To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC319 HIGH SPEED DUAL COMPARATOR DESCRIPTION The µPC319 is a precision high speed dual comparator designed to operate over a wide range of supply voltage down to a 5 V logic supply and ground. Further advantage, they have excellent input characteristics and direct drive capability to all the popular logic families. FEATURES • Operate from single 5 V supply • Typically 80 ns response time at ±15 V • Open collector output • Minimum fan-out of 2 each side (TTL) • High common mode slew rate ORDERING INFORMATION Part Number Package µPC319C 14-pin plastic DIP (7.62 mm (300)) µPC319G2 14-pin plastic SOP (5.72 mm (225)) EQUIVALENT CIRCUIT (1/2 Circuit) PIN CONFIGURATION (Top View) R1 R2 V+ R3 Q9 Q4 II Q3 − + Q7 R4 Q1 C1 R10 R5 IN Q5 Q 19 Q 18 Q8 Q6 Q2 R8 R20 channel 14 NC NC 2 13 NC GND1 3 IN1 4 Q 10 Q13 Q 11 Q 21 R25 R 24 another NC 1 12 OUT1 Q 15 R 18 R19 Q20 R 12 R 11 R9 R 22 R 23 µ PC319C, 319G2 R7 R6 R 15 R 13 Q 14 OUT Q 12 Q 16 V- 6 R16 R 14 Q 22 R 21 Q 17 II1 5 11 V+ + − 1 2 − OUT2 7 R 17 10 II 2 + 9 IN2 8 GND2 GND V− The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G15950EJ5V0DS00 (5th edition) Date Published March 2004 N CP(K) Printed in Japan The mark shows major revised points. 1987 µPC319 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter + Voltage between V and V – Note 1 Ratings Unit – –0.3 to +36 V ±5 V V –V Differential Input Voltage Input Voltage Symbol + VID Note 2 V –0.3 to V +0.3 V –0.3 to +36 V – –0.3 to +25 V V – VGND –0.3 to +18 V 570 mW 550 mW 10 sec VI Note 3 Output to Negative Supply Voltage Ground to Negative Supply Voltage Ground to Positive Supply Voltage Note 3 C Package Power Dissipation Note 3 Note 4 G2 Package + – – VO – V VGND – V + PT Note 5 Note 6 Output Short Circuit Duration Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output and GND terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is –7.6 mW/°C when operating ambient temperature is higher than 50°C. 5. Thermal derating factor is –5.5 mW/°C when operating ambient temperature is higher than 25°C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Supply Voltage (split) V – Supply Voltage (V = GND) ± + V MIN. TYP. MAX. Unit ±5 ±16 V +5 +32 V TYPICAL CONNECTIONS SPLIT SUPPLIES SINGLE SUPPLY + + + V (V ≤ 18 V) V (V+ < 18 V) VRL (VRL ≤ 36 V) VRL IN + II − IN + II − VO VO GND V− − GND − V (V ≥ −25 V) + − − (V − V ≥ 36 V, VRL − V − ≤ 36 V) 2 Data Sheet G15950EJ5V0DS µPC319 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit VIO V − V = 5 to 30 V, RS ≤ 5 kΩ ±2.0 ±8.0 mV IIO V − V = 5 to 30 V ±80 ±200 nA Input Bias Current IB V − V = 5 to 30 V 400 1,000 nA Voltage Gain AV Input Offset Voltage Input Offset Current + + + – – – 8,000 Response Time Input 100 mV, Overdrive 5 mV 40,000 80 ns Output Saturation Voltage VOL VI ≤ −10 mV, IO = 25 mA 0.75 1.5 Output Leakage Current IOLEAK VI ≥ 10 mV, VO = 35 V 0.2 10 Positive Supply Current I + Positive Supply Current I + IO = 0 A, Both Comparators 8.0 12.5 mA Negative Supply Current I – IO = 0 A, Both Comparators 3.0 5.0 mA Input Offset Voltage VIO ±10 mV Input Offset Current IIO V − V = 5 to 30 V, TA = 0 to 70°C ±300 nA Input Bias Current IB V − V = 5 to 30 V, TA = 0 to 70°C 1,200 nA Common Mode Input Voltage VICM + – V = 5 V, V = 0 V, IO = 0 A, 4.3 V µA mA Both Comparators V − V = 5 to 30 V, RS ≤ 5 kΩ, + – TA = 0 to 70°C + + – – ±13 V Range Output Saturation Voltage V = 4.5 V, V = 0 V, VI ≤ −10 mV, + VOL – 0.23 0.4 V IO ≤ 3.2 mA TYPICAL APPLICATION CIRCUIT COMPARATOR with HYSTERESIS CIRCUIT V+ VRL RL − INPUT OUTPUT GND + Threshold Voltage R2 R1 V VREF . VTH (High) =. VREF + − . VTH (Low) =. VREF – R1 (VRL – VREF) RL + R2 + R1 R1 (VREF – VOL) R1 + R2 (VRL > VREF > VOL) Data Sheet G15950EJ5V0DS 3 µPC319 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) INPUT BIAS CURRENT INPUT OFFSET CURRENT POWER DISSIPATION 500 600 IB - Input Bias Current - nA IIO - Input Offset Current - nA PT - Total Power Dissipation - mW V ± = ±15 V 800 