CERAMIC RESONATOR Data Sheet

SHOULDER ELECTRONICS LIMITED
CERAMIC RESONATOR Data Sheet
PRODUCT 产 品:
CERAMIC
MODEL NO 型 号:
ZTTCV…MX
PREPARED 编 制:
Fengyu
CHECKED 审 核:
York
APPROVED 批 准:
Lijiating
DATE
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日 期:
RESONATOR
2008-01-25
Page: 1
SHOULDER ELECTRONICS LIMITED
1 SCOPE
This specification shall cover the characteristics of the ceramic resonator 16.00-50.00MHZ.
2 PART NO.
PART NUMBER
CUSTOMER PART NO
SPECIFICATION NO
ZTTCV…MX
3.OUTLINE DIMENSIONS AND MARK
3.1 Appearance: No visible damage and dirt.
3.2 Construction: SMD ceramic packaging.
3.3 The products conform to the RoHS directive and national environment protection law.
16.0*
0.7±0.2
3.1±0.2
3.4 Dimensions and mark
0.7±0.2
0.9±0.2
1.2±0.2
1.5±0.2
3.7±0.2
4.ELECTRICAL SPECIFICATIONS
4.1 RATING
Items
Withstanding Voltage (V)
Insulation Resistance Ri,(MΩ)min.
Operating temperature
Storage temperature
Rating Voltage
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① Input
② Ground
③ Output
*:EIAJ MONTHLY CODE
Requirement
50 (DC,1min)
100 (10V,1min)
-25℃~85℃
-55℃~85℃
6V DC
UR(V)
15V p-p
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SHOULDER ELECTRONICS LIMITED
4.2 ELECTRICAL SPECIFICATIONS
Items
Requirement
Oscillation Frequency Fosc(MHz)
16.00-50.00
Frequency Accuracy (%)
Resonant Impedance Ro(Ω)max.
Temperature Coefficient of Oscillation
Frequency (%) max.
Oscillation Frequency
Aging Rate (%) max *
±0.5
40
±0.3(Oscillation Frequency
drift,-25℃~+85℃)
±0.3
(From initial value)
* Components shall be left in a chamber of +85±2℃ for 1000 hours, then measured after
leaving in natural condition for 1 hours.
5.TEST
5.1 Test Conditions
Parts shall be tested under the condition ( Temp.:20±15℃,Humidity :65±20%
R.H.) unless the standard condition(Temp.:25±2℃,Humidity :65±5% R.H.)
is regulated to measure.
5.2 Test Circuit
IC: 1/6 TC74HCU04P×2
X: Ceramic Resonator
①INPUT ②GROUND ③OUTPUT
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
No
Item
Condition of Test
6.1
Humidity
Keep the resonator at 40℃±2℃ and 90%-95%
RH for 96h. Then Release the resonator into
the room Condition for 1h prior to the
Measurement.
6.2
High
Temperature
Exposure
Subject the resonator to 85℃±2℃ for 96h,
then release the resonator into the room
conditions for 1h prior to the measurement.
6.3
Low
Temperature
Exposure
Subject the resonator to -55℃±2℃ for 96h,
then release the resonator into the room
conditions for 1h prior to the measurement.
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Page: 3
Performance
Requirements
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
the
specifications
in Table 1.
SHOULDER ELECTRONICS LIMITED
6.4
Temperature
Cycling
6.5
Vibration
6.6
Mechanical
Shock
After temperature cycling of blow table was
performed 5 times, resonator shall be measured
after being placed in natural conditions for 1h.
Temperature
Time
–25±3℃
30±3 min
85±3℃
30±3 min
Subject the resonator to vibration for 2h each in
x、y and z axis With the amplitude of 1.5mm,
the frequency shall be varied uniformly
between the limits of 10 Hz—55Hz.
It shall fulfill
the
specifications
in Table 1.
It shall fulfill
Drop the resonator randomly onto a wooden the
floor from the height of 100cm 3 times.
specifications
in Table 1.
Passed through the re-flow oven under the
following condition and left at room
temperature for 1h before measurement.
Peak:260℃max
6.7
Soldering
Test
It shall fulfill
the
specifications
in Table 1.
10s max
250℃
It shall fulfill
the
specifications
in Table 1.
230℃
150℃
Pre-heating
100℃
30s min
within
80-120s.
within
20-40s
(To be continued)
6 PHYSICAL AND ENVIRONMENAL CHARACTERISICS
No
6.8
6.9
Item
Solder
Ability
Board
Bending
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Performance
Requirements
Dipped in 245℃±5℃ solder bath for The terminals shall
3s±0.5 s with rosin flux (25wt% ethanol be at least 95%
solution.)
covered by solder.
Condition of Test
Mount
a
glass-epoxy
board
(Width=40mm,thickness=1.6mm),then bend it
to 1mm displacement and keep it for 5s. (See
the following figure)
Page: 4
Mechanical damage
such as breaks shall
not occur.
SHOULDER ELECTRONICS LIMITED
PRESS
PRESS HEAD
SUPPORT BAR
Table 1
Item
Oscillation Frequency Change
Δfosc/fosc (%)max.
Resonant Impedance
Specification after test
±0.3
Ro(Ω)max.
45
The limits in the above table are referenced to the initial measurements.
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD
CONDITIONS
7.1Recommended land pattern
4.1±0.2
1 .5 ± 0.2
1.0 ± 0.2
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0 .8 ± 0 .2
Page: 5
1.0 ± 0.2
SHOULDER ELECTRONICS LIMITED
7.2Recommended reflow soldering standard conditions
10s max
250℃
Peak:260℃max
230℃
150℃
Pre-heating
100℃
30s min
within
80-120s.
within
20-40s
8.PACKAGE
To protect the products in storage and transportation,it is necessary to pack them(outer and
inner package).
8.1 On paper pack, the following requirements are requested.
8.1.1 Dimensions and Mark
5
6
3
4
7
300
1
2
382
392
NO.
Name
Quantity
①
Package
1
②
Inner Box
12
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Page: 6
SHOULDER ELECTRONICS LIMITED
③
Belt
2.9 m
④
Adhesive tape
1.2 m
⑤
Label
1
⑥
Certificate of approval
1
⑦
Company name ,Address etc.
8.1.2 Section of package
Package is made of corrugated paper with thickness of 0.8cm.Package has 10 inner boxes, each
box has 1 reel(each reel for plastic bag)
8.1.3 Quantity of package
Per plastic reel
1000 pieces of piezoelectric ceramic part
Per inner box
5 reels
Per package
(60000 pieces of
12 inner boxes
piezoelectric ceramic part )
8.1.4 Inner Box Dimensions
96±2
②
①
18
5±
2
185±2
③
NO.
Name
Quantity
①
Inner Box
1
②
QC Label
1
③
Label
1
8.2 On reel pack, the following requirements are requested.
8.2.1 Reel Dimensions
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Page: 7
SHOULDER ELECTRONICS LIMITED
φA
φB
W
T
Pieces per reel Carrier tape size
180±3 60min 12.4min 19.4max
1000typ.
12
8.2.3 Packing Method Sketch Map
Blank Pocket
10 Pitches
Loaded Pocket
Blank Pocket
10 Pitches
Leader
200mm Max
8.2.4Test Condition of Peeling Strength
Top Tape
h 20-70g
t
g
n
e
r
t
S
g
n
i
Peel
10 max
Carrier Tape
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Page: 8
SHOULDER ELECTRONICS LIMITED
9.EIAJ Monthly Code
2005 / 2007 / 2009
MONTH
CODE
JAN
A
FEB
B
MAR
C
APR
D
MAY
E
JUN
F
JUL
G
AUG
H
SEP
J
OCT
K
NOV
L
DEC
M
2006 / 2008 / 2010
MONTH
CODE
JAN
N
FEB
P
MAR
Q
APR
R
MAY
S
JUN
T
JUL
U
AUG
V
SEP
W
OCT
X
NOV
Y
DEC
Z
10.OTHER
10.1 Caution
10.1.1 Don’t apply excess mechanical stress to the component and terminals at soldering. Do
not use this product with bend.
10.1.2 Do not clean or wash the component for it is not hermetically sealed.
10.1.3 Do not use strong acidity flux,more than 0.2wt% chlorine content,in flow soldering.
10.1.4 Don’t be close to fire.
10.1.5 This specification mentions the quality of the component as a single unit. Please insure
the component is thoroughly evaluated in your application circuit
10.1.6 Expire date (Shelf life) of the products is six months after delivery under the conditions
of a sealed and an unopened package. Please use the products within six months after delivery.
If you store the products for a long time (more than six months), use carefully because the
products may be degraded in the solderability or rusty. Please confirm solderability and
characteristics for the products regularly.
10.1.7 Please contact us before using the product as automobile electronic component.
10.2 Notice
10.2.1 Please return one of this specification after your signature of acceptance.
10.2.2 When something gets doubtful with this specifications, we shall jointly work to get an
agreement.
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SHOULDER ELECTRONICS LIMITED