H2A3-NW High Power single chip LED H2A3-NW is a high power white single chip LED in standard hexagonal Aluminum package for general application. Slots in the Aluminum-core PCB allow for easy mounting of standard collimating optics and are also suitable for M3 or M4 mounting screws. Large electrical interconnection pads on the PCB allow for convenient installation. Specifications • • • • • Structure: 3W high power chip Emitting Color: white color (6-8K) Optical Output: 150-170 lm Life Time: > 30.000 hours Lead free product - RoHS compliant Absolute Maximum Ratings (Ta=25°C) Parameter Power Dissipation, DC Forward Current, DC Pulsed Current (10% duty cycle, 100µs) Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (max. 1.5 s) Symbol PD IF IFP UR Topr Tstg Tsol Value 2.8 700 1400 -5 -30 … +85 -30 … +85 330 Unit W mA mA V °C °C °C Electro-Optical Characteristics (Ta=25°C) Parameter Forward Current Viewing Angle Luminous Flux Color Temperature Forward Voltage Symbol IF φ Φv UF Condition IF = 700 mA IF = 700 mA IF = 700 mA IF = 700 mA Min. 150 6000 3.2 Typ. 700 ± 60 - Max. 170 8000 4.0 Unit mA deg. lm K V Device Materials Item foundation Lens Electrodes PCB 09.04.2014 Material Plastic Acryl AgCu Al H2A3-NW 1/4 Outline Dimensions Emitter: Static Electricity LEDs are very sensitive to static Electricity and surge voltage. It is recommended to wear a wristband or an anti-electrostatic glove whenever handling the LEDs All devices, equipment, and machinery that is used when handling the LEDs must be grounded properly. Heat Generation It is advised to operate these LEDs at a reasonable low temperature for long lifetime and stability. High operating temperature will result in premature degradation and shortened lifetime. 09.04.2014 H2A3-NW 2/4 Soldering Conditions Reflow Soldering: H2A3 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use a reflow soldering process for array assembly! Hot Bar Soldering: A Hot Bar Soldering process is recommended when soldering H2A3 emitters. This process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. In order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: • • • Amount of flux Pressing force of solder tip Hot bar temperature For the standard assembly process, following parameters should be maintained: • • • Hot Bar temperature: 330 °C Force of Hot Bar. 40 N Soldering time: 1.5 s It is recommended to use a copper nickel-plated hot bar mounted to standard temperature controlled soldering equipment. Manual Hand Soldering: For prototype build or small series production runs, it is possible to place and solder the emitters by hand. It is therefore recommended to maintain the following parameters: • • • Solder Tip Temperature 330 °C Soldering time. < 1.5 s Junction temperature must be kept below 70 °C A visual inspection may be used to check the quality of the solder joint General Soldering Precautions: • • • 09.04.2014 Mechanical stress, shock and vibration must be avoided during soldering Only use non corrosive flux. Do not apply current to the device until it has cooled down to room temperature after soldering. H2A3-NW 3/4 Accessories Collimating optics, holders, reflectors polycarbonate optic + optic holder metalized polycarbonate reflector 09.04.2014 H2A3-NW 4/4