To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. “Standard”: 8. 9. 10. 11. 12. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT μ PC494 SWITCHING REGULATOR CONTROL CIRCUIT <R> DESCRIPTION The μ PC494 is a PWM type switching regulator control circuit. Included in this device are a 5 V voltage reference, dual error amplifiers, a variable frequency sawtooth-wave generating oscillator, a comparator for dead-time control, a flip flop, dual alternating output switches, and a buffer to output source and sink currents. Error amplifiers have wide common mode input voltage capability, and circuits for voltage feedback and over current protection are easy to configure. The μ PC494 can be applied to all types of switching regulators, including chopper type regulators. <R> FEATURES • 250 mA output buffer to output sink and source currents • Switchable operation mode between a single-end mode and a push-pull mode • No double pulsing during transient condition • Adjustable dead-time (0 to 100%) • Internal 5 V output voltage reference circuit • Error amplifiers with phase-compensating function • Providing master-slave operation (synchronizing multiple ICs) • With malfunction prevention circuit for low level supply voltage • Package variations available for different applications The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G12649EJ5V0DS00 (5th edition) Date Published August 2008 NS Printed in Japan 1988, 2000, 2008 The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. μ PC494 <R> ORDERING INFORMATION Part Number Package Package Type μ PC494C 16-pin plastic DIP (7.62 mm (300)) • plastic magazine μ PC494GS 16-pin plastic SOP (7.62 mm (300)) • plastic magazine μ PC494GS-E1 16-pin plastic SOP (7.62 mm (300)) • embossed taping • Pin 1 on draw-out side • 2500 pcs/reel μ PC494GS-E2 16-pin plastic SOP (7.62 mm (300)) • embossed taping • Pin 1 at take-up side • 2500 pcs/reel μ PC494GT-A Note μ PC494GT-E1-A Note 16-pin plastic SOP (9.53 mm (375)) • plastic magazine 16-pin plastic SOP (9.53 mm (375)) • embossed taping • Pin 1 on draw-out side • 1500 pcs/reel μ PC494GT-E2-A Note 16-pin plastic SOP (9.53 mm (375)) • embossed taping • Pin 1 at take-up side • 1500 pcs/reel μ PC494GS-A Note μ PC494GS-E1-A Note 16-pin plastic SOP (7.62 mm (300)) • plastic magazine 16-pin plastic SOP (7.62 mm (300)) • embossed taping • Pin 1 on draw-out side • 2500 pcs/reel μ PC494GS-E2-A Note 16-pin plastic SOP (7.62 mm (300)) • embossed taping • Pin 1 at take-up side • 2500 pcs/reel Note Pb-free (This product does not contain Pb in the external electrode and other parts.) 