MAAM71100
GaAs MMIC Power Amplifier
7.0 - 11.0 GHz
Rev. V6
Features
Die
+31 dBm Typical Saturated Power
18 dB Typical Gain
30% Typical Power Added Efficiency
On-Chip Bias Network
DC Decoupled RF Input and Output
Description
The MAAM71100 is a GaAs MMIC two stage high
efficiency power amplifier. The MAAM71100 is a
fully monolithic design for operation in 50 Ω
systems, with an on-chip negative bias network
which eliminates the need for external bias circuitry.
Ordering Information 1
Schematic
Part Number
Package
MAAM71100
Die
A
B
C
D
E
G2
G1
GND
D1
G2
GND
D2
1. Die quantity varies.
RF IN
RF OUT
Absolute Maximum Ratings 2
Parameter
Absolute Maximum
VDD
+10 V
VGG
-5 V
Input Power
+23 dBm
Operating Channel
Temperature
+150°C
Storage Temperature
-65°C to +150°C
G2
A
B
C
D
G1
GND
D1
G2
GND
D2
E
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM71100
GaAs MMIC Power Amplifier
7.0 - 11.0 GHz
Rev. V6
Electrical Specifications: TA = 25°C, Z0 = 50 Ω, VDD = +8 V, VGG = -1.2 V Typ
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Gain
—
dB
14
18
—
Input VSWR
Output VSWR
—
Ratio
Ratio
—
—
2.0:1
4.5:1
—
—
Saturated Power Output
Input Power = +18 dBm
dBm
—
+31
—
Output Power at 1 dB Gain Compression
—
dBm
—
+28
—
Third Order Intercept
—
dBm
—
+38
—
Reverse Isolation
—
dB
—
30
—
Bias Current
IDSQ (No RF)
IDD Pin = +18 dBm
mA
mA
—
—
520
750
—
—
Thermal Resistance
—
°C/W
—
12
—
Typical Performance Curves
Linear Gain and Input Return Loss vs. Frequency
25
Output Power and Power added efficiency vs.
Frequency @ Pin = +18 dBm
-5
34
20
-10
32
15
-15
30
-20
28
-25
26
-30
24
60
S21
S11
10
5
0
6
7
8
9
10
11
12
Frequency (GHz)
50
Pout
40
30
PAE
20
10
6
7
8
9
10
11
12
Frequency (GHz)
Output Power and Power added efficiency vs.
Input Power @ 9 GHz
34
50
30
40
Pout
26
30
22
20
PAE (%)
18
10
14
0
0
4
8
12
16
20
Pin (dBm)
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM71100
GaAs MMIC Power Amplifier
7.0 - 11.0 GHz
Handling Procedures
Permanent damage to the MAAM71100 may occur
if the following precautions are not adhered to:
Rev. V6
Outline Drawing
A. Cleanliness - The MAAM71100 should be handled in a clean environment. DO NOT attempt
to clean assembly after the MAAM71100 is
installed.
B. Static Sensitivity - All die handling equipment
and personnel should comply with DOD-STD1686 Class I.
C. Transients - Avoid instrument and power supply transients while bias is connected to the
MAAM71100. Use shielded signal and bias
cables to minimize inductive pick-up.
D. General Handling - DO NOT touch the surface
of the die.
It is recommended that the
MAAM71100 die be handled along the long
side with a sharp pair of tweezers.
Mounting
The MAAM71100 is back-metallized with Pd/Ni/Au
(100/1, 000/30,000Å) metallization. It is recommended that the die be mounted with Au/Sn eutectic preforms. The attachment surface should be
clean and flat.
A. An 80/20 preform is recommended with a work
surface temperature of approximately 255°C
and a tool temperature of 265°C. When hot
90/5 nitrogen/hydrogen gas is applied, solder
temperature should be approximately 290°C.
B. DO NOT expose the MAAM71100 to a temperature greater than 320°C for more than 20
seconds. No more than 3 seconds of scrubbing should be required for attachment.
Typical Bias Configuration 3,4,5
VDD
(VD1, VD2)
1000 pF Min.
RF OUT
RF IN
Bonding
A. Ball or wedge bond with 1.0 mil diameter gold
wire of 3.0 mil x 0.5 mil ribbon. Thermosonic
bonding with a nominal stage temperature of
150°C and a ball bonding force of 40 to 50
grams or wedge bonding force of 18 to 22
grams is recommended. Ultrasonic energy and
time should be adjusted to the minimum levels
necessary to achieve reliable bonds.
B. Bonds should be started on the die and terminated on the package.
C. Bonding pads are 4.0 x 4.0 mils minimum.
VGG
(VG1, VG2)
3. Nominal bias is obtained by first connecting -1.2 volts to pads
VG1 and VG2 followed by connecting +8 volts to pads VD1 and
VD2
(note sequence).
4. The recommended VDD range is +6 to +9 volts.
5. Optional on-chip resistor networks are used by connecting a
nominal –5 volts to pad ―A‖ and connecting pad ―B‖, ―C‖, ―D‖,
or ―E‖ to pad VG1; and VG2.
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM71100
GaAs MMIC Power Amplifier
7.0 - 11.0 GHz
Rev. V6
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support