规格书编号 SPEC NO : 产品 规 格书 SPECIFICATION CUSTOMER 客 户： PRODUCT 产 品： SAW FILTER MODEL NO 型 号： HDF110A F11 PREPARED 编 制： CHECKED 审 核： APPROVED 批 准： D A T E 日 期： 2006-5-11 客户确认 CUSTOMER RECEIVED: 审核 CHECKED 批准 APPROVED 日期 DATE 无锡市好达电子有限公司 Shoulder Electronics Limited www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 1 of 5 SAW FILTER HDF110A F11 更改历史记录 History Record 更改日期 Date www.shoulder.cn 规格书编号 Spec. No. 产品型号 Part No. 客户产品型号 Customer No. Tel:0755-82916880 Fax:0755-82916881 更改内容描述 Modify Content E-mail:[email protected] 备注 Remark Page 2 of 5 SAW FILTER HDF110A F11 1. SCOPE This specification shall cover the characteristics of SAW filter F110A 2. ELECTRICAL SPECIFICATION DC Voltage VDC 10V AC Voltage Vpp 10V50Hz/60Hz Operation temperature -40℃ to +85℃ Storage temperature -45℃ to +85℃ RF Power Dissipation 0dBm 2.2Electronic Characteristics 型号 Part Number 中心频率(fo)(MHz) Nominal Center Frequency 3dB 带宽 Bandwidth(from fo)(MHz) 阻带衰耗 Stop Band Attenuation (from peak level)(dB) 1)fo-5.0MHz 2)fo±3.0MHz 3)fo+5.0MHz 插入损耗(dB) Insertion Loss(at minimum loss point) 群延时波动(fo+/-576KHz)(μsce.) Group Delay Deviation 输入/输出阻抗 Input/output Impedance www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] HDF110A 110.0 1.6 typ. 40min 30min 40min 6.0max 0.200 50Ω//0pF Page 3 of 5 SAW FILTER HDF110A F11 3. DIMENSION 4.TEST CIRCUIT www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 4 of 5 SAW FILTER HDF110A F11 5. ENVIRONMENTAL CHARACTERISTICS 5-1 High temperature exposure Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2. 5-2 Low temperature exposure Subject the device to -40℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2. 5-3 Temperature cycling Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high temperature of +85℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in 2.2. 5-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2.2. 5-5 Solderability Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2.2. 5-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2.2. 5-7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2. 6. REMARK 6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component. www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 5 of 5