2 Data Sheet G12649EJ5V0DS00 μ PC494 BLOCK DIAGRAM 13 Output Control VCC 12 Reference Low Voltage Regulator Stop Ref Out 14 GND 7 F T/ F RT 6 CT 5 Oscillator Non-Inv. Input Inv. Input Non-Inv. Input Inv. Input C1 E1 C2 E2 Dead-Time Comparator + Dead-Time Control 4 8 9 11 10 – + 1 2 16 15 + EA I – PWM Comparator – + EA II – Feed-Back 3 PIN CONFIGURATION (Top View) <R> • μ PC494C, 494GS, 494GT-A, 494GS-A Non-Inv. Input 1 16 Non-Inv. Input Inv. Input 2 15 Inv. Input Feed-Back Dead-Time Control 3 14 Ref Out 4 13 Output Control CT 5 12 VCC RT 6 11 C2 GND 7 10 E2 C1 8 9 E1 Data Sheet G12649EJ5V0DS00 3 μ PC494 <R> ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise noted) Characteristics μ PC494C Symbol μ PC494GS μ PC494GT-A μ PC494GS-A Unit Supply Voltage VCC −0.3 to +41 V Error Amplifier Input Voltage VICM −0.3 to VCC +0.3 V Dead-time Comparator Input VDTC −0.3 to +5.25 V Output Voltage VCER −0.3 to +41 V Output Current IC Voltage Total Power Dissipation 250 PT 650 1000 Note mA 780 Note 650 Note mW Operating Ambient Temperature TA −20 to +85 °C Storage Temperature −65 to +150 °C Tstg Note With 5 cm x 5 cm x 1.6 mmt glass-epoxy substrate. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. RECOMMENDED OPERATING CONDITIONS Characteristics Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 7 40 V Output Voltage VCER −0.3 +40 V IC 200 mA Error Amplifier Sink Current IOAMP −0.3 mA Timing Capacitor CT 0.47 10000 nF Timing Resistance RT 1.8 500 kΩ Oscillation Frequency fOSC 1 300 kHz Operating Ambient Temperature TA −20 +70 °C <R> Output Current (per output stage) Caution The recommended operating range may be exceeded without causing any problems provided that the absolute maximum ratings are not exceeded. However, if the device is operated in a way that exceeds the recommended operating conditions, the margin between the actual conditions of use and the absolute maximum ratings is small, and therefore thorough evaluation is necessary. The recommended operating conditions do not imply that the device can be used with all values at their maximum values. 4 Data Sheet G12649EJ5V0DS00 μ PC494 ELECTRICAL SPECIFICATIONS (VCC = 15 V, f = 10 kHz, −20°C ≤ TA ≤ +70°C, unless otherwise noted) (1/2) Block Characteristics Symbol Conditions Reference Output Voltage VREF IREF = 1 mA, TA = 25°C Section Line Regulation REGIN 7 V ≤ VCC ≤ 40 V, Load Regulation REGL 1 mA ≤ IREF ≤ 10 mA, MIN. 4.75 TYP. Note1 MAX. Unit 5 5.25 V 8 25 mV 1 15 mV 0.01 0.03 %/°C IREF = 1 mA, TA = 25°C TA = 25°C ΔVREF /ΔT −20°C ≤ TA ≤ +85°C, Temperature Coefficient Short Circuit Output Current Oscillator IREF = 1 mA Note2 Frequency Section Standard Deviation of Frequency ISHORT VREF = 0 V 50 mA fOSC CT = 0.01 μF, 10 kHz 10 % 1 % RT = 12 kΩ Note3 7 V ≤ VCC ≤ 40 V, TA = 25°C, under recommended operating conditions of CT and RT constants. 7 V ≤ VCC ≤ 40 V, Frequency Change with Voltage TA = 25°C, CT = 0.01 μF, RT = 12 kΩ 0°C ≤ TA ≤ 70°C, Frequency Change with Temperature 1 2 % −2 −10 μA CT = 0.01 μF, RT = 12 kΩ 0 V ≤ VDTC ≤ 5.25 V Dead- Time Input Bias Current Control Maximum Duty Cycle (Each Output) Section Input Threshold Voltage 1 VTH1 Output pulse 0% duty cycle Input Threshold Voltage 2 VTH2 Output pulse maximum duty VDTC = 0 V 45 49 3 % 3.3 V 0 V cycle Error Input Offset Voltage Amplifier 1, 2 Input Offset Current Section Input Bias Current Common Mode Input Voltage Low