SMT POWER INDUCTORS Shielded Drum Core - P1166 Series Height: 3.8mm Max Footprint: 7.5mm x 7.5mm Max Current Rating: up to 5.5A Inductance Range: .44µH to 750µH Electrical Specifications @ 25°C — Operating Temperature -40°C to +130°C Saturation 6 Inductance Inductance DCR (m Ω ) Part** Irated 5 @0A DC @Irated Current Number (A DC ) TYP MAX -25% (A) (μH ±20%) (μH) MIN P1166.681 0.68 * 0.44 5.5 5.0 6.0 5.9 P1166.102 1.00 * 0.65 4.9 6.2 7.5 5.2 P1166.162 1.60 * 1.0 4.0 7.8 11 4.0 P1166.302 3.00 * 2.0 2.8 19 23 3.0 P1166.482 4.80 * 3.1 2.4 25 31 2.4 P1166.682 6.80 * 4.4 2.1 32 40 2.1 P1166.103 10 7.5 1.6 58 70 1.8 P1166.123 12 9.0 1.5 62 78 1.7 P1166.153 15 11.3 1.4 74 92 1.5 P1166.183 18 13.5 1.2 100 124 1.4 P1166.223 22 16.5 1.2 106 126 1.2 P1166.273 27 20.3 1.0 146 180 1.1 P1166.333 33 24.8 0.94 167 205 1.0 P1166.393 39 29.3 0.86 183 211 0.86 P1166.473 47 35.3 0.83 206 260 0.83 P1166.563 56 42.0 0.73 271 340 0.73 P1166.683 68 51.0 0.67 303 370 0.67 P1166.823 82 61.5 0.60 411 500 0.61 P1166.104 100 75.0 0.56 464 580 0.56 P1166.124 120 90.0 0.53 528 645 0.55 P1166.154 150 113 0.46 695 860 0.46 P1166.184 180 135 0.39 992 1190 0.42 P1166.224 220 165 0.35 1210 1480 0.37 P1166.274 270 203 0.32 1407 1750 0.32 P1166.334 330 248 0.31 1580 1880 0.31 P1166.394 390 293 0.26 2178 2600 0.29 P1166.474 470 353 0.25 2400 2910 0.26 P1166.564 560 420 0.23 2705 3400 0.23 P1166.684 680 510 0.20 3658 4450 0.21 P1166.824 820 615 0.17 5021 6200 0.20 P1166.105 1000 750 0.15 6720 8000 0.16 * I n d u c t a n c e a t 0 A DC t o l e r a n c e o n i n d i c a t e d p a r t n u m b e r s i s ± 3 0 % ; t o l e r a n c e i s ± 2 0 % o n a l l o t h e r p a r t s . Schematic Mechanical .138 MAX 3,51 .297 7,54 2 MAX XXX 1 .297 MAX 7,54 Weight . . . . . . . . 0.7 grams Tape & Reel . . . . . 1200/reel .197 5,00 .083 2,11 1 SUGGESTED PAD LAYOUT 1 .083 2,11 2 .197 5,00 .287 7,29 .165 4,20 .301 7,65 Heating 7 Core Loss 8 SRF Current Factor (MHz) +40°C(A) (K2) 5.5 380 >40 4.9 440 >40 4.4 570 >40 2.8 780 >40 2.5 990 >40 2.2 1200 38 1.6 1400 29 1.5 1500 25 1.4 1700 22 1.2 1800 21 1.2 2000 20 1.0 2300 17 0.94 2400 15 0.90 2700 13 0.85 2900 12 0.74 3300 11 0.70 3600 9.5 0.60 4000 8.0 0.57 4300 7.5 0.53 4700 7.0 0.46 5300 6.3 0.39 5800 5.6 0.35 6400 5.1 0.33 7100 4.6 0.31 7800 4.1 0.26 8500 3.9 0.25 9500 3.6 0.23 10000 3.1 0.20 11000 2.7 0.17 13000 2.5 0.15 14000 1.3 NOTES FROM TABLE: (See page 43) 2 .472 12,00 Dimensions: Inches mm Unless otherwise specified, all tolerances are ± .010 0,25 .630 16,00 TAPE & REEL LAYOUT USA 858 674 8100 • Germany 49 7032 7806 0 • Singapore 65 6287 8998 • Shanghai 86 21 54643211 / 2 • China 86 755 33966678 • Taiwan 886 3 4641811 www.pulseeng.com 34 SPM2006 (7/07) SMT POWER INDUCTORS Shielded Drum Core Series Notes from Tables (pages 27 - 42) 8. In high volt*time (Et) or ripple current applications, additional heating in the component can occur due to core losses in the inductor which may necessitate derating the current in order to limit the temperature rise of the component. In order to determine the approximate total loss (or temperature rise) for a given application, both copper losses and core losses should be taken into account. 