- Samsung

May. 2015
DDR4 SDRAM Memory
Product Guide
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION
AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of
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intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment,
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provisions may apply.
For updates or additional information about Samsung products, contact your nearest Samsung
office.
All brand names, trademarks and registered trademarks belong to their respective owners.
-1-
May. 2015
Product Guide
DDR4 SDRAM Memory
1. DDR4 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
K 4 A X X X X X X X - X X X X
Speed
SAMSUNG Memory
DRAM
Temp & Power
DRAM Type
Package Type
Density
Revision
Interface (VDD, VDDQ)
Bit Organization
# of Internal Banks
1. SAMSUNG Memory : K
8. Revision
M
A
B
C
D
E
F
G
H
2. DRAM : 4
3. DRAM Type
A : DDR4 SDRAM
4. Density
4G : 4Gb
8G : 8Gb
16G : AG
32G : BG
9. Package Type
B
M
4
2
5. Bit Organization
04 : x 4
08 : x 8
6. # of Internal Banks
W : POD (1.2V, 1.2V)
:
:
:
:
FBGA (Halogen-free & Lead-free, Flip Chip)
FBGA (Halogen-free & Lead-free, DDP)
FBGA (Halogen-free & Lead-free, TSV 4High)
FBGA (Halogen-free & Lead-free, TSV 2High)
10. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
5 : 16 Banks
7. Interface ( VDD, VDDQ)
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen.
: 8th Gen.
: 9th Gen.
11. Speed
PB : DDR4-2133
RC : DDR4-2400
RB : DDR4-2133
TC : DDR4-2400
-2-
(1066MHz @ CL=15, tRCD=15, tRP=15)
(1200MHz @ CL=17, tRCD=17, tRP=17)
(1066MHz @ CL=17, tRCD=15, tRP=15)
(1200MHz @ CL=19, tRCD=17, tRP=17)
May. 2015
Product Guide
DDR4 SDRAM Memory
2. DDR4 SDRAM Component Product Guide
Density
Banks
Part Number
Package & Power,
Temp. & Speed
Org.
4Gb D-die
16Banks
(4Bank Groups)
K4A4G045WD
BCPB/RC
1G x 4
K4A4G085WD
BCPB/RC
512M x 8
8Gb B-die
16Banks
(4Bank Groups)
K4A8G045WB
BCPB/RC
2G x 4
K4A8G085WB
BCPB/RC
1G x 8
-3-
VDD Voltage
PKG
Avail.
1.2V
78 ball FBGA
MP
1.2V
78 ball FBGA
MP
NOTE
May. 2015
Product Guide
DDR4 SDRAM Memory
3. DDR4 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
13
M X X X A X X X X X X X - X X XX
Memory Module
DIMM Type
Memory buffer
Data bits
Speed
DRAM Component Type
Temp & Power
Depth
PCB Revision
Package
# of Banks in Comp. & Interface
Component Revision
Bit Organization
8. Component Revision
M : 1st Gen.
B : 3rd Gen.
D : 5th Gen.
F : 7th Gen.
1. Memory Module : M
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71:
74 :
78:
86 :
91:
92:
93 :
x64
x72
x64
x72
x72
x72
x72
260pin Unbuffered SODIMM
260pin ECC Unbuffered SODIMM
288pin Unbuffered DIMM
288pin Load Reduced DIMM
288pin ECC Unbuffered DIMM
288pin VLP Registered DIMM
288pin Registered DIMM
A
C
E
G
:
:
:
:
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
9. Package
B : FBGA (Halogen-free & Lead-free, Flip Chip)
M : FBGA (Halogen-free & Lead-free, DDP)
2 : FBGA (Halogen-free & Lead-free, 2H TSV)
4 : FBGA (Halogen-free & Lead-free, 4H TSV)
10. PCB Revision
0 : None
2 : 2nd Rev.
4 : 4th Rev.
4. DRAM Component Type
1 : 1st Rev.
3 : 3rd Rev.