level VIO VOAMP = 2.5 V 2 10 IIO VOAMP = 2.5 V 25 250 nA VOAMP = 2.5 V 0.2 1 μA VICM 7 V ≤ VCC ≤ 40 V −0.3 V VCC − 2 High level Open Loop Voltage Gain mV AV VOAMP = 0.5 to 3.5 V, 60 80 dB kHz TA = 25°C Unity Gain Bandwidth TA = 25°C 500 830 VCC = 40 V, TA = 25°C 65 80 dB Output Sink Current VOAMP = 0.7 V 0.3 0.7 mA Output Source Current VOAMP = 3.5 V −2 −10 mA Input Threshold Voltage (Pin 3) Output pulse 0% duty cycle, Common Mode Rejection Ratio PWM CMR Section 4 4.5 V see Figure 1. V(Pin 3) = 0.7 V Input Sink Current 0.3 0.7 mA Notes 1. The TYP. values are values at TA = 25°C, except for the characteristics of temperature. 2. The short circuit output current flow must be terminated within 1 second. Repeated operations are allowed while internal heat accumulation is within a safe range. 3. Standard deviation is a measure of the statistical distribution about the mean as derived from the formula; σ= N ∑ (Xn − X)2 n=1 N−1 Calculation expression of frequency fOSC is as follows ; fOSC ≅ 1 (Hz) 0.817 RT • CT + 1.42 • 10−6 [RT] = Ω, [CT] = F Data Sheet G12649EJ5V0DS00 5 μ PC494 (2/2) Block Output Characteristics Symbol Collector Cut-off Current ICER Section Conditions MIN. TYP. Note VCE = 40 V, VCC = 40 V, MAX. Unit 100 μA −100 μA Common Emitter Emitter Cut-off Current VCC = VC = 40 V, VE = 0 V, Emitter Follower Collector Saturation Common Voltage Emitter Emitter VCE(sat) IC = 200 mA, VE = 0 V 0.95 1.3 V VCE(ON) IE = −200 mA, VC = 15 V 1.6 2.5 V tr1 VCC = 15 V, RL = 150 Ω, 100 200 ns 70 200 ns 100 200 ns 70 200 ns 8 12.5 mA Follower Output Voltage Rise Time Common Emitter Output Voltage Fall Time tf1 Output Voltage Rise Time Emitter tr2 see Figure 1. VC = 15 V, RL = 150 Ω, IE ≅ 100 mA, TA = 25°C, Follower Total IC ≅ 100 mA, TA = 25°C, Output Voltage Fall Time tf2 Standby Current ICC(S.B) Device see Figure 1. VCC = 15 V, all other pins open. Bias Current ICC(BI) V(Pin 4) = 2 V, see Figure 1. Note The TYP. values are values at TA = 25°C, except for the characteristics of temperature. 6 Data Sheet G12649EJ5V0DS00 10 mA μ PC494 TEST CIRCUIT AND WAVEFORM CHARACTERISTICS Figure1. Test Circuit VCC = 15 V RL (12) 150 Ω V CC (4) Dead-Time (8) 2 W C1 (9) Test Input (3) Control E1 Feed-Back (11) (6) 12 kΩ C2 (10) R T 0.01 μFNote (5) E2 CT (1) Non-Inv. Input (2) Inv. Input (16) (15) Non-Inv. Input Inv. Input (13) (14) Output Control Ref Out GND 50 kΩ (7) RL 150 Ω 2W Output 1 Output 2 Note Recommend film capacitor. Caution When the emitter follower is output, connect C1 and C2 to VCC and E1 and E2 to GND via RL. Figure2. Voltage Waveform VCC C1 Output Voltage 0V VCC C2 Output Voltage 0V CT Voltage sawtooth-wave oscillation output Dead-Time Control Input Voltage Threshold Voltage 0% MAX. Threshold Voltage 0% Feed-Back Input (E.A. Output) 0.7 V Connection of Output Control Pin (Pin 13) Output Control Input (Pin 13) Operation Mode Ref Out push-pull GND Single-ended operation (common-mode output of C1, C2) Data Sheet G12649EJ5V0DS00 7 μ PC494 TYPICAL PERFORMANCE