H2A3-NW

H2A3-NW
High Power single chip LED
H2A3-NW is a high power white single chip LED in standard hexagonal Aluminum package for general application.
Slots in the Aluminum-core PCB allow for easy mounting of standard collimating optics and are also suitable for M3 or
M4 mounting screws. Large electrical interconnection pads on the PCB allow for convenient installation.
Specifications
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Structure: 3W high power chip
Emitting Color: white color (6-8K)
Optical Output: 150-170 lm
Life Time: > 30.000 hours
Lead free product - RoHS compliant
Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Dissipation, DC
Forward Current, DC
Pulsed Current (10% duty cycle, 100µs)
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (max. 1.5 s)
Symbol
PD
IF
IFP
UR
Topr
Tstg
Tsol
Value
2.8
700
1400
-5
-30 … +85
-30 … +85
330
Unit
W
mA
mA
V
°C
°C
°C
Electro-Optical Characteristics (Ta=25°C)
Parameter
Forward Current
Viewing Angle
Luminous Flux
Color Temperature
Forward Voltage
Symbol
IF
φ
Φv
UF
Condition
IF = 700 mA
IF = 700 mA
IF = 700 mA
IF = 700 mA
Min.
150
6000
3.2
Typ.
700
± 60
-
Max.
170
8000
4.0
Unit
mA
deg.
lm
K
V
Device Materials
Item
foundation
Lens
Electrodes
PCB
09.04.2014
Material
Plastic
Acryl
AgCu
Al
H2A3-NW
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Outline Dimensions
Emitter:
Static Electricity
LEDs are very sensitive to static Electricity and surge voltage. It is recommended to wear a wristband or
an anti-electrostatic glove whenever handling the LEDs
All devices, equipment, and machinery that is used when handling the LEDs must be grounded
properly.
Heat Generation
It is advised to operate these LEDs at a reasonable low temperature for long lifetime and stability. High
operating temperature will result in premature degradation and shortened lifetime.
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Soldering Conditions
Reflow Soldering:
H2A3 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use a
reflow soldering process for array assembly!
Hot Bar Soldering:
A Hot Bar Soldering process is recommended when soldering H2A3 emitters. This process will
only transfer heat to the leads and avoids overheating the emitter which will damage the
device. In order to transfer sufficient heat from the hot bar to the device, following parameters
must be carefully considered:
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Amount of flux
Pressing force of solder tip
Hot bar temperature
For the standard assembly process, following parameters should be maintained:
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Hot Bar temperature: 330 °C
Force of Hot Bar. 40 N
Soldering time: 1.5 s
It is recommended to use a copper nickel-plated hot bar mounted to standard temperature
controlled soldering equipment.
Manual Hand Soldering:
For prototype build or small series production runs, it is possible to place and solder the
emitters by hand. It is therefore recommended to maintain the following parameters:
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Solder Tip Temperature 330 °C
Soldering time. < 1.5 s
Junction temperature must be kept below 70 °C
A visual inspection may be used to check the quality of the solder joint
General Soldering Precautions:
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09.04.2014
Mechanical stress, shock and vibration must be avoided during soldering
Only use non corrosive flux.
Do not apply current to the device until it has cooled down to room temperature after
soldering.
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Accessories
Collimating optics, holders, reflectors
polycarbonate optic + optic holder
metalized polycarbonate reflector
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