MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Functional Schematic
Features
Rev. V4
Single or Dual Bias Control
Easily Cascadable
Small Size
Attenuation Flatness DC - 12 GHz ± 0.2 dB
Low Control Current Consumption
Low Phase Shift
Up to 20 dB Matched Attenuation with Dual Bias
RoHS* Compliant
J1
J2
Description
The MAAA2000G is a broadband GaAs MESFET
MMIC voltage variable absorptive attenuator. Typical
applications are for WLAN IEEE 802.11a+b/g,
WiMAX IEEE 802.16, and MIMO. Other applications
include test equipment requiring ultra fast switching
speed.
VB VA
Ordering Information
The MAAA2000G is fabricated using a 1.0 micro gate
length GaAs MESFET process. The process features
full chip passivation for increased performance and
reliability.
Part Number
Package
MAAA2000G
DIE 1
1. Die quantity varies.
Electrical Specifications: 0/-5 Vdc, 50 , -55°C to +85°C
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Insertion Loss 2
DC - 1.0 GHz
DC - 2.0 GHz
DC - 12.0 GHz
dB
—
—
—
—
—
—
1.2
1.4
1.5
VSWR
DC - 1.0 GHz
DC - 2.0 GHz
DC - 12.0 GHz
Ratio
—
—
—
—
—
—
1.5:1
1.5:1
1.8:1
Relative Attenuation
(Matched)
(Reflective)
(Matched)
DC - 2.0 GHz
DC - 2.0 GHz
2.0 - 12.0 GHz
dB
23
40
12
—
—
—
—
—
—
Trise, Tfall
10% to 90% RF, 90% to 10% RF
ns
—
7
—
Ton, Toff
50% Control to 90% RF, 50% Control to 10% RF
ns
—
10
—
Transients
In-band
mV
—
20
—
Input 1 dB Compression
0.5 - 4.0 GHz
dBm
—
15
—
VIN Low
0 to -0.2 V
µA
—
—
9
VIN High
-5 V
µA
—
50
100
2. Loss changes 0.00025 dB/°C (-55°C to +85°C.)
1
*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Rev. V4
Typical Performance Curves @ 25°C
Insertion Loss
Isolation
55
2.0
45
1.5
35
1.0
25
0.5
0.0
15
0
2
4
6
8
10
12
5
0
2
4
6
8
10
12
Frequency (GHz)
Frequency (GHz)
VSWR
Attenuation @ 2 GHz
50
1.8
40
1.6
30
1.4
20
1.2
1.0
VB Series
VA Shunt
Matched Attn. below 23.5 dB
10
0
0
2
4
6
8
10
12
-5
-4
Attenuation @ 12 GHz
-2
-1
0
Absolute Maximum Ratings 3,4
14
12
-3
Gate Voltage
Frequency (GHz)
VB Series
VA Shunt
10
8
Parameter
Absolute Maximum
Control Voltage
-8.5 VDC
Input RF Power
(500 MHz - 12 GHz)
+34 dBm
Storage Temperature
-65°C to +175°C
Operating Temperature
+175°C
6
4
2
0
-5
-4
-3
-2
Gate Voltage
-1
0
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. M/A-COM Technology Solutions does not recommend
sustained operation near these survivability limits.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Rev. V4
Handling Procedures
Permanent damage to the MAAA2000G may occur if the following precautions are not adhered to:
A. Cleanliness - The MAAA2000G should be handled in a clean environment. DO NOT attempt to clean
assembly after the MAAA2000G is installed.
B. Static Sensitivity - All die handling equipment and personnel should be DC grounded.
C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAA2000G. Use
shielded signal and bias cables to minimize inductive pick-up.
D. Bias - Apply voltage to either control port A1/B2 or A2/B1 only when the other is grounded. Neither port
should be allowed to “float”.
E. General Handling - It is recommended that the MAAA2000G chip be handled along the long side of the die
with a sharp pair of bend tweezers. DO NOT touch the surface of the chip with fingers or tweezers.
Mounting
The MAAA2000G is back-metallized with Pd/Ni/Au (100/1,000/10,000Å) metallization. It can be die-mounted
using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat
before attachment.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255°C and a
tool temperature of 265°C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be
approximately 290°C.
B. DO NOT expose the MAAA2000G to a temperature greater than 320°C for more than 20 seconds. No more
than 3 seconds of scrubbing should be required for attachment.
Epoxy Die Attach:
A. Apply a minimum amount of epoxy and place the MAAA2000G into position. A thin epoxy fillet should be
visible around the perimeter of the die.
B. Cure epoxy per manufacturer’s recommended schedule.
C. Electrically conductive epoxy is recommended but is not required.
Bonding
A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermosonic bonding with a nominal stage
temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to
achieve reliable wirebonds.
B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as
possible; at least three and no more than four bond wires from ground pads to package are recommended.
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Rev. V4
M/A-COM Technology Solutions Inc. All rights reserved.
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4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support