CHARACTERISTICS (Unless otherwise specified, TA = 25°C, VCC = 15 V, Reference) <R> MISS-OPERATION PREVENTION CIRCUIT CHARACTERISTICS MAXIMUM POWER DISSIPATION 1.0 μPC494C 0.8 0.6 0.4 0.2 6 Note With 5 cm x 5 cm x 1.6 mmt glass-epoxy substrate VCE - Output Voltage - V PT - Total Power Dissipation - W 1.2 Thermal Resistance Rth(J-A)125°C/W 16 0 192 °C/W °C/ W μPC494GS, Note 494GS-A μPC494GT-A 0 Note 25 50 75 100 5 2 1 5 4 3 2 1 0 5 10 15 20 25 30 35 VCC - Supply Voltage - V 40 VCC = 15 V fOSC - Frequency - kHz 200 100 50 CT = 47 00 0 p pF F 10 20 10 5 0. 04 2 1 01 0. 2 7 μF μF 5 10 20 50 100 200 500 RT - Timing Resistance - kΩ 8 Δ f/fOSC - Frequency Change - % FREQUENCY vs. RT AND CT 500 4 5 6 7 VCC - Supply Voltage - V Δ VREF - Reference Voltage Change - mV VREF - Reference Voltage - V 6 VCE 3 TA - Operating Ambient Temperature - °C REFERENCE VOLTAGE vs. SUPPLY VOLTAGE 430 Ω 8 9 4 0 125 Test Circuit 5V REFERENCE VOLTAGE vs. OPERATING AMBIENT TEMPERATURE 40 VCC = 15 V IREF = 1 mA 20 0 –20 –40 –60 –25 0 25 50 75 100 TA - Operating Ambient Temperature - °C FREQUENCY vs. OPERATING AMBIENT TEMPERATURE 4 VCC = 15 V RT = 12 kΩ 2 CT = 0.01 μF 0 –2 –4 –6 –25 0 25 50 75 100 TA - Operating Ambient Temperature - °C Data Sheet G12649EJ5V0DS00 μ PC494 OPEN-LOOP VOLTAGE GAIN vs. FREQUENCY 20 30 VCC = 15 V RT = 12 kΩ CT = 0.01 μF 40 0 1 2 120 100 80 60 40 20 0 3 1 10 100 1 k 10 k 100 k 1 M 10 M VDTC - Dead-Time Control Input Voltage - V f - Frequency - Hz COLLECTOR SATURATION VOLTAGE vs. OUTPUT CURRENT STANDBY AND BIAS CURRENT vs. SUPPLY VOLTAGE 2.0 12 ICC (S.B) - Standby Current - mA ICC (BI) - Bias Current - mA VCE (sat) - Collector Saturation Voltage (Common Emitter) - V VCE (ON) - Collector Saturation Voltage (Emitter Follower) - V 50 AV - Open-Loop Voltage Gain - dB –2 0° C = 10 TA Duty Cycle - % 0 25 °C 85 °C DUTY CYCLE vs. DEAD-TIME CONTROL INPUT VOLTAGE 1.8 1.6 VCE (ON) 1.4 1.2 1.0 VCE (sat) 0.8 0.6 0.4 0 40 80 120 160 IC, IE - Output Current - mA 200 Data Sheet G12649EJ5V0DS00 ICC (BI) 10 ICC (S.B) 8 6 4 2 0 ICC (S.B) VCC Terminal Biased. Other Terminal Open. ICC (BI) VDTC = 2 V (Pin 4) 10 20 30 VCC - Supply Voltage - V 40 9 μ PC494 BASIC APPLICATION CIRCUIT VOUT rsense Switching regulator output pin GND JP2 VCC VR3 100 Ω R14 –Iosense R13 7.5 kΩ 5 kΩ C1 JP1 C6 47 μF + R15 +Iosense 0.01 μF 100 Ω C2 16 15 + 14 13 12 11 10 R9 110 Ω REFERENCE REGULATOR R16 100 kΩ C7 F/F + VR1 ERROR AMP 1 OSCILLATOR – 0.1 V 2 kΩ R2 R4 5.1 kΩ 1 5.1 kΩ 2 240 kΩ R5 3 4 2 kΩ VR2 5 6 7 C5 R8 24 kΩ C4 C3 R6 R7 7.5 kΩ + 0.01 μF 24 kΩ 10 μF +5 V (VREF) Remark fOSC ≅ 40 kHz, C5 = 1000 pF (Recommend film capacitor) 10 C1 9 – ERROR AMP 2 R17 R3 5.1 kΩ R11 110 Ω 110 Ω C2 E2 E1 Vosense 3.9 kΩ R1 R12 Data Sheet G12649EJ5V0DS00 8 R10 110 Ω 12 V μ PC494 CONNECTION DIAGRAM Output Control Input Operation Mode Output Mode Output Voltage Waveform (Pin 13) Push-pull Ref Out (Pin 14) Sink (R9, R10 short) C1 C2 (JP1 Wired) Source (R11, R12 short) E1 E2 Single-ended operation GND (Pin 