LED740-series TECHNICAL DATA Infrared LED, 5 mm package AlGaAs LED740-series are AlGaAs LEDs mounted on a lead frame and encapsulated in various types of epoxy lens, which offers different design settings. On forward bias, it emits a high power radiation of typical 18 mW at a peak wavelength at 740 nm. Specifications Structure: Peak Wavelength: Optical Output Power: Package: Resin Material: Lead Frame: • • • • • • AlGaAs 740 nm 18 mW Ø 5 mm clear molding clear epoxy resin soldered (Unit: mm) Absolute Maximum Ratings (TA=25°C) Item Power Dissipation Forward Current 1 Pulse Forward Current * Reverse Voltage Operating Temperature Storage Temperature 2 Soldering Temperature * Symbol PD IF IFP VR Topr Tstg Tsol Value 140 75 500 5 -30 … +85 -40 … +100 240 Unit mW mA mA V °C °C °C 1 * duty = 1%, pulse width = 1 µs 2 * must be completed within 3 seconds at 260°C Electro-Optical Characteristics Item Peak Wavelength Half Width 1 Total Radiated Power * Forward Voltage Reverse Current Rise Time Fall Time Symbol λP Δλ PO VF IR tr tf Condition IF = 50 mA IF = 50 mA IF = 50 mA IF = 50 mA VR = 5 V IF = 50 mA IF = 50 mA Min. 14 - Typ. 740 30 18 1.8 80 80 Max. 2.2 10 - Unit nm nm mW V µA ns ns Note: The above specifications are for reference purpose only and subjected to change without prior notice. 05.11.2012 LED740-series 1 of 7 Electro-Optical Characteristics Type LED740-01AU LED740-02AU LED740-03AU LED740-04AU LED740-05AU LED740-06AU LED740-09AU LED740-46AU LED740-41AU LED740-42AU LED740-31AU LED740-33AU LED740-34AU LED740-36AU Viewing Half Angle Radiant Intensity (IF = 50mA) [Unit: mW/sr] Min. ±10° ±7° ±10° ±20° ±40° ±7° ±25° (long) ±15° (short) Typ. 90 120 90 40 10 90 70 ±16° ±23° 70 55 ±18° 40 ±33° 20 Max. Outer Dimension Dimension Figure Ø5 Ø5 Ø5 Ø5 Ø5 Ø5 Ø5 Oval Ø5 Ø4 Ø4 Ø3 Ø3 Ø3 Ø3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 * Radiant Intensity measured by Photodyne #500 Note: The above specifications are for reference purpose only and subjected to change without prior notice. Electro-Optical Characteristics 05.11.2012 Figure-1 Ø5 Mold (Type 01) Figure-2 Ø5 Mold (Type 02) Figure-3 Ø5 Mold (Type 03) Figure-4 Ø5 Mold (Type 04) LED740-series 2 of 7 05.11.2012 Figure-5 Ø5 Mold (Type 05) Figure-6 Ø5 Mold (Type 06) Figure-7 Ø5 Mold (Type 09) Figure-8 Ø5 Mold (Type 46) Figure-9 Ø4 Mold (Type 41) Figure-10 Ø4 Mold (Type 42) Figure-11 Ø3 Mold (Type 31) Figure-12 Ø3 Mold (Type 33) Figure-13 Ø3 Mold (Type 34) Figure-12 Ø3 Mold (Type 36) LED740-series 3 of 7 Viewing Half Angle 05.11.2012 Figure-1 Ø5 Mold (Type 01) Figure-2 Ø5 Mold (Type 02) Figure-3 Ø5 Mold (Type 03) Figure-4 Ø5 Mold (Type 04) Figure-5 Ø5 Mold (Type 05) Figure-6 Ø5 Mold (Type 06) Figure-7 Ø5 Mold (Type 09) Figure-8 Ø5 Mold (Type 46) Figure-9 Ø4 Mold (Type 41) Figure-10 Ø4 Mold (Type 42) LED740-series 4 of 7 Figure-11 Ø3 Mold (Type 31) Figure-12 Ø3 Mold (Type 33) Figure-13 Ø3 Mold (Type 34) Figure-12 Ø3 Mold (Type 36) Typical Performance Curves Forward Current – Forward Voltage Relative Radiant Intensity – Pulse Forward Current Forward Current – Pulse Duration Forward Voltage – Ambient Temperature 05.11.2012 LED740-series 5 of 7 05.11.2012 Relative Radiant Intensity – Ambient Temperature Allowable Forward Current – Ambient Temperature Peak Wavelength Peak Wavelength – Ambient Temperature LED740-series 6 of 7 Precaution for Use 1. Cautions • DO NOT look directly into the emitting area of the LED or through the optical system during operation! To prevent in adequate exposure of the radiation, wear protective glasses. • This LED is emitting invisible light. 2. Lead Forming • Lead forming should be done before soldering. • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the lead frame as a fulcrum during lead forming! • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. Recommended Land Layout (Unit: mm) 3. Soldering Conditions • Solder the LEDs no closer than 3 mm from the base of the lead. • DO NOT apply any stress to the lead particularly when heat. • After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. • The LEDs must not be reposition after soldering. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. • Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. Soldering Conditions 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an antielectrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 05.11.2012 LED740-series 7 of 7