Datasheet

SMT POWER INDUCTORS
Shielded Drum Core - P1170NL/P1171NL Series
Height: 6.0mm Max
Footprint: 12.2mm x 12.2mm Max
Current Rating: up to 13A
Inductance Range: .32µH to 750µH
Electrical Specifications @ 25°C — Operating Temperature -40°C to +130°C
Inductance
Inductance
Saturation
DCR (m Ω )
Irated 5
@0A DC
@Irated
Current
(A DC )
(μH)
(μH) MIN
TYP
MAX
-25% (A)
P1170.901NL
P1171.901NL
0.9*
0.6
13
2.0
2.9
14
P1170.142NL
P1171.142NL
1.4*
0.9
11
3.0
4.2
13
P1170.222NL
P1171.222NL
2.2*
1.5
9.6
4.0
5.7
9.7
P1170.302NL
P1171.302NL
3.0*
2.0
8.3
5.4
7.7
8.3
P1170.392NL
P1171.392NL
3.9*
2.5
7.0
7.4
10
7.0
P1170.502NL
P1171.502NL
5.0*
3.3
6.4
8.5
12
6.4
P1170.642NL
P1171.642NL
6.4*
4.2
5.3
13
18
5.8
P1170.103NL
P1171.103NL
10
7.5
4.4
19
25
4.6
P1170.123NL
P1171.123NL
12
9.0
4.2
21
27
4.3
P1170.153NL
P1171.153NL
15
11.3
4.0
22
30
4.0
P1170.183NL
P1171.183NL
18
13.5
3.4
32
40
3.4
P1170.223NL
P1171.223NL
22
16.5
3.0
36
45
3.0
P1170.273NL
P1171.273NL
27
20.3
2.7
41
51
2.7
P1170.333NL
P1171.333NL
33
24.8
2.6
56
70
2.6
P1170.393NL
P1171.393NL
39
29.3
2.4
60
75
2.4
P1170.473NL
P1171.473NL
47
35.3
2.2
79
100
2.2
P1170.563NL
P1171.563NL
56
42
2.0
85
110
2.0
P1170.683NL
P1171.683NL
68
51
1.8
97
120
1.8
P1170.823NL
P1171.823NL
82
61.5
1.7
127
158
1.7
P1170.104NL
P1171.104NL
100
75
1.4
182
230
1.4
P1170.124NL
P1171.124NL
120
90
1.3
201
253
1.3
P1170.154NL
P1171.154NL
150
113
1.2
225
280
1.2
P1170.184NL
P1171.184NL
180
135
1.1
249
310
1.1
P1170.224NL
P1171.224NL
220
165
1.0
319
400
1.0
P1170.274NL
P1171.274NL
270
203
0.91
363
460
0.91
P1170.334NL
P1171.334NL
330
248
0.82
539
620
0.82
P1170.394NL
P1171.394NL
390
293
0.72
561
690
0.72
P1170.474NL
P1171.474NL
470
353
0.68
629
770
0.68
P1170.564NL
P1171.564NL
560
420
0.63
851
1060
0.63
P1170.684NL
P1171.684NL
680
510
0.57
950
1200
0.57
P1170.824NL
P1171.824NL
820
615
0.52
1241
1550
0.52
P1170.105NL
P1171.105NL
1000
750
0.46
1398
1750
0.46
*Inductance at 0A DC tolerance on indicated part numbers is ±30%; tolerance is ±20% on all other parts.
2,3
6
Heating 7
Core Loss 8
SRF
Current
Factor
(MHz)
+40°C(A)
(K2)
13
140
>40
11
170
>40
9.6
210
>40
8.3
250
38
7.1
280
34
6.6
310
30
5.3
360
26
4.4
430
24
4.2
470
18
4.1
550
16
3.4
580
14
3.2
670
14
3.0
740
12
2.6
820
11
2.5
880
10
2.2
980
9.0
2.1
1000
8.0
1.9
1100
6.9
1.7
1300
6.3
1.4
1400
5.5
1.4
1500
5.0
1.3
1700
4.6
1.2
1900
3.8
1.1
2100
3.5
1.0
2300
3.2
0.82
2600
3.0
0.81
2800
2.7
0.77
3100
2.6
0.66
3300
2.3
0.62
3700
2.0
0.54
4000
2.0
0.51
4500
1.5
NOTES FROM TABLE: (See page 43)
Part
Numbers
Mechanical
P1170/P1171
P1170
.315
8,00
.315
8,00
.039
1,00
.482
12,24 2
MAX
XXX
1
1
.482
12,24
MAX
Schematic:
.236
6,00
MAX
.075
1,91
2
.197
5,00
1
SUGGESTED PAD LAYOUT
.262
6,65
.134
3,40
.079
2,00
.118
3,00
2
.075
1,91
.472
12,00
SUGGESTED PAD LAYOUT
.630
16,00
Weight . . . . . . . . 3.2 grams
Tape & Reel . . . . . . 500/reel
Dimensions: Inches
mm
Unless otherwise specified, all tolerances are ± .010
0,25
1
.492
12,50
.315
8,00
.039
1,00
.472
12,00
.366
9,30
P1171
.315
8,00
.945
24,00
2
TAPE & REEL LAYOUT
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38
SPM2007 (11/07)
SMT POWER INDUCTORS
Shielded Drum Core Series
Notes from Tables (pages 27 - 42)
1. Unless otherwise specified, all testing is made at
100kHz, 0.1VAC.
