RFMD + TriQuint = Qorvo RFPA5542 RFPA5542 WiFi Integrated PA Module 4.9GHz to 5.925GHz The RFPA5542 is a three-stage power amplifier (PA) designed for 802.11a/n/ac applications. The integrated input and output 50Ω match greatly reduces the layout area, bill of materials and manufacturability cost in the customer application. The PA is optimized to minimize the required external components to maintain linear performance. The RFPA5542 is manufactured on an advanced InGaP heterojunction bipolar transistor (HBT) process and is capable of achieving linear powers up to 23dBm with an EVM <1.8% while maintaining excellent power added efficiency. The device is provided in a 4.0mm x 4.0mm x 0.90mm package that meets or exceeds the power requirements of IEEE802.11a/n/ac WiFi RF systems. Package: QFN, 20-pin, 4.0mm x 4.0mm x 0.90mm Features ■ POUT = 23dBm, 5V, 11ac, 80MHz MCS9 at 1.8% EVM ■ POUT = 25dBm, 5V, 11n, 20/40MHz MCS7 at 3% EVM ■ Typical Gain = 33dB ■ High PAE ■ Required external components minimized ■ Integrated Regulator ■ Input and Output Matched to 50Ω ■ Integrated Power Detector Applications ■ Customer Premise Equipment (CPE) ■ Wireless Access Points, Gateways ■ Routers ■ Set-Top Box Applications ■ Picocell/Femtocell Functional Block Diagram Ordering Information RFPA5542SB Standard 5-piece Sample Bag RFPA5542SQ Standard 25-piece Sample Bag RFPA5542SR Standard 100-piece Reel RFPA5542TR13 Standard 2500-piece Reel RFPA5542PCK-410 Fully Assembled Evaluation Board Revision DS20150515 © 2015 RF Micro Devices, Inc. 1 of 7 Disclaimer: Subject to change without notice www.rfmd.com / www.qorvo.com RFPA5542 RFMD + TriQuint = Qorvo Absolute Maximum Ratings Parameter DC Supply Voltage DC Supply Current Rating Unit -0.5 to +6 VDC 1000 mA Operating Case Temperature -40 to +85 ºC Storage Temperature -40 to +150 ºC +10 dBm +15 dBm Maximum TX Input Power into 50Ω Load for 11a/n/ac (No Damage). *R1=0Ω Maximum TX Input Power into 10:1 VSWR Load for 11a/n/ac (No Damage). *R1=15Ω Moisture Sensitivity Level (260°C JEDEC J-STD-020) Caution! ESD sensitive device. RFMD Green: RoHS status based on EU Directive 2011/65/EU (at time of this document revision), halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. This is an InGaP PA designed for high duty cycle applications with Tj>30oC over ambient. MSL2 *Note: For R1 placement, please refer to the applications schematic. Nominal Operating Parameters Specification Parameter Unit Min Typ Max 5.00 3.0 5.925 5.180 5.25 3.3 GHz GHz V V 0.5 V Condition Compliance Operating Frequency Extended Operating Frequency Power Supply VCC PA Enable - High PA Enable - Low 802.11a/n/ac 5.180 4.900 4.75 1.7 0 T= +25ºC, VCC=5.0V, VPAEN = 3.0V, Unless otherwise noted 5V Transmit Performance 11ac 80MHz Output Power 22 11ac 80MHz DEVM 11ac 160MHz Output Power 21 11ac 160MHz DEVM 11n 20/40MHz Output Power 23.5 11n 20/40MHz DEVM Gain Gain Variation over Temp 31 -2.5 23 1.5 1.8 Operating Current Quiescent Current PA Enable Current Leakage Current Revision DS20150515 © 2015 RF Micro Devices, Inc. MCS9 256QAM MCS9 256QAM -36.5 22 1.5 -35 1.8 dB dBm % -36.5 -35 dB 25 dBm 2.5 3 % MCS7 64QAM -32.0 33 -30.5 dB dB dB Over operating frequency band dB POUT=23dBm; MCS0 160MHz 3 dB POUT=25dBm; MCS0 80MHz 3 dB POUT=26dBm; MCS0 40MHz 3 dB POUT=27dBm; MCS0 20MHz +2.5 3 Margin to Spectral Mask dBm % 285 385 310 430 mA mA POUT=23dBm POUT=27dBm 150 1 165 5 mA uA RF=Off, T= +25ºC, VCC=5.0V, VPAEN = 3.0V, 0.2 1 uA 2 of 7 PA_EN