TDM3051 Random Phase Switching 600V Triac Driver Description Features The TDM3051 consists of a GaAs LED optically coupled to a Random Phase photo-sensitive Triac Driver chip. The miniature 4 pin SOP package provides high input-to-output isolation and drives high powered triacs while using very little board space. Typical uses include interfacing logic level control signals to equipment powered from 110VAC to 240VAC lines. The TDM3051 comes standard in a miniature 4 pin SOP package. Ultra Miniature 4-Pin Small Outline Package Random Phase Switching 600V Blocking Voltage Low Trigger Current (15mA MAX) High Input-to-Output Isolation (3.75kVRMS) Long Life / High Reliability RoHS / Pb-Free / REACH Compliant Agency Approvals UL / C-UL: VDE: Applications Home Appliances Motor / Drive Controls Solid State Relays High Power Triacs Dimmer Controls Absolute Maximum Ratings The values indicated are absolute stress ratings. Functional operation of the device is not implied at these or any conditions in excess of those defined in electrical characteristics section of this document. Exposure to absolute Maximum Ratings may cause permanent damage to the device and may adversely affect reliability. Schematic Diagram (+) Input (-) Input 1 2 File # E201932 File # 40035191 (EN 60747-5-2) Random Phase Circuit 4 (+/- Load) 3 (-/+) Load Storage Temperature …………………………..-55 to +125°C Operating Temperature …….………...………-40 to +100°C Continuous Input Current ………………………………..50mA Transient Input Current ………………….……………..500mA Reverse Input Control Voltage …………..…………………5V Input Power Dissipation …………………………………70mW Total Power Dissipation ……………………………..170mW Solder Temperature – Wave (10sec)……………….….260°C Solder Temperature – IR Reflow (10sec)….…………..260°C Ordering Information Part Number TDM3051 TDM3051-TR TDM3051 Description 4 pin SOP, (100/Tube) 4 pin SOP, Tape and Reel (2000/Reel) NOTES: Suffixes listed above are not included in marking on device for part number identification © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 1 of 8 TDM3051 /TR Rev 2.00 (11/12/2013) 001686 TDM3051 Random Phase Switching 600V Triac Driver Electrical Characteristics, TA = 25°C (unless otherwise specified) Parameter Symbol Min. Typ. Max. 1.8 Units Test Conditions Input Specifications LED Forward Voltage LED Reverse Voltage VF - 1.4 V IF = 10mA BVR 5 - - V IR = 10μA IInRleak - - 10 A VR = 5μA IFT - - 15 mA Main Terminal Voltage = 3V Blocking Voltage VDRM 600 - - V Peak Blocking Current IDRM1 - 10 100 nA VDRM = 600 IO - - 70 mA IF = 15mA On-State Voltage VON - 2 3 V IF = 15mA, ITM = 70mA Leakage Current IDRM2 - 0.2 1 A IF=0mA, VDRM = 600V Holding Current IHOLD - 250 - A - dV/dt 1,000 1,500 - V/S - VISO 3,750 - - VRMS RH ≤ 50%, t=1min - Reverse Leakage Current Trigger Current 1 Output Specifications Continuous Load Current Critical Rate of Rise 2 IO = 1A Isolation Specifications Isolation Voltage Input-Output Resistance RI-O - 10 12 Note 1: Resistive load. For inductive loads, higher drive current is recommended Note 2: This is for static dV/dt. Test Circuit Below VI-O = 500VDC TDM3051 Static dV/dt Test Circuit: © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 2 of 8 TDM3051 /TR Rev 2.00 (11/12/2013) 001686 TDM3051 Random Phase Switching 600V Triac Driver TDM3051 Performance & Characteristics Plots, TA = 25°C (unless otherwise specified) Figure 1: Maximum Load Current vs. Temperature Figure 3: On State Characteristics Figure 4: Peak Blocking Current (IDRM1) vs. Temperature (°C) Figure 5: Trigger Current (IFT) vs. Temperature (°C) © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 3 of 8 TDM3051 /TR Rev 2.00 (11/12/2013) 001686 TDM3051 Random Phase Switching 600V Triac Driver TDM3051 Solder Reflow Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: G F D E H B A C Process Step A B C D E F G H Description Preheat Start Temperature (ºC) Preheat Finish Temperature (ºC) Preheat Time (s) Melting Temperature (ºC) Time above Melting Temperature (s) Peak Temperature, at Terminal (ºC) Dwell Time at Peak Temperature (s) Cool-down (ºC/s) Parameter 150ºC 180ºC 90 - 120s 230ºC 30s 260ºC 10s <6ºC/s (2) Wave Solder: Maximum Temperature: Maximum Time: Pre-heating: Single Occurrence 260ºC (at terminal) 10s 100 - 150ºC (30 - 90s) (3) Hand Solder: Maximum Temperature: Maximum Time: Single Occurrence © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 350ºC 3s (at tip of soldering iron) Page 4 of 8 TDM3051 /TR Rev 2.00 (11/12/2013) 001686 TDM3051 Random Phase Switching 600V Triac Driver TDM3051 Package Dimensions 4 PIN SOP Package Note: All dimensions in millimeters [mm] 4 PIN SOP Footprint © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 5 of 8 TDM3051 /TR Rev 2.00 (11/12/2013) 001686 TDM3051 Random Phase Switching 600V Triac Driver TDM3051 Packaging Specifications Tape & Reel Specifications (T&R) Specification Note: Symbol All dimensions in millimeters [mm] Dimensions, mm ( inches ) Tape Width W 12 0.3 ( 0.47 ) Sprocket Hole Pitch P0 4 0.1 ( 0.15 ) Compartment Location F P2 5.5 0.1 ( 0.217 ) 2 0.1 ( 0.079 ) Compartment Pitch P1 8 0.1 ( 0.315 ) © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 6 of 8 TDM3051 /TR Rev 2.00 (11/12/2013) 001686 TDM3051 Random Phase Switching 600V Triac Driver TDM3051 Packaging Specifications Tape & Reel Specifications (T&R) © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Note: Page 7 of 8 All dimensions in millimeters [mm TDM3051 /TR Rev 2.00 (11/12/2013) 001686 TDM3051 Random Phase Switching 600V Triac Driver TDM3051 Package Marking TDM3051 Package Weights Single Unit Full Tube (100pcs) Full Pouch (10 tubes) TDM3051 0.10 23 240 - TDM3051-TR 0.10 - - 500 Device Note: Full Reel (2000pcs) All weights above are in GRAMS, and include packaging materials where applicable DISCLAIMER Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. LIFE SUPPORT POLICY SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 8 of 8 TDM3051 /TR Rev 2.00 (11/12/2013) 001686