SHOULDER ELECTRONICS LIMITED CERAMIC RESONATOR Data Sheet PRODUCT 产 品: CERAMIC MODEL NO 型 号: ZTTCC…MG PREPARED 编 制: Fengyu CHECKED 审 核: York APPROVED 批 准: Lijiating DATE Http://www.shoulder.cn 日 期: RESONATOR 2008-01-25 Page: 1 SHOULDER ELECTRONICS LIMITED 1 SCOPE This specification shall cover the characteristics of the ceramic resonator 1.84-8.00MHZ 2 PART NO. PART NUMBER CUSTOMER PART NO SPECIFICATION NO ZTTCC…MG 3 OUTLINE DRAWING AND DIMENSIONS 3.1 Appearance: No visible damage and dirt. 3.2 Except the chip(ceramic element, ceramic base, capacitance slice), the materials don’t contain lead. 3.3 Dimensions 1.2± 0.3 1.2± 0.3 1.2± 0.3 ② ③ 1.8±0.3 ① 2.5± 0.3 2.5± 0.3 4.00M 3.4±0.3 7.4± 0.3 ① Input ② Ground ③ Output 4 RATING AND ELECTRICAL SPECIFICATIONS 4.1 RATING Items Content Withstanding Voltage (V) 50 (DC，1min) Insulation Resistance Ri,（MΩ）min. 100 （100V，1min） Operating Temperature Range (℃) -20～+80 Storage Temperature Range (℃) -55～+85 Http://www.shoulder.cn Page: 2 SHOULDER ELECTRONICS LIMITED 4.2 ELECTRICAL SPECIFICATIONS Oscillation Frequency Fosc（MHz） 1.84-8.00 Frequency Accuracy （%） ±0.5 Resonant Impedance Ro（Ω）max. 30 ±0.3 （Oscillation Frequency drift，-20℃～+80℃） Temperature Coefficient of Oscillation Frequency （%） max. 6V DC Rating Voltage UR（V）max. 15V p-p Aging Rate （%）max. ±0.3 （For Ten Years） 5 MEASUREMENT 5.1 Measurement Conditions Parts shall be measured under a condition ( Temp.：20℃±15℃,Humidity ：65%±20% R.H.) unless the standard condition(Temp.：25℃±3℃,Humidity ：65%±5% R.H.) is regulated to measure. 5.2 Test Circuit IC：1/6TC4069UBP×2 X：CERAMIC RESONATOR C1,C2: 30pF(1±20%) 6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS No Item 6.1 Humidity 6.2 Vibration 6.3 Mechanical Shock Http://www.shoulder.cn Condition of Test Keep the resonator at 40℃±2℃ and 90%-95% RH for 96h±4h. Then Release the resonator into the room Condition for 1h prior to the Measurement. Subject the resonator to vibration for 2h each in x、y and z axis With the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 Hz—55Hz. Drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. Page: 3 Performance Requirements It shall fulfill the specifications in Table 1. It shall fulfill the specifications in Table 1. It shall fulfill the specifications in Table 1. SHOULDER ELECTRONICS LIMITED 6.4 Soldering Test Passed through the re-flow oven under the following condition and left at room temperature for 1h before measurement. Temperature at the surface of the Time substrate Preheat 150℃±5℃ 60s±10 s Peak 260℃±5℃ 10s±3 s 6.5 Solder Ability Dipped in 250℃±5℃ solder bath for 3s±0.5 s with rosin flux (25wt% ethanol solution.) 6.6 High Temperature Exposure Subject the resonator to 80℃±5℃ for 96s, then release the resonator into the room conditions for 1h prior to the measurement. 6.7 Low Temperature Exposure Subject the resonator to -20℃±5℃ for 96h, then release the resonator into the room conditions for 1h prior to the measurement. 6 PHYSICAL AND ENVIRONMENAL CHARACTERISICS No Item Condition of Test 6.8 6.9 It shall fulfill the specifications in Table 1. The terminals shall be at least 95% covered by solder. It shall fulfill the specifications in Table 1. It shall fulfill the specifications in Table 1. （To be continued） Performance Requirements Temperature Cycling Subject the resonator to -40℃ for 30 min. followed by a high temperature of 85℃ for 30 min. It shall fulfill the Cycling shall be repeated 5 times with a specifications in transfer time of 15s. At the room Table 1. temperature for 1h prior to the measurement. Board Bending Mount a glass-epoxy board (Width=40mm,thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (See the following figure) Http://www.shoulder.cn Page: 4 Mechanical damage such as breaks shall not occur. SHOULDER ELECTRONICS LIMITED PRESS PRESS HEAD SUPPORT BAR Table 1 Item Oscillation Frequency Change △Fosc/Fosc (%) max Resonant Impedance (Ω) max Specification after test ±0.3 40 The limits in the above table are referenced to the initial measurements. 7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS 7.1Recommended land pattern Http://www.shoulder.cn Page: 5 SHOULDER ELECTRONICS LIMITED 7.2Recommended reflow soldering standard conditions Tem.(℃) within 10s 250 255℃ Peak:260℃ Pre-heating within 80-120s. within 20-40s 8 PACKAGE To protect the products in storage and transportation，it is necessary to pack them（outer and inner package）.On paper pack, the following requirements are requested. 8.1 Dimensions and Mark At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) Http://www.shoulder.cn Page: 6 SHOULDER ELECTRONICS LIMITED NO. Name Quantity 1 Package 1 2 Certificate of approval 1 3 Label 1 4 Tying 2 5 Adhesive tape 1.2m 6 Belt 2.9m 7 Inner Box 10 Notes 8.2 Section of package Package is made of corrugated paper with thickness of 0.8cm.Package has 10 inner boxes, each box has 1 reel(each reel for plastic bag) 8.3 Quantity of package Per plastic reel 4000 pieces of piezoelectric ceramic part Per inner box 1 reel Per package 10 inner boxes （40000 pieces of piezoelectric ceramic part ） 8.4 Inner Packing Dimensions 1 Label 2 QC Label 3 Inner Box Pars shall be packaged in box with hold down tape upside. Part No., quantity and lot No. 8.5 Reel Http://www.shoulder.cn Page: 7 SHOULDER ELECTRONICS LIMITED Dimensions φA φB Unit：mm W T Pieces per reel Carrier tape size 330±3 80min 16.4min 22.4max 4000typ. 16 8.6 Taping Dimensions 8.7 Packing Method Sketch Map Blank Pocket 10 Pitches Http://www.shoulder.cn Loaded Pocket Blank Pocket 10 Pitches Page: 8 Leader 200mm Max SHOULDER ELECTRONICS LIMITED 8.8 Test Condition Of Peeling Strength T o p T ap e ng g S tre P e e lin th 2 0 - 7 0 g 10° Max C arrier T ap e 9 OTHER 9.1 Caution of use 9.1.1 Do not use this product with bend. Please don’t apply excess mechanical stress to the component and terminals at soldering. 9.1.2 The component may be damaged when an excess stress will be applied. 9.1.3 This specification mentions the quality of the component as a single unit. Please insure the component is thoroughly evaluated in your application circuit. 9.2 Notice 9.2.1 Please return one of this specification after your signature of acceptance. 9.2.2 When something gets doubtful with this specifications, we shall jointly work to get an agreement. Http://www.shoulder.cn Page: 9 SHOULDER ELECTRONICS LIMITED