High RF OFF; VCC=5.0V, VPAEN = 0V Disclaimer: Subject to change without notice www.rfmd.com / www.qorvo.com RFPA5542 RFMD + TriQuint = Qorvo Specification Parameter Unit Min Typ Condition Max T= +25ºC, VCC=5.0V, VPAEN = 3.0V, Unless otherwise noted 5V Transmit Performance Second Harmonic -45 -40 dBm/MHz Third Harmonic -50 -45 dBm/MHz OOB Gain Input Return Loss Output Return Loss -5 dB 7 12 dB dB 12 0.25 dB V 0.55 Power Detector Range POUT = 27dBm, measured with a standard IEEE802.11a 6 Mbps waveform POUT = 27dBm, measured with a standard IEEE802.11a 6 Mbps waveform Gain @ 3.3-3.8GHz Gain @ 7.0GHz RF=Off POUT = 22dBm 0.65 0.85 V V POUT = 23dBm POUT = 27dBm General Specifications Stability Output VSWR Output Power Range 4:1 0 27 CW signal. No spurious above -41.25dBm/MHz for non-harmonic related signals. dBm Output P1dB 33 dBm Ramp ON/OFF time 200 nS Thermal Resistance 25 °C/W CW signal 10-90% / 90-10% of gain ESD HBM 1500 V EIA/JESD22-114A; All pins ESD CDM 500 V JESD22-C101C; All pins Revision DS20150515 © 2015 RF Micro Devices, Inc. 3 of 7 Disclaimer: Subject to change without notice www.rfmd.com / www.qorvo.com RFPA5542 RFMD + TriQuint = Qorvo RFPA5542 Applications Schematic Revision DS20150515 © 2015 RF Micro Devices, Inc. 4 of 7 Disclaimer: Subject to change without notice www.rfmd.com / www.qorvo.com RFPA5542 RFMD + TriQuint = Qorvo Pin Out Revision DS20150515 © 2015 RF Micro Devices, Inc. 5 of 7 Disclaimer: Subject to change without notice www.rfmd.com / www.qorvo.com RFPA5542 RFMD + TriQuint = Qorvo Package Drawing PCB Patterns Revision DS20150515 © 2015 RF Micro Devices, Inc. 6 of 7 Disclaimer: Subject to change without notice www.rfmd.com / www.qorvo.com RFPA5542 RFMD + TriQuint = Qorvo Pin Names and Descriptions Pin Name 1 NC 2 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 3 RFIN RF input, internally matched to 50Ω and DC shorted. External DC blocking capacitor required. 4 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 5 PA_EN 6 NC Not connected internally. It may be left floating or connected to ground. 7 NC Not connected internally. It may be left floating or connected to ground. 8 NC Not connected internally. It may be left floating or connected to ground. 9 NC Not connected internally. It may be left floating or connected to ground. 10 PDET Power detector. Provides an output voltage proportional to the RF output power level. 11 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 12 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 13 RFOUT 14 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 15 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 16 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 17 GND Ground connection. This pin is not connected internally and can be left floating or connected to ground. 18 VCC3 Third stage supply voltage 19 VCC2 Second stage supply voltage. 20 VCC1 First stage supply voltage. Pkg Base GND Ground connection. The back side of the package should be connected to the ground plan though as short of a connection as possible. PCB vias under the device are recommended. Revision DS20150515 © 2015 RF Micro Devices, Inc. Description Not connected internally. It may be left floating or connected to ground. PA Enable pin. Apply <0.4VDC. Apply 1.5VDC to VCC to enable PA. RF output, internally matched to 50Ω and DC shorted. External DC blocking capacitor required. 7 of 7 Disclaimer: Subject to change without notice www.rfmd.com / www.qorvo.com