SEAMP–20–02.0–L–06 F-215 SEAMI–50–11.0–L–10–2–A–K–TR Press fit tails (1,27 mm) .050" SEAMP, SEAMI SERIES HIGH SPEED/HIGH DENSITY OPEN PIN FIELD Mates with: SEAF, SEAF-RA-GP NO. OF POSITIONS PER ROW SEAMP SPECIFICATIONS PLATING OPTION 02.0 For complete specifications and recommended PCB layouts see www.samtec.com?SEAMP SEAMP Insulator Material: Natural LCP Contact Material: Copper Alloy Operating Temp Range: -55°C to +125°C Current Rating: 2.5 A per pin (6 adjacent pins powered) Plating: Au or Sn over 50 µ" (1,27 µm) Ni Contact Resistance: 8.7 mΩ Working Voltage: 215 VAC RoHS Compliant: Yes NO. OF ROWS RECOGNITIONS –10 For complete scope of recognitions see www.samtec.com/quality –10, – 20, – 30, –40, –50 = Press Fit –04 –06 –08 No. of positions x (1,27) .050 + (5,18) .204 A B (7,06) .278 (9,60) .378 (12,14) .478 (14,68) .578 (2,54) .100 (2,54) .100 (5,08) .200 (7,62) .300 MATED HEIGHTS* SEAMP SEAF LEAD STYLE LEAD STYLE –05.0 –06.0 –06.5 –02.0 7 mm 8 mm 8.5 mm Note: Compliant pin fixture *Processing conditions will affect mated height. CAT-SEAMP-XX-XX. Patent Pending. Mates with: SEAF A SPECIFICATIONS B (1,27) .050 (1,23) .048 (0,59) .023 No. of positions x (1,27) .050 - (1,27) .050 PLATING OPTION 11.0 For complete specifications and recommended PCB layouts see www.samtec.com?SEAMI Insulator Material: Black LCP Contact Material: Copper Alloy Operating Temp Range: Testing Now! Plating: NO. OF Au or Sn over ROWS 50 µ" (1,27 µm) Ni –08 Contact Resistance: –10 Testing Now! Working Voltage: Testing Now! RoHS Compliant: Yes Lead-Free Solderable: Yes –L = 10 µ" (0,25 µm) Gold on contact area, Matte Tin on solder tail –40, –50 SEAMI = 85Ω tuned A B (13,41) .528 (15,95) .628 (5,08) .200 (7,62) .300 01 No. of positions x (1,27) .050 + (4,98) .196 –S A B = 30 µ" (0,76 µm) Gold on contact area, Matte Tin on solder tail 08 ALSO AVAILABLE (MOQ Required) • Other plating options • 20 & 30 pins per row • 04 & 06 rows Contact Samtec. Note: Patented Note: Some sizes, styles and options are non-standard, non-returnable. –L – 04 – GP = Four Rows = Guide Post (Mates with SEAF-RAGP only) – 06 = Six Rows – 08 = 30 µ" (0,76 µm) Gold on contact area, Matte Tin on tail (1,12) .044 DIA (1,27) .050 (0,86) No. of positions x .034 (1,27) .050 + (3,58) .141 – TR = Eight Rows = Tape & Reel – 10 = Ten Rows SEAMP/SEAF-RA Rated @ 3dB Insertion Loss* Single-Ended Signaling 11 GHz / 22 Gbps 11 GHz / 22 Gbps (4,60) Differential Pair Signaling .181 *Test board losses de-embedded from performance data. Complete test data available at www.samtec.com?SEAMP or contact [email protected] Processing: Application tooling and one ton (1,78) minimum press required. Contact [email protected] .070 for more information. NO. OF ROWS SOLDER TYPE – 08 = Tin/Lead Alloy Solder Charge A K –1 =Eight Rows – 10 =Ten Rows –2 = Lead-Free Solder Charge SEAMI/SEAF Rated @ 3dB Insertion Loss* 16 mm Stack Height Single-Ended Signaling 14 GHz / 28 Gbps Differential Pair Signaling 16.5 GHz / 33 Gbps *Test board losses de-embedded from performance data. Complete test data available at www.samtec.com?SEAMI or contact [email protected] WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. TR –A = Alignment Pins –K = Polyimide film Pick & Place Pad – TR =Tape & Reel MATED HEIGHTS* SEAMI SEAF LEAD STYLE LEAD STYLE –05.0 –06.0 –06.5 –11.0 16 mm 17 mm 17.5 mm *Processing conditions will affect mated height. (14,66) .577 OPTION = 10 µ" (0,25 µm) Gold on contact area, Matte Tin on tail –S NO. PINS PER ROW SEAMI NO. OF ROWS