7) Sink (R9, R10 short) C1, C2 (JP2 Wired) Source (R11, R12 short) E1, E2 Data Sheet G12649EJ5V0DS00 11 μ PC494 TYPICAL EXAMPLE OF APPLICATION CIRCUITS 1) Forward Type +VCC + + +12 V – VOUT (12) VCC (8) C1 (13) Output Control E1 (14) Ref Out GND To EA I To EA II (Over Current (Vosense) Protection ) (9) (7) GND 2) Push-pull Type (Isolated) +VCC + + – GND VOUT +12 V To EA II (12) (11) C2 VCC (10) E2 (9) E1 (8) C1 Output (7) (13) GND Control (14) Ref Out To EA I (Non Isolated) +VCC (40 V MAX.) (12) (11) VCC C2 + (10) + E2 (13) Output (9) E1 Control (14) (8) Ref Out C1 GND (7) – To EA II GND 12 Data Sheet G12649EJ5V0DS00 To EA I VOUT μ PC494 3) Step-down Chopper + +VCC (40 V MAX.) (12) (11) VCC C2 + VOUT (10) E2 – (9) E1 Output (8) (13) Control C1 GND (7) To EA I To EA II (Over Current Protection) Remark The dotted line indicates the connection in case of large current. EXAMPLE OF MASTER-SLAVE CONNECTION To synchronize μ PC494 ICs, connect the pin 6 (RT) of a slave IC to pin 14 (Ref Out) of the same IC, and connect both CT pins of master and slave ICs after confirming oscillator of slave IC is stopped. +VCC (12) VCC Ref Out (M) RT (7) (12) GND CT VCC Ref Out (S) RT (7) GND CT (14) (6) (5) RT CT (14) (6) (5) (M) : Master (S) : Slave Data Sheet G12649EJ5V0DS00 13 μ PC494 PACKAGE DRAWINGS (Unit : mm) μ PC494C 16-PIN PLASTIC DIP (7.62mm(300)) 16 9 1 8 A J K P I F C B H D G N L R M M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. Item "K" to center of leads when formed parallel. ITEM MILLIMETERS A 20.32 MAX. B 1.27 MAX. C 2.54 (T.P.) D 0.50±0.10 F 1.1 MIN. G 3.5±0.3 H 0.51 MIN. I 4.31 MAX. J 5.08 MAX. K L 7.62 (T.P.) 6.5 M 0.25 +0.10 −0.05 N 0.25 P 1.1 MIN. R 0∼15° P16C-100-300B-2 14 Data Sheet G12649EJ5V0DS00 μ PC494 <R> μ PC494GT-A 16-PIN PLASTIC SOP (9.53 mm (375)) 16 9 detail of lead end P 1 8 A H F I G J S C D M B L N S K M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 10.2±0.26 B 0.805 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.125±0.075 F 2.9 MAX. G 2.50±0.2 H 10.3±0.3 I 7.2±0.2 J 1.6±0.2 K 0.17 +0.08 −0.07 L 0.8±0.2 M 0.12 N 0.10 P 3° +7° −3° P16GT-50-375B-2 Data Sheet G12649EJ5V0DS00 15 μ PC494 μ PC494GS, 494GS-A 16-PIN PLASTIC SOP (7.62 mm (300)) 16 9 detail of lead end P 1 8 A H F I G J S B N S L K C D M M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 10.2±0.2 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.65±0.15 G 1.55 H 7.7±0.3 I 5.6±0.2 J 1.1±0.2 K 0.22 +0.08 −0.07 L 0.6±0.2 M 0.12 N 0.10 P 3° +7° −3° P16GM-50-300B-6 16 Data Sheet G12649EJ5V0DS00 μ PC494 <R> RECOMMENDED SOLDERING CONDITIONS The μ PC494 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Through-hole Device μ PC494C: 16-pin plastic DIP (7.62 mm (300)) Process Wave Soldering Conditions Solder temperature: 260°C or below, Flow time: 10 seconds or less Symbol WS60-00 (only to leads) Partial Heating Method Pin temperature: 300°C or below, P300 Heat time: 3 seconds or less (Per each side of the device) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Type