产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF139 F11
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2006-5-11
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 5
SAW FILTER
HDF139
F11
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规格书编号
Spec. No.
产品型号
Part No.
客户产品型号
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Page 2 of 5
SAW FILTER
HDF139
F11
1. SCOPE
This specification shall cover the characteristics of SAW filter With F139 used for the page
system.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
10V
10V50Hz/60Hz
-40℃ to +85℃
-45℃ to +85℃
0dBm
2-1.Typcal frequency response
2-2Electrical characteristics
Part number
Nominal center frequency (Fo)
Insertion Loss
1.Fo -100MHz to Fo -46.8MHz
2.Fo -46.8MHz to Fo-38.8MHz
3.Fo±4MHz
4.Fo±38.8MHz to 2.5×Fo
Input/Output Impedance(Nominal)
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
HDF139
139.0
50 min
50 min
6.5 max
42 min
210/-13.3
E-mail:[email protected]
Unit
MHz
dB
Ω/pF
Page 3 of 5
SAW FILTER
HDF139
F11
3. TEST CIRCUIT
4. DIMENSION
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Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 4 of 5
SAW FILTER
HDF139
F11
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
5-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2-2.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 2-2.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2-2.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 2-2.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2-2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 5 of 5