PACKAGE INFORMATION • PE-QFN0404-20-080623 QFN0404-20 Unit: mm PACKAGE DIMENSIONS 4.00 2.2Typ. B 15 16 6 20 2.2Typ. 10 0.50 4.00 11 0.50±0.10 A INDEX 5 1 0.50±0.10 0.23±0.05 0.08 S S 0.10 S AB Bottom View 0.85Max. 0.2Typ. 0.50 ) Tab in the parts have VDD or GND level. (They are connected to the back side of the IC.) Do not connect to other wires or land patterns. 12.0±0.3 4.35±0.05 2.0±0.05 5.5±0.05 4.0±0.1 1.5 +0.1 0 0.3±0.05 1.75±0.1 TAPING SPECIFICATION 1.0±0.1 4.35±0.05 1.3±0.05 8.0±0.1 E2 TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-12Cc) 19.5Max. (1reel=2,000pcs) ∅13±0.2 ∅ 254±2 21±0.8 ∅ 100 +2.0 0 13.5±0.2 2±0.5 A reel for QFN0404-20 User Direction of Feed PACKAGE INFORMATION PE-QFN0404-20-080623 POWER DISSIPATION (QFN0404-20) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Land Pattern A Land Pattern B Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (4 layers) Board Dimensions 35mm × 90mm × 0.8mm 40mm × 40mm × 0.8mm Copper Ratio Each layer: 15% 1st:50%, 2nd:15%, 3rd:15%, 4th:50% φ0.3mm×16pcs, Through-hole φ0.5mm×20pcs φ0.3mm×16pcs, Measurement Result φ0.5mm×20pcs (Topt=25°C, Tjmax=125°C) Land Pattern B Power Dissipation 1800mW 1900mW Thermal Resistance θja=(125−25°C)/1.8W=55.6°C/W θja=(125−25°C)/1.9W=52.6°C/W 2000 1900 1800 40 On Board : B 1600 1400 40 Power Dissipation PD (mW) Land Pattern A 1200 On Board : A 1000 800 600 0 25 50 75 85 100 125 Ambient Temperature (°C) 150 Measurement Board Pattem B Power Dissipation 4.4 0.23 2.0 0.5 RECOMMENDED LAND PATTERN 0.7 2.0 4.4 (Unit: mm) (Unit: mm)