F-215 (Rev 28AUG15) TPAF–M–H–H–H–0–S–2 TPAF–D–H–0–S–2 (1.50 mm) .059" X (1.75 mm) .069" TPAF SERIES HIGH SPEED ELEVATED ARRAY RECEPTACLE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?TPAF Insulator Material: Black LCP (TPAF-M) Gray LCP (TPAF-D) Contact Material: Copper Alloy Ground Plane: Copper Alloy Operating Temp Range: -55°C to +125°C Plating: Au or Sn over 50 µ" (1.27 µm) Ni Working Voltage: 165 VAC / 230 VAC RoHS Compliant: Yes Lead-Free Solderable: Yes High speed differential pair Mates with: TPAR APPLICATION TPAF-D TPAR TPAF/TPAR Rated @ 3dB Insertion Loss* Differential Pair Signaling 13.5 GHz / 27 Gbps *Test board losses de-embedded from performance data. Complete test data available at www.samtec.com?TPAF or contact [email protected] TPAF-M SIGNAL MAPPING BODY KEY TPAF G G S G G S G S G S G S G S G S G S G S G S MOD 1 MOD 3 PLATING OPTION 0 SOLDER TYPE OPTION –2 –TY S S G –S S G S G S For complete signal mapping, see www.samtec.com?TPAF or contact Samtec. –D –H = Detachable = High Speed Differential Pair –M = Mounting MODULE 1 ROWS 01 MODULES PAIRS A 1 50 2 100 (21.00) .827 (38.50) 1.516 (56.00) 2.205 3 MOD 2 G G G BGA (solder ball) technology Low profile keeps thermal mass low for reflow processing 150 –H –H = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on solder tail = High Speed = High Speed Differential Pair Differential (Leave blank for Pair (Leave blank module 1 or 2 only) for module 1 only) MODULE 2 10 11 MODULE 3 20 21 30 (1.50) .059 (15.00) .591 (19.20) .756 (0.75) .030 A Notes: Entire system requires TPAF-D, TPAF-M and TPAR. (6.20) .244 Tape and reel is standard packaging (0.88) .034 Dual source for Hirose IT5. Some sizes, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. (1.75) .069 = Lead-Free Tin Alloy = Tray TPAR–H–H–H–35–S F-215 (Rev 28AUG15) TPAR–H–35–S (1.50 mm) .059" X (1.75 mm) .069" TPAR SERIES HIGH SPEED ELEVATED ARRAY RISER SPECIFICATIONS Elevated stack heights allow better system air flow Mates with: TPAF-D, TPAF-M For complete specifications and recommended PCB layouts see www.samtec.com?TPAR Insulator Material: LCP Contact Material: Copper Alloy Operating Temp Range: -55°C to +125°C Plating: Au over 50 µ" (1.27 µm) Ni Working Voltage: 165 VAC / 230 VAC RoHS Compliant: Yes Lead-Free Solderable: Yes WAFER DESIGN Cutaway shown for clarity 35 mm standard mated height achieved when mated with TPAF-M and TPAF-D ALSO AVAILABLE (MOQ Required) • 18 to 40 mm mated heights Contact Samtec. TPAR MODULE 1 MODULE 2 TOOLING • Installation Cap: CAT-PT-TPAR-X TPAF/TPAR Rated @ 3dB Insertion Loss* Differential Pair Signaling 13.5 GHz / 27 Gbps *Test board losses de-embedded from performance data. Complete test data available at www.samtec.com?TPAR or contact [email protected] Polarity-swapping technology greatly reduces crosstalk in 100Ω, differential applications. –H = Helical Crosstalk Cancellation MODULE 1 ROWS 01 –H –H = Helical Crosstalk Cancellation (Leave blank for module 1 only) = Helical Crosstalk Cancellation (Leave blank for module 1 or 2 only) MODULE 2 10 11 MODULE 3 LEAD STYLE PLATING OPTION –35 = 30 µ" (0.76 µm) Gold on contact area –S = 35 mm MODULE 3 20 21 30 (19.50) .768 (21.00) .827 • Removal al Tool: CAT-EX-TPAR-X X TPAR X MATED HEIGHT A PAIRS A 1 50 2 100 3 150 (24.00) .945 (41.50) 1.634 (59.00) 2.323 MODULES TPAF-D TPAR (33.80) 1.33 Notes: Entire system requires TPAF-D, TPAF-M and TPAR. 35 mm MATED HEIGHT Tray is standard packaging Dual source for Hirose IT5. TPAF-M Some sizes, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice.