规格书编号 SPEC NO : 产品规 格 书 SPECIFICATION CUSTOMER 客 户： PRODUCT 产 品： SAW FILTER MODEL NO 型 号： HDF650A F11 PREPARED 编 制： CHECKED 审 核： APPROVED 批 准： D A T E 日 期： 2010-8-25 客户确认 CUSTOMER RECEIVED: 审核 CHECKED 批准 APPROVED 日期 DATE 无锡市好达电子有限公司 Shoulder Electronics Limited www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 1 of 4 SAW FILTER HDF650A F11 1. SCOPE This specification shall cover the characteristics of SAW filter With HDF650A used for the page system. 2. ELECTRICAL SPECIFICATION DC Voltage VDC AC Voltage Vpp Operation temperature Storage temperature 10V 10V50Hz/60Hz -40℃ to +85℃ -45℃ to +85℃ Electronic Characteristics 2-1.Typical frequency response 2-2.Electrical characteristics Center Frequency Insertion Loss (In Fc +/- 4 MHz) Amplitude Ripple (In Fc +/- 4 MHz) Relative Attenuation 0.3 MHz ~ Fo-35 MHz Fo+45 MHz ~ …. Input/Output Impedance www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 Unit Minimum Typical Maximum MHz dB dB - 650 - 2.5 0.5 3.0 1.0 dB 40 40 45 45 50 - Ohms E-mail:[email protected] Page 2 of 4 SAW FILTER HDF650A F11 3. TEST CIRCUIT 4. DIMENSION www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 3 of 4 SAW FILTER HDF650A F11 5. ENVIRONMENTAL CHARACTERISTICS 5-1 High temperature exposure Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2. 5-2 Low temperature exposure Subject the device to -40℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2-2. 5-3 Temperature cycling Subject the device to a low temperature of -40℃for 30 minutes. Following by a high temperature of +85℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in 2-2. 5-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2-2. 5-5 Solderability Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2-2. 5-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2-2. 5-7 Vibration Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2-2. 6. REMARK 6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be solded. Please avoid soldering another part of component. www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 4 of 4