of Surface Mount Device μ PC494GS: 16-pin plastic SOP (7.62 mm (300)) Process Infrared Ray Reflow Conditions Maximum temperature (package’s surface temperature): 235°C or below, Symbol IR35-00-3 Time at maximum temperature: 10 seconds or less, Time at temperature higher than 210°C: 30 seconds or less, Preheating time at 100 to 160°C: 30 to 60 seconds, Times: 3 times, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Vapor Phase Soldering Maximum temperature (package’s surface temperature): 215°C or below, VP15-00-3 Reflow time: 25 to 40 seconds or less (at 200°C or higher), Preheating time at 120 to 150°C: 30 to 60 seconds, Times: 3 times, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Preheating temperature: 120°C MAX. (Package surface temperature). Partial Heating Method Pin temperature: 350°C or below, P350 Heat time: 3 seconds or less (Per each side of the device), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Data Sheet G12649EJ5V0DS00 17 μ PC494 μ PC494GT-A Note1 : 16-pin plastic SOP (9.53 mm (375)) Process Conditions Infrared Ray Reflow Maximum temperature (package’s surface temperature): 260°C or below, Symbol IR60-207-3 Time at maximum temperature: 10 seconds or less, Time at temperature higher than 220°C: 60 seconds or less, Preheating time at 160 to 180°C: 60 to 120 seconds, Times: 3 times, Exposure limit: 7 days Note2 (after that, prebake at 125°C for 20 hours), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-207-1 Maximum number of flow processes: 1 time, Preheating temperature: 120°C MAX. (Package surface temperature), Exposure limit: 7 days Partial Heating Method Note2 (after that, prebake at 125°C for 20 hours). Pin temperature: 350°C or below, P350 Heat time: 3 seconds or less (Per each side of the device), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Notes 1. Pb-free (This product does not contain Pb in the external electrode and other parts.) 2. After opening the dry pack, store it a 25°C or less and 65% RH or less for the allowable storage period. μ PC494GS-A Note : 16-pin plastic SOP (7.62 mm (300)) Process Infrared Ray Reflow Conditions Maximum temperature (package’s surface temperature): 260°C or below, Symbol IR60-00-3 Time at maximum temperature: 10 seconds or less, Time at temperature higher than 220°C: 60 seconds or less, Preheating time at 160 to 180°C: 60 to 120 seconds, Times: 3 times, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Preheating temperature: 120°C MAX. (Package surface temperature). Partial Heating Method Pin temperature: 350°C or below, P350 Heat time: 3 seconds or less (Per each side of the device), Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Note Pb-free (This product does not contain Pb in the external electrode and other parts.) Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. 18 Data Sheet G12649EJ5V0DS00 μ PC494 • The information in this document is current as of August, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1