1. Unless otherwise specified, all testing is made at 100kHz, 0.1VAC. 2. Optional Tape & Reel packaging can be ordered by adding a "T" suffix to the part number (i.e. P1166.102 becomes P1166.102T). Pulse complies with industry standard Tape and Tape & Reel specification EIA481. 3. To order RoHS compliant part, add the suffix "NL" to the part number (i.e. P1166.102 becomes P1166.102NL and P1166.102T becomes P1166.102NLT). Estimated Temperature Rise: 4. Temperature of the component (ambient plus temperature rise) must be within specified operating temperature range. Trise = [Total loss (mW) / K0].833 (oC ) Total loss = Copper loss + Core loss (mW) 5. The rated current (Irated) as listed is either the saturation current or the heating current depending on which value is lower. Copper loss = IRMS2 x DCR (Typical) (mW) 6. The saturation current, Isat, is the current at which the component inductance drops by the indicated percentage (typical) at an ambient temperature of 25°C. This current is determined by placing the component in the specified ambient environment and applying a short duration pulse current (to eliminate self-heating effects) to the component. Irms = [IDC2 + ΔI2/12]1/2 (A) Core loss = K1 x f (kHz)1.23 x Bac(Ga)2.38 (mW) Bac (peak to peak flux density) = K2 x ΔI (Ga) [= K2/L(µH) x Et(V-µSec) (Ga)] where f varies between 25kHz and 1MHz, and Bac is less than 2500 Gauss. K2 is a core size and winding dependant value and is given for each p/n in the proceeding datasheets. K0 & K1 are platform and material dependant constants and are given in the table below for each platform. Part No. PG0085/86 PG0087 PG0040/41 P1174 PF0601 PF0464 PF0465 P1166 P1167 PF0560NL P1168/69 P1170/71 P1172/73 PF0552NL PF0553NL Trise Factor (K0 ) 2.3 5.8 0.8 0.8 4.6 3.6 3.6 1.9 2.1 5.5 4.8 4.3 5.6 8.3 7.1 Core Loss Factor (K1) 5.29E-10 15.2E-10 2.80E-10 6.47E-10 14.0E-10 24.7E-10 33.4E-10 29.6E-10 42.2E-10 136E-10 184E-10 201E-10 411E-10 201E-10 411E-10 Core Loss / K1 (mW) 7. The heating current, Idc, is the DC current required to raise the component temperature by the indicated delta (approximately). The heating current is determined by mounting the component on a typical PCB and applying current for 30 minutes. The temperature is measured by placing the thermocouple on top of the unit under test. CoreLoss/K1 Vs Flux Density 3.00E+10 100KHz 2.50E+10 200KHz 2.00E+10 300KHz 1.50E+10 400KHz 1.00E+10 500KHz 700KHz 0.50E+10 0 1.0MHz 0 500 1000 1500 DB (Gauss) 2000 2500 where DB = K2 x DI [= K2/L(µH) x Et(V-µSec)] Take note that the component's temperature rise varies depending on the system condition. It is suggested that the component be tested at the system level, to verify the temperature rise of the component during system operation. USA 858 674 8100 • Germany 49 7032 7806 0 • Singapore 65 6287 8998 • Shanghai 86 21 54643211 / 2 • China 86 755 33966678 • Taiwan 886 3 4641811 www.pulseeng.com 43 SPM2006 (7/07)