µ PC319C µPC319G2 18 2˚ 13 2˚ C/ 400 W C/ W 200 400 IB 300 200 100 IIO 0 20 40 60 80 100 0 −20 TA - Operating Ambient Temperature - ˚C 0 20 40 60 80 TA - Operating Ambient Temperature - ˚C COMMON MODE INPUT VOLTAGE RANGE INPUT CURRENT IB - Input Bias Current - nA 800 IB − VICM - Common Mode Input Voltage Range 1000 IB+ 600 400 200 0 −200 −400 −6 −4 −2 0 2 4 6 V+ V + −1 + V −2 V −+1.0 − V +0.5 V VDIF - Differential Input Votage - V 20 VO - Output Voltage - V V ± = ±15 V RL = 1.4 kΩ 15 VRL = 15 V 10 5 VRL = 5 V −0.6 −0.2 0.0 +0.2 +0.6 +1.0 VDIF - Differential Input Votage - V 4 − −20 0 20 40 60 TA - Operating Ambient Temperature - ˚C TRANSFER FUNCTION 0 −1.0 V ± = ±15 V Data Sheet G15950EJ5V0DS 80 µPC319 VO - Output Voltage - V 6 RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES + V =5V VRL = +5 V RL = 500 Ω 5 4 3 20 mV 2 mV 2 1 5 mV VI - Input Voltage - mV VI - Input Voltage - mV VO - Output Voltage - V RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES 0 20 Overdrive = 20 mV 10 0 5 mV 2 mV −10 6 5 4 20 mV 2 5 mV 0 100 10 Overdrive = 2 mV 0 −10 5 mV 20 mV 0 100 200 0 300 100 VO - Output Voltage - V 6 V ± = ±15 V VRL = +5 V RL = 500 Ω 5 4 2 mV 2 20 mV 5 mV 0 20 Overdrive = 20 mV 10 300 RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES VI - Input Voltage - mV VO - Output Voltage - V RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES 3 200 t - Time - ns t - Time - ns VI - Input Voltage - mV V ± = ±5 V VRL = +5 V RL = 500 Ω 1 −20 −100 1 2 mV 3 0 5 mV 2 mV −10 −100 6 5 4 20 mV 5 mV 3 2 1 V ± = ±15 V VRL = +5 V RL = 500 Ω 2 mV 0 100 10 Overdrive = 2 mV 0 −10 5 mV −20 20 mV 100 200 t - Time - ns 300 0 OUTPUT SATURATION VOLTAGE 300 OUTPUT LIMITING CHARACTERISTICS 25 120 IOshort - Short Circuit Current - mA IOSINK - Output Current - mA 100 200 t - Time - ns 20 15 10 5 V± = ±15 V Overdrive = 5 mV 100 1.2 Short Circuit Current 1.0 80 0.8 60 0.6 40 0.4 Power Consumption 20 0.2 Pd - Power Consumption - W 0 0 0 0.2 0.4 0.6 0.8 1.0 0 5.0 10 15 VOL - Output Voltage - V VOL - Output Voltage - V Data Sheet G15950EJ5V0DS 5 µPC319 SUPPLY CURRENT SUPPLY CURRENT 10 10 8.0 8 + I - Supply Current - mA + I 6.0 4.0 − 6 4 I − ± I ± I - Supply Current - mA I 2 2.0 V ± = ±15 V 0 ±5 ±10 ±15 0 −20 ±20 ± 0 20 V - Supply Voltage - V SUPPLY VOLTAGE RANGE V RL − VO + − V 30 80 V ± RANGE 20 10 0 − −10 −20 V - Negative Supply Voltage - V 6 60 VRL RANGE 40 VRL V+ - Positive Supply Voltage - V VRL - Load Supply Voltage - V + 40 TA - Operating Ambient Temperature - ˚C Data Sheet G15950EJ5V0DS −30 µPC319 PACKAGE DRAWINGS (Unit : mm) 14-PIN PLASTIC DIP (7.62 mm (300)) 14 8 1 7 A K J L I C H G B M R F D N M NOTES ITEM 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. A MILLIMETERS 19.22±0.2 B 2.14 MAX. C 2.54 (T.P.) D F G 0.50±0.10 1.32±0.12 H 0.51 MIN. 3.6±0.3 I 3.55 J K 4.3±0.2 7.62 (T.P.) L 6.4±0.2 M 0.25 +0.10 −0.05 N R 0.25 0~15° P14C-100-300B1-3 Data Sheet G15950EJ5V0DS 7 µPC319 14-PIN PLASTIC SOP (5.72 mm (225)) 14 8 detail of lead end P 1 7 A H F J I G S C D B L N S K M M E NOTE Each lead centerline is located within 0.1 mm of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS 10.2±0.26 B 1.42 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.59+0.21 −0.2 G 1.49 H 6.5±0.2 I 4.4±0.1 J 1.1±0.16 K 0.17 +0.08 −0.07 L 0.6±0.2 M 0.1 N 0.10 P 3° +7° −3° S14GM-50-225B, C-6 8 Data Sheet G15950EJ5V0DS µPC319 RECOMMENDED SOLDERING CONDITIONS The µPC319 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC319G2: 14-pin plastic SOP (5.72 mm (225)) Process Infrared Ray Reflow Conditions Symbol Peak temperature: 230°C or below (Package surface temperature), IR30-00-1 Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, – Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC319C: 14-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering Solder temperature: 260°C or below, (only to leads) Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Data Sheet G15950EJ5V0DS 9 µPC319 • The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1