATURE 25 25 20 20 tf - Fall Time - μs tr - Rise Time - μs 50 Ta - Ambient Temperature - °C Ta - Ambient Temperature - °C 15 10 5 15 10 5 0 0 –50 0 50 100 150 200 –50 Ta - Ambient Temperature - °C 0 50 100 150 200 Ta - Ambient Temperature - °C Data Sheet S18753EJ1V0DS 7 μPD166104 ON STATE RESISTANCE vs. TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE AMBIENT TEMPERATURE 2.5 0.12 PT - Total Power Dissipation - W RDS(ON) - On State Resistance - Ω 0.14 0.10 0.08 0.06 0.04 0.02 2.0 2 units 1 unit 1.5 1.0 0.5 0.0 0.00 –50 0 50 100 150 0 200 50 100 150 200 Ta - Ambient Temperature - °C Ta - Ambient Temperature - °C TRANSIENT THERMAL RESISTANCE CHARACTERISTICS TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1000 Transient thermal resistance Rth (°C/W) Device on 50 mm × 50 mm × 1.5 mm epoxy PCB FR4 with 6 cm2 of 70 μm copper area 100 Rth(ch-a) = 62.5 °C/W Rth(ch-c) = 16.5 °C/W 10 1 0.1 0.001 0.01 0.1 1 Pulse width (s) 8 Data Sheet S18753EJ1V0DS 10 100 1000 μPD166104 APPLICATION EXAMPLE VBAT Injector VCC Rin IN1 OUT1 μPD166104 Injector Rin OUT2 IN2 GND Power GND Micro computer Injector VCC Rin IN1 OUT1 μPD166104 Injector Rin OUT2 IN2 Rin: ex. 470 Ω GND Power GND GND Caution This application circuit is example and not intended for use in actual mass production design. Data Sheet S18753EJ1V0DS 9 μPD166104 PACKAGE DRAWING 20-PIN PLASTIC SOP (7.62 mm (300)) 20 11 detail of lead end P 1 10 A H I G J S L B C D M M N K S E F NOTE ITEM Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. MILLIMETERS A 12.7±0.3 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.8 MAX. G 1.55±0.05 H 7.7±0.3 I 5.6±0.2 J 1.1 K 0.22 +0.08 −0.07 L M 0.6±0.2 0.12 N 0.10 P 3° +7° −3° P20GM-50-300B, C-7 10 Data Sheet S18753EJ1V0DS μPD166104 TAPING INFORMATION There are two types (E1, E2) of directions of the device in the career tape. E1: Pin 1 of the device faces toward the open end of the tape, away from the reel Pin 1 indication Tape drawout direction E2: Pin 1 of the device faces away from the open end of the tape, toward the reel Pin 1 indication MARKING INFORMATION This figure indicates the marking items and arrangement. However, details of the letterform, the size and the position aren't indicated. Country of assembly D166104GS Lead-free mark Pin 1 indication Lot number Data Sheet S18753EJ1V0DS 11 μPD166104 RECOMMENDED SOLDERING CONDITIONS The μPD166104 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) • μPD166104GS-E1-AZ: 20-pin plastic SOP (7.62 mm (300)) • μPD166104GS-E2-AZ: 20-pin plastic SOP (7.62 mm (300)) Soldering Method Infrared reflow Soldering Conditions Symbol Peak package’s surface temperature: 260 °C, Reflow time: 60 seconds or less (220 °C IR60-107-3 or higher), Maximum allowable number of reflow processes: 3, Exposure limit Note : 7 days (10 to 72 hours pre-backing is required at 125C° afterwards), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. <Caution> Non-heat-resistant trays, such as magazine and taping trays, cannot be baked before unpacking. Partial heating method Pin temperature: 350°C or below, – Heat time: 3 seconds or less (per each side of the device) , Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Note The Maximum number of days during which the product can be stored at a temperature of 5 to 25°C and a relative humidity of 20 to 65% after dry-pack package is opened. 12 Data Sheet S18753EJ1V0DS μPD166104 [MEMO] Data Sheet S18753EJ1V0DS 13 μPD166104 [MEMO] 14 Data Sheet S18753EJ1V0DS μPD166104 [MEMO] Data Sheet S18753EJ1V0DS 15 μPD166104 • The information in this document is current as of June, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1