MADA2030G
5-Bit GaAs Digital Attenuator
DC- 2.0 GHz
Rev. V3
Features
Die
Attenuation 0.5-dB Steps to 15.5 dB
Temperature Stability: ± 0.1 dB from –55°C to
+85°C Typical
Fast Switching Speed: 3 nS Typical to 90%
Ultra Low DC Power Consumption
Description
M/A-COM’s MADA2030G is a 5-bit, 0.5-dB step
GaAs MMIC digital attenuator. The MADA2030G is
ideally suited for use where high accuracy, fast
switching, very low power consumption and low
intermodulation products are required at a low cost.
Typical applications include radio and cellular
equipment, wireless LANS, GPS equipment and
other gain/level control circuits.
The MADA2030G is fabricated with a monolithic
GaAs MMIC using a mature 1-micron process. The
process features full chip passivation for increased
performance and reliability.
Ordering Information
Part Number
Package
MADA2030G
DIE
Absolute Maximum Ratings 1,2
Parameter
Absolute Maximum
Input Power
500 MHz - 2 GHz
+34 dBm
Control Voltage
-8.5 VDC
Operating Temperature
+175°C
Storage Temperature
-65°C to +175°C
Bond Pad Dimensions
Bond Pad
Dimension Inches (mm)
RFIN, RFOUT
0.004 x 0.008 (0.100 x 0.200)
VC1, VC2, VC3,
VC3, VC4, VC4
VC5, VC5
0.004 x 0.004 (0.100 x 0.100)
GND1, GND2,
GND3
0.008 x 0.004 (0.200 x 0.100)
GND4
0.004 x 0.004 (0.100 x 0.100)
DIE Size
0.045 x 0.039 x 0.010 (1.14 x 0.99 x 0.25)
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
2. M/A-COM does not recommend sustained operation near
these survivability limits.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADA2030G
5-Bit GaAs Digital Attenuator
DC- 2.0 GHz
Rev. V3
Electrical Specifications: TA = 25°C, Z0 = 50
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Reference Insertion Loss
DC - 1.0 GHz
DC - 2.0 GHz
dB
dB
—
—
—
—
1.9
2.3
Attenuation Accuracy
DC - 2.0 GHz
± (0.3 dB ± 3% of attenuation setting in dB) dB
VSWR (Worst Case)
DC - 2.0 GHz
Ratio
—
—
1.6:1
Phase Balance
(For any bit or combinations of bits per unit)
500 MHz
1.0 GHz
2.0 GHz
°
°
°
—
—
—
+1 / -2
+2 / -3
+4 / -6
—
—
—
Switching Characteristics
50% Control to 90% RF, 50% Control to 10% RF
Unfiltered Transients
nS
mV
—
—
3
7
—
—
Input Power for
1 dB Compression
100 MHz
Above 500 MHz
dBm
dBm
—
—
24
27
—
—
IP2
for two-tone input power up to +5 dBm
100 MHz
Above 500 MHz
dBm
dBm
—
—
45
68
—
—
IP3
for two-tone input power up to +5 dBm
100 MHz
Above 500 MHz
dBm
dBm
—
—
40
45
—
—
Control Voltages
(Complementary Logic)
VIN Low, 0 to -0.2 V
VIN Hi, -5 V
VIN Hi, -8 V
µA
µA
µA
—
—
—
—
75
—
5
—
250
Truth Table3
Handling Procedures
VC1 VC2 VC3 VC3 VC4 VC4 VC5 VC5
Attenuation
Setting
1
1
1
0
1
0
1
0
Reference
0
1
1
0
1
0
1
0
0.5 dB
1
0
1
0
1
0
1
0
1 dB
1
1
0
1
1
0
1
0
2 dB
1
1
1
0
0
1
1
0
4 dB
1
1
1
0
1
0
0
1
8 dB
0
0
0
1
0
1
0
1
15.5 dB
3.
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
0 = VIN Low, 0 to -0.2 V, 1 = VIN Hi, -5 V to -8 V
Schematic
RF
Input
0.5 dB
1 dB
VC1
VC2
2 dB
VC3
VC3
4 dB
VC4
VC4
8 dB
VC5
RF
Output
VC5
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADA2030G
5-Bit GaAs Digital Attenuator
DC- 2.0 GHz
Rev. V3
Typical Performance Curves
Attenuation
Insertion Loss
20
2.0
1.8
15
0.5 dB Bit
1 dB Bit
2 dB Bit
4 dB Bit
8 dB Bit
15.5 dB Bit
10
+25°C
+85°C
-55°C
1.6
1.4
5
1.2
0
0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
1.0
0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
Worst Case VSWR
1.8
1.6
1.4
1.2
+25°C
+85°C
-55°C
1.0
0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADA2030G
5-Bit GaAs Digital Attenuator
DC- 2.0 GHz
Rev. V3
Handling Procedures
Wire Bonding
Permanent damage to the MADA2030G may occur if the
following precautions are not adhered to:
A.
A.
B.
C.
D.
E.
Cleanliness - The MADA2030G should be handled in
a clean environment. DO NOT attempt to clean
after the MADA2030G is installed.
Static Sensitivity - All die handling equipment and
personnel should be DC grounded.
Transients - Avoid instrument and power supply
transients while bias is applied to the MADA2030G.
Use shielded signal and bias cables to minimize
inductive pick-up.
Bias - Apply voltage to either complementary control
ports only when the other is grounded. Neither port
should be allowed to ―float‖.
General Handling - It is recommended that the
MADA2030G chip be handled along the long side of
the die with a sharp pair of bent tweezers. DO NOT
touch the surface of the chip with fingers or
tweezers.
Ball or wedge bond with 1.0 mil diameter pure gold
wire. Thermosonic wire bonding with a nominal
stage temperature of 150°C and a ball bonding force
of 40 to 50 grams or wedge bonding force of 18 to
22 grams is recommended. Ultrasonic energy and
time should be adjusted to the minimum levels to
achieve reliable wirebonds.
B. Wirebonds should be started on the chip and
terminated on the package. GND bonds should be
as short as possible; at least three and no more than
four bond wires from ground pads to package are
recommended.
Mounting
The MADA2030G is back-metallized with Pd/Ni/Au
(100/1,000/10,000Å) metallization. It can be die-mounted
using Au/Sn eutectic preforms or a thermally conductive
epoxy. The package surface should be clean and flat
before attachment.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with a
work surface temperature of approximately 255°C
and a tool temperature of 265°C. When hot 90/10
nitrogen/hydrogen gas is applied, tool tip
temperature should be approximately 290°C.
B. DO NOT expose the MADA2030G to a temperature
greater than 320°C for more than 20 seconds. No
more than 3 seconds of scrubbing should be
required for attachment.
Epoxy Die Attach:
B Apply a minimum amount of epoxy and place the
MADA2030G into position. A thin epoxy fillet should
be visible around the perimeter of the die.
C Cure epoxy per manufacturer’s recommended
schedule.
D Electrically conductive epoxy may be used but is not
required.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADA2030G
5-Bit GaAs Digital Attenuator
DC- 2.0 GHz
Rev. V3
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
5
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support