8. In high volt*time (Et) or ripple current applications, additional heating in the component can occur due to core
losses in the inductor which may necessitate derating
the current in order to limit the temperature rise of the
component. In order to determine the approximate total
loss (or temperature rise) for a given application, both
copper losses and core losses should be taken into
account.
2. Optional Tape & Reel packaging can be ordered by
adding a "T" suffix to the part number (i.e. P1166.102NL
becomes P1166.102NLT). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
3. The "NL" suffix indicates an RoHS-compliant part
number. Non-NL suffixed parts are not necessarily
RoHS compliant, but are electrically and mechanically
equivalent to NL versions. If a part number does not
have the "NL" suffix, but an RoHS compliant version is
required, please contact Pulse for availability.
Estimated Temperature Rise:
Trise = [Total loss (mW) / K0].833 (oC )
4. Temperature of the component (ambient plus
temperature rise) must be within specified operating
temperature range.
Total loss = Copper loss + Core loss (mW)
5. The rated current (Irated) as listed is either the saturation current or the heating current depending on which
value is lower.
Copper loss = IRMS2 x DCR (Typical) (mW)
Irms = [IDC2 + ΔI2/12]1/2 (A)
6. The saturation current, Isat, is the current at which
the component inductance drops by the indicated
percentage (typical) at an ambient temperature of
25°C. This current is determined by placing the
component in the specified ambient environment and
applying a short duration pulse current (to eliminate
self-heating effects) to the component.
Core loss = K1 x f (kHz)1.23 x Bac(Ga)2.38 (mW)
Bac (peak to peak flux density) = K2 x ΔI (Ga)
[= K2/L(µH) x Et(V-µSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
Part No.
PG0085/86
PG0087
PG0040/41
P1174
PF0601
PF0464
PF0465
P1166
P1167
PF0560NL
P1168/69
P1170/71
P1172/73
PF0552NL
PF0553NL
Trise Factor
(K0 )
2.3
5.8
0.8
0.8
4.6
3.6
3.6
1.9
2.1
5.5
4.8
4.3
5.6
8.3
7.1
Core Loss Factor
(K1)
5.29E-10
15.2E-10
2.80E-10
6.47E-10
14.0E-10
24.7E-10
33.4E-10
29.6E-10
42.2E-10
136E-10
184E-10
201E-10
411E-10
201E-10
411E-10
Core Loss / K1 (mW)
7. The heating current, Idc, is the DC current required
to raise the component temperature by the indicated
delta (approximately). The heating current is
determined by mounting the component on a
typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple
on top of the unit under test.
K2 is a core size and winding dependant value and
is given for each p/n in the proceeding datasheets.
K0 & K1 are platform and material dependant constants
and are given in the table below for each platform.
CoreLoss/K1 Vs Flux Density
3.00E+10
100KHz
2.50E+10
200KHz
2.00E+10
300KHz
1.50E+10
400KHz
1.00E+10
500KHz
700KHz
0.50E+10
0
1.0MHz
0
500
1000
1500
DB (Gauss)
2000
2500
where DB = K2 x DI [= K2/L(µH) x Et(V-µSec)]
Take note that the component's temperature rise varies depending on the system condition. It is suggested that the
component be tested at the system level, to verify the temperature rise of the component during system operation.
USA 858 674 8100 • Germany 49 7032 7806 0 • Singapore 65 6287 8998 • Shanghai 86 21 54643211 / 2 • China 86 755 33966678 • Taiwan 886 3 4641811
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43
SPM2007 (11/07)