5RAA5111P TECHNICAL DATA Visible LED 5 mm AlGaInP Features Applications • • • • • • • • • • • • High Luminous LEDs 5mm Round Standard Directivity Long Lifetime Operation Superior Weather-resistance UV Resistant Epoxy Water Clear Type Traffic signal, Portable light source Singnage and Channel Letter Decorating and Entertainment Lighting Architectural Lighting Outdoor/Indoor Applications Backlighting Diretivity: Outline Dimension: PIN 1 2 Absolute Maximum Ratings (Ta=25°C) Item Power Dissipation Forward Current Pulse Forward Current * Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (5 sec.) Symbol PD IF IFP VR Topr Tstg Tsol Value 182 70 120 5 -30 … +85 -40 … +100 260 Unit mW mA mA V °C °C °C Function LED Anode LED Cathode Unit: mm Tolerance: ±0.3 mm * pulse width max. 10 ms, duty ratio max. 1/10 Specifications (Ta=25°C) Item Optical Specifications Luminous Intensity *1 Dominant Wavelength Viewing Angle Electrical Specifications Forward Voltage Reverse Voltage Condition Symbol Min. Typ. Max. Unit IF = 60 mA IF = 60 mA IF = 60 mA IV λD 2Θ1/2 60000 620 - 75000 625 15 630 - mcd nm deg IF = 60 mA UF = 5 V UF UR 2.0 - 2.2 - 2.6 10 V µA 1 * Tolerance of chromaticity coordinates is ±10% 2 * Tolerance of luminous intensity is ±15% 18.07.2011 5RAA5111P 1 of 3 Typical Performance Curves Precaution for Use 1. Cautions • DO NOT look directly into the light or look through the optical system. 2. Lead Forming • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the leadframe as a fulcrum during lead forming. • Lead forming should be done before soldering. • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. 3. Soldering Conditions • Solder the LEDs no closer than 3 mm from the base of the lead. • Recommended soldering conditions: Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position • • • Dip Soldering 120 °C Max. 60 Seconds Max. 260 °C Max. 5 Seconds Max. No lower than 3 mm from the base of the epoxy bulb DO NOT apply any stress to the lead particularly when heat. The LEDs must not be reposition after soldering. After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. 18.07.2011 5RAA5111P 2 of 3 • • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 5. Heat Generation • The powered LEDs generate heat. Heat dissipation should be considered in the application design to avoid the environmental conditions for operation in excess of the absolute maximum ratings. 18.07.2011 5RAA5111P 3 of 3