A : DDR4 SDRAM (1.2V VDD)
11. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
5. Depth
51K
1G
2G
4G
8G
: 512M
: 1G
: 2G
: 4G
: 8G
1K : 1G (for 8Gb)
2K : 2G (for 8Gb)
4K : 4G (for 8Gb)
8K : 8G (for 8Gb)
AG : 16G
12. Speed
PB : DDR4-2133
RC : DDR4-2400
RB : DDR4-2133
TC : DDR4-2400
6. # of Banks in comp. & Interface
4 : 16Banks & POD-1.2V
7. Bit Organization
0 : x4
3 : x8
-4-
(1066MHz @ CL=15, tRCD=15, tRP=15)
(1200MHz @ CL=17, tRCD=17, tRP=17)
(1066MHz @ CL=17, tRCD=15, tRP=15)
(1200MHz @ CL=19, tRCD=17, tRP=17)
May. 2015
Product Guide
DDR4 SDRAM Memory
4. DDR4 SDRAM Module Product Guide
4.1 288Pin DDR4 Registered DIMM
288Pin DDR4 Registered DIMM
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
1G x4 * 18pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
MP
C(1Rx4)
1G x4 * 18pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
Mar’15
CS
CPB
E(2Rx8)
512M x8 * 18pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
M393A1G43DB1
CRC
E(2Rx8)
512M x8 * 18pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
Apr’15
CS
16GB
M393A2G40DB0
CPB
A(2Rx4)
1G x4 * 36pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
2G x72
16GB
M393A2G40DB1
CRC
A(2Rx4)
1G x4 * 36pcs
4Gb D-die
16
2
78ball
FBGA
31.25mm
Mar’15
CS
2G x72
16GB
M393A2K40BB0
CPB
C(1Rx4)
2G x4 * 18pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
MP
2G x72
16GB
M393A2K40BB1
CRC
C(1Rx4)
2G x4 * 18pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
Mar’15
CS
2G x72
16GB
M393A2K43BB1
E(2Rx8)
1G x8 * 18pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
Mar’15
CS
4G x72
32GB
M393A4K40BB0
CPB
A(2Rx4)
2G x4 * 36pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
4G x72
32GB
M393A4K40BB1
CRC
A(2Rx4)
2G x4 * 36pcs
8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
8G x72
64GB
M393A8G40D40
CRB
A(8Rx4)
4H TSV
x4 * 36pcs
4G
4Gb D-die
16
8
78ball
FBGA
31.25mm
MP
8G x72
64GB
TBD
CRB/CTC A(4Rx4)
2H TSV
x4 * 36pcs
4G
8Gb B-die
16
4
78ball
FBGA
31.25mm
Aug’15
CS
16G x72 128GB
TBD
CRB/CTC A(8Rx4)
4H TSV
x4 * 36pcs
8G
8Gb B-die
16
8
78ball
FBGA
31.25mm
Dec’15
CS
Org.
Density
Part Number
Speed
Raw Card
1G x72
8GB
M393A1G40DB0
CPB
C(1Rx4)
1G x72
8GB
M393A1G40DB1
CRC
1G x72
8GB
M393A1G43DB0
1G x72
8GB
2G x72
CPB
CRC
Composition
NOTE
4.2 288Pin DDR4 Load Reduced DIMM
288Pin DDR4 Load Reduced DIMM
Org.
Density
Part Number
Speed
Raw Card
Composition
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
4G x72
32GB M386A4G40DM0
CPB
D(4Rx4)
DDP
x4 * 36pcs 4Gb D-die
2G
16
4
78ball
FBGA
31.25mm
MP
4G x72
32GB M386A4G40DM1
CRC
D(4Rx4)
DDP
x4 * 36pcs 4Gb D-die
2G
16
4
78ball
FBGA
31.25mm
May’15
CS
8G x72
64GB
D(4Rx4)
DDP
x4 * 36pcs 8Gb B-die
4G
16
4
78ball
FBGA
31.25mm
Mar’15
CS
M386A8K40BM1
CPB
CRC
-5-
NOTE
May. 2015
Product Guide
DDR4 SDRAM Memory
4.3 288Pin DDR4 VLP Registered DIMM
288Pin DDR4 VLP Registered DIMM
Org.
Density
Part Number
2G x72
16GB M392A2G40DM0
2G x72
16GB
TBD
4G x72
32GB
M392A4K40BM0
Internal
Banks
Rank
PKG
Height
Avail.
DDP
x4 * 18pcs 4Gb D-die
2G
16
2
78ball
FBGA
18.75mm
MP
H(2Rx8)
1G x8 * 18pcs 8Gb B-die
16
2
78ball
FBGA
18.75mm
Oct’15
CS
J(2Rx4)
DDP
x4 * 18pcs 8Gb B-die
4G
16
2
78ball
FBGA
18.75mm
July’15
CS
Internal
Banks
Rank
PKG
Height
Avail.
Speed
Raw Card
CPB
J(2Rx4)
CPB
CRC
CPB
CRC
Composition
Comp.
Version
NOTE
4.4 260Pin DDR4 ECC SODIMM
260Pin DDR4 ECC SODIMM
Density
Part Number
Speed
1G x72
8GB
M474A1G43DB0
CPB
G(2Rx8) 512M x8 * 18pcs 4Gb D-die
16
2
78ball
FBGA
30mm
MP
1G x72
8GB
M474A1G43DB1
CRC
G(2Rx8) 512M x8 * 18pcs 4Gb D-die
16
2
78ball
FBGA
30mm
May’15
CS
2G x72
16GB
M474A2K43BB1
G(2Rx8)
16
2
78ball
FBGA
30mm
Mar’15
CS
CPB
CRC
Raw Card
Composition
Comp.
Version
Org.
1G x8 * 18pcs 8Gb B-die
NOTE
4.5 260Pin DDR4 Non ECC SODIMM
260Pin DDR4 Non ECC SODIMM
Org.
Density
Part Number
Speed
Raw Card
Composition
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
512M x64
4GB
M471A5143DB0
CPB
A(1Rx8)
512M x8 * 8pcs
4Gb D-die
16
1
78ball
FBGA
30mm
MP
512M x64
4GB
M471A5143EB0
A(1Rx8)
512M x8 * 8pcs
4Gb E-die
16
1
78ball
FBGA
30mm
July’15
CS
1G x64
8GB
M471A1G43DB0
E(2Rx8)
512M x8 * 16pcs 4Gb D-die
16
2
78ball
FBGA
30mm
MP
1G x64
8GB
M471A1K43BB0
2G x64
16GB
M471A2K43BB1
CPB
CRC
CPB
CPB
CRC
CPB
CRC
A(1Rx8)
1G x8 * 8pcs
8Gb B-die
16
1
78ball
FBGA
30mm
July’15
CS
E(2Rx8)
1G x8 * 16pcs 8Gb B-die
16
2
78ball
FBGA
30mm
MP
NOTE
4.6 288Pin DDR4 ECC UDIMM
288Pin DDR4 ECC UDIMM
Internal
Banks
Rank
PKG
Height
Avail.
512M x8 * 18pcs 4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
E(2Rx8)
512M x8 * 18pcs 4Gb D-die
16
2
78ball
FBGA
31.25mm
Mar’15
CS
E(2Rx8)
1G x8 * 18pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
Mar’15
CS
Org.
Density
Part Number
Speed
Raw Card
1G x72
8GB
M391A1G43DB0
CPB
E(2Rx8)
1G x72
8GB
M391A1G43DB1
CRC
2G x72
16GB
M391A2K43BB1
CPB
CRC
Composition
-6-
Comp.
Version
NOTE
May. 2015
Product Guide
DDR4 SDRAM Memory
4.7 288Pin DDR4 Non ECC UDIMM
280Pin DDR4 Non ECC UDIMM
Org.
Density
Part Number
Speed
Raw Card
Composition
Comp.
Version
Internal
Banks
Rank
PKG
Height
Avail.
512M x64
4GB
M378A5143DB0
CPB
A(1Rx8)
512M x8 * 8pcs
4Gb D-die
16
1
78ball
FBGA
31.25mm
MP
512M x64
4GB
M378A5143EB1
A(1Rx8)
512M x8 * 8pcs
4Gb E-die
16
1
78ball
FBGA
31.25mm
July’15
CS
1G x64
8GB
M378A1G43DB0
B(2Rx8)
512M x8 * 16pcs 4Gb D-die
16
2
78ball
FBGA
31.25mm
MP
1G x64
8GB
M378A1K43BB1
A(1Rx8)
512M x8 * 8pcs
8Gb B-die
16
1
78ball
FBGA
31.25mm
July’15
CS
2G x64
16GB
M378A2K43BB1
1G x8 * 16pcs 8Gb B-die
16
2
78ball
FBGA
31.25mm
MP
CPB
CRC
CPB
CPB
CRC
CPB
CRC
B(2Rx8)
-7-
NOTE
May. 2015
Product Guide
DDR4 SDRAM Memory
5. RDIMM, LRDIMM Memory Buffer Information
5.1 Label Example
2
1
3
4
5
6
7 8 9 10
11 12
32GB 4 1Rx4 PC4 -2133P -LD0-10-&##
Made in Korea
M386A4G40DM0-CPB
1344
5.2 JEDEC Description Information
1. Module total capacity, in gigabytes, for primary bus (ECC not counted)
2. Number of package ranks of memory installed and number of logical ranks per package rank
3. Device organization (data bit width) of SDRAMs used on this assembly
4. SDRAM and support component supply voltage (VDD)
blank = 1.2 V operable
5. Module speed in Mb/s/data pin
6. SDRAM speed grade
7. Module Type
E = Unbuffered DIMM ("UDIMM"), x64 primary + 8 bit ECC module data bus
L = Load Reduced DIMM (“LRDIMM”), x64 primary + 8 bit ECC module data bus
R = Registered DIMM ("RDIMM"), x64 primary + 8 bit ECC module data bus
S = Small Outline DIMM ("SO-DIMM"), no ECC (x64 bit module data bus)
U = Unbuffered DIMM ("UDIMM"), no ECC (x64 bit module data bus)
T = Unbuffered 72-bit small outline DIMM ("72b-SO-DIMM"), x64 primary + 8bit ECC module data bus
8. Reference design file used for this design (if applicable)
A = Reference design for raw card ’A’ is used for this assembly
B = Reference design for raw card ’B’ is used for this assembly
AC = Reference design for raw card ’AC’ is used for this assembly (example only)
ZZ = None of the JEDEC standard reference designs were used for this assembly
9. Revision number of the reference design used
0 = Initial release
1 = First revision
2 = Second revision
P = Pre-release or Engineering sample
Z = To be used when reference raw card = ZZ
10. JEDEC SPD Revision Encoding and Additions level used on this DIMM
5.3 RCD (& Data Buffer) Information
(These codes are only used SAMSUNG, Not JEDEC)
11&12. RCD, Data Buffer Revision & Vendor used on this DIMM
Jedec desctription on label
Buffer Vendor
RCD ver
DB ver (Only LRDIMM)
DC0
IDT
C0
B1
MB1
Montage
B1
A1
MC0
Montage
C0
B0
DC3
IDT
C0
A3
P20
Inphi
GS02
GS01
-8-
May. 2015
Product Guide
DDR4 SDRAM Memory
6. Package Dimension
1.60
#A1 INDEX MARK
3.20
#A1
0.80 x12 = 9.60
4.80
0.80
0.80
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
7.50 0.10
B
9 8 7 6 5 4 3 2 1
11.00  0.10
0.80
(Datum A)
A
11.00  0.10
7.50 0.10
0.80 x 8 6.40
0.10MAX
78ball FPGA for 4Gb D-die (x4/x8)/DDP 8Gb D-die (x4)/4H 16Gb D-die (x4)/4Gb E-die (x4/x8)/ 8Gb Bdie (x4/x8)/DDP 16Gb B-die (x4)/2H 16Gb B-die (x4)/4H 32Gb B-die (x4)
0.37 0.05
78 - Æ0.48 Solder ball
(Post Reflow Æ0.50 ± 0.05)
1.10 0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
-9-
May. 2015
Product Guide
DDR4 SDRAM Memory
7. Module Dimension
x72 288pin DDR4 SDRAM RDIMM
x72 288pin DDR4 SDRAM LRDIMM
x72 288pin DDR4 SDRAM ECC UDIMM
x64 288pin DDR4 SDRAM Non ECC UDIMM
Units : Millimeters
Max 3.9
64.60
56.10
31.25
17.60
30.75
133.35
1.4 ± 0.10
3.35
126.65
4.30
C
A
E
D
3.85 ± 0.10
B
1.50 ± 0.05
0.85
Detail B,E
9.35
10.20
2.1
2.6
2.6
0.25
Detail A
2.1
B : 2.1
E : 2.6
0.6 ± 0.03
9.35
10.20
Detail C
Detail D
- 10 -
May. 2015
Product Guide
DDR4 SDRAM Memory
x72 260pin DDR4 SDRAM ECC SODIMM
x64 260pin DDR4 SDRAM Non ECC SODIMM
Units : Millimeters
69.60
Max 3.7
30.00
65.60
1.2 ± 0.10
A
35.50
B
28.50
1.375
0.35 ± 0.03
0.50
4.00 ± 0.10
2.55
1.00 ± 0.05
0.30 MAX
Detail A
Detail B
- 11 -
May. 2015
Product Guide
DDR4 SDRAM Memory
x72 288pin DDR4 VLP Registered DIMM
Units : Millimeters
Max 3.9
64.60
18.75
18.25
133.35
1.4 ± 0.10
56.10
126.65
4.30
A
C
E
D
B
3.85 ± 0.10
1.50 ± 0.05
0.85
Detail B,E
9.35
10.20
Detail C
- 12 -
2.6
2.6
2.1
B : 2.1
E : 2.6
0.25
2.1
Detail A
0.6 ± 0.03
9.35
10.20
Detail D
May. 2015
Product Guide
DDR4 SDRAM Memory
VLP Registered DIMM Heat Spreader Design Guide (DDP)
1. FRONT
127 ± 0.12
50.81
50.81
21.49
21.49
0.4
9.9
13.6
8.9
0.8 ± 0.05
0.4
Caution
"Hot surface"
63.68
2. BACK
127 ± 0.12
50.81
50.81
21.49
21.49
9.9
13.6
8.9
"Hot surface"
3. CLIP
35.82 ± 0.12
3.80
+0.5
-0.8
9.3 ± 0.12
6.8 ± 0.1
- 13 -
May. 2015
Product Guide
DDR4 SDRAM Memory
TSV Registered DIMM Heat Spreader Design Guide
1. FRONT PART
133.15 +0.40
-0.20
130.45 ± 0.2
5.785
17.02
6.075
4.35
25.75
31.1
2 ± 0.1
2.6 ± 0.2
127
2. BACK PART
3. CLIP PART
39.3 ± 0.2
19.25 ± 0.12
7 ± 0.12
R4
Clip open size
3.2 ± 0.6
- 14 -
May. 2015
Product Guide
DDR4 SDRAM Memory
LRDIMM Heat Spreader Design Guide
1. FRONT PART
133.15 +0.40
-0.20
18.6 ± 0.25
25.75 ± 0.2
130.45 ± 0.2
0.6 ± 0.1
2.8 ± 0.2
127 ± 0.25
2. BACK PART
3. CLIP PART
39.3 ± 0.2
19.25 ± 0.12
7 ± 0.12
Clip open size
3.2 ± 